All items tagged with SoC (132)

u-blox Acquires Rigado’s Bluetooth Modules Business

August 2, 2019 by audioXpress Staff

u-blox Acquires Rigado’s Bluetooth Modules Business

Swiss company u‑blox, a global provider of positioning and wireless communication technologies, announced it acquired Rigado’s Bluetooth modules business in an Asset Purchase Agreement. Rigado is an Oregon-based provider of Edge‑as‑a-Service gateway solutions for Commercial IoT applications, and began offering certified wireless modules in 2015, implementing Nordic Semiconductor’s nRF52840 Bluetooth Low Energy (Bluetooth LE) SoC.

Audinate Announces Dante Reference Design for Popular NXP i.MX 8M Mini ARM-based Applications Processor

July 23, 2019 by audioXpress Staff

Audinate Announces Dante Reference Design for Popular NXP i.MX 8M Mini ARM-based Applications Processor

Audinate and NXP Semiconductors have collaborated to introduce a new reference design kit for the popular NXP i.MX 8M Mini QuadLite SoC – providing Dante audio-over-IP to OEMs as on-chip software. Following the announced shift from purpose-built hardware to software-based solutions running on standardized hardware, and a similar agreement to supply software running on Linux for x86 and ARM processors, Audinate now extends the support to NXP’s i.MX 8M processors.

StreamUnlimited Announces StreamSDK availability on MediaTek MT8516 SOC

April 19, 2019 by audioXpress Staff

StreamUnlimited Announces StreamSDK availability on MediaTek MT8516 SOC

StreamSDK, acknowledged in the audio industry for its feature-rich wireless audio streaming software stack, is now available on the MT8516 chipset from MediaTek. StreamUnlimited developed StreamSDK to be flexible enough to run on multiple hardware configurations, allowing manufacturers to remain with their chosen SoC supplier or to select the best hardware module for the product feature set, price point and target market. StreamUnlimited also confirmed AirPlay 2 is now available in StreamSDK, and hardware platforms across major SOC suppliers.

Qualcomm Launches AI-Enabled Highly Integrated SoCs and Dedicated Smart Speaker Platform

March 19, 2019 by audioXpress Staff

Qualcomm Launches AI-Enabled Highly Integrated SoCs and Dedicated Smart Speaker Platform

Qualcomm made two important announcements for audio developers, both bound to significantly impact the fast-growing market of smart speakers and new generation whole-home audio systems. The San Diego company announced the new QCS400 family of audio SoCs and the Smart Audio Platform 400 development kit, bringing smart speakers high-performance processing, Qualcomm AI Engine, superior connectivity, and multiple advanced audio and visual display capabilities in a single, power-optimized chip architecture.

Cadence Announces Industry’s First Verification IP for USB4

March 15, 2019 by audioXpress Staff

Cadence Announces Industry’s First Verification IP for USB4

Cadence Design Systems announced the availability of the industry’s first Verification IP (VIP) in support of the recently announced USB4 standard. The Cadence VIP for USB4 enables engineers to develop standard-compliant system-on-chip (SoC) designs, completing functional verification of the design with less effort and greater assurance that the SoC will operate as expected, enabling early adoption of the next-generation USB standard protocol.

Dialog Semiconductor Provides Audio and Configurable Mixed Signal Chipset for Huawei Honor FlyPods

March 12, 2019 by audioXpress Staff

Dialog Semiconductor Provides Audio and Configurable Mixed Signal Chipset for Huawei Honor FlyPods

Dialog Semiconductor announced that its audio and Configurable Mixed Signal ICs (CMICs) have been adopted by Huawei for their Honor FlyPods, the company’s latest True Wireless Stereo (TWS) earbuds. Five Dialog ICs provide voice control and power to Huawei’s recently announced TWS earbuds. A Dialog’s SmartBeat DA14195 System-on-Chip (SoC) is integrated into each FlyPod earbud and is connected to a pair of Voice Pick Up (VPU) sensors.

Qualcomm Ultra Low-Power Bluetooth Audio SoCs Now Powering Compact, Feature-Rich Wireless Earbuds, Headsets and Speakers

February 27, 2019 by audioXpress Staff

Qualcomm Ultra Low-Power Bluetooth Audio SoCs Now Powering Compact, Feature-Rich Wireless Earbuds, Headsets and Speakers

Qualcomm Technologies International, a subsidiary of Qualcomm Incorporated, showcased at MWC 2019 in Barcelona the most recent wireless earbuds and hearables using the latest Qualcomm QCC5100 and QCC302x series, ultra-low power Bluetooth audio SoCs. Now available in more than 10 products, Qualcomm is finding increased traction from audio, mobile and consumer electronics manufacturers for these SoCs, allowing for a robust, low-latency and high-quality wireless audio experiences, in compact, feature-rich wireless earbuds, headsets and speakers.

DSP Group and Snips Announce Technology Partnership on Multi-Room Embedded Voice Recognition Architecture

February 26, 2019 by audioXpress Staff

DSP Group and Snips Announce Technology Partnership on Multi-Room Embedded Voice Recognition Architecture

DSP Group and Snips, the European pioneer in embedded voice recognition software, announced a technology partnership which combines Snips’ voice software with DSP Group’s Ultra Low Energy (ULE) system-on-chip (SoC) and modules. According to the announcement, this combination of software and hardware running over the ULE network extends the reach of natural voice-controlled edge devices and could become a natural choice for multi-room smart home and smart building applications.

Xperi Corporation to Showcase Latest DTS Audio Technologies at MWC 2019

February 25, 2019 by audioXpress Staff

Xperi Corporation to Showcase Latest DTS Audio Technologies at MWC 2019

Xperi Corporation will showcase its latest mobile imaging, audio and semiconductor solutions from its brands, FotoNation, DTS and Invensas at MWC 2019 (February 25-28), in Barcelona. Xperi will showcase DTS audio solutions specifically targeted at the gaming market, including DTS Headphone:X 2.0 (for Gaming Headphones); DTS:X Ultra (for Windows and Android); DTS:X Game Audio; and DTS:X Premium.

NXP Brings Dolby Atmos and DTS:X to the Masses with its New Immersiv3D Audio Solution

February 18, 2019 by audioXpress Staff

NXP Brings Dolby Atmos and DTS:X to the Masses with its New Immersiv3D Audio Solution

Following a showcase at CES 2019, NXP Semiconductors announced its Immersiv3D audio solution, combining NXP software on its i.MX 8M Mini applications processor with support both Dolby Atmos and DTS:X immersive audio technologies. The i.MX 8M Mini SoC also brings smart capabilities like voice control to a broader range of consumer devices including soundbars, smart speakers, and AV receivers with the option for adding additional speakers to distribute smart voice control and immersive audio throughout the home.

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