All items tagged with SoC (132)
New Qualcomm QCC3026 Bluetooth Audio System-on-Chip Now Available
June 29, 2018 by audioXpress Staff

New Qualcomm QCC3026 Bluetooth Audio System-on-Chip Now Available

Qualcomm announced the QCC3026, a flash-programmable Bluetooth Audio System-on-Chip (SoC) that is designed to reduce power consumption by up to 50% compared to previous generation entry-level flash devices. The new SoC is also engineered to help manufacturers simply and quickly develop and commercialize feature optimized truly wireless headsets, and extends the Company’s portfolio of low power Bluetooth audio solutions following the announcement of the flagship QCC5100 Bluetooth SoC series earlier this year.
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Dialog Semiconductor’s SmartBeat SoC Enhances Jabra Engage Headset Series
May 3, 2018 by audioXpress Staff

Dialog Semiconductor’s SmartBeat SoC Enhances Jabra Engage Headset Series

Jabra turned to Dialog Semiconductor’s SmartBeat audio system-on-chip (SoC) for its newest range of Jabra Engage professional wireless headsets. As the first company to deploy Dialog’s SmartBeat DA14495 SoC, Jabra was able to make use of the SoC’s support for the DECT 1.9GHz standard, as well as a flexible audio API, to connect three times as many users as before with industry-leading call performance at a range of up to 490 feet.
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Synaptics Announces Design Wins at Multiple OEMs with Second-Generation USB Type-C Headset SoCs
April 27, 2018 by audioXpress Staff

Synaptics Announces Design Wins at Multiple OEMs with Second-Generation USB Type-C Headset SoCs

Synaptics announced its second-generation AudioSmart digital headset SoC solution for USB Type-C headphones is now shipping in mass production with a major OEM and designed-in with multiple other smartphone makers. Leading the trend of eliminating the legacy analog 3.5mm headphone jack is Huawei, who selected Synaptics’ latest CX2198x family for its flagship P20 and P20 Pro smartphones.
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STMicroelectronics Introduces Next-Generation Wireless Platform for Higher-Performing Bluetooth Devices
February 23, 2018 by Joao Martins

STMicroelectronics Introduces Next-Generation Wireless Platform for Higher-Performing Bluetooth Devices

Powering the next generation of smart connected objects like digital-home products and wearable electronics, STMicroelectronics has revealed an advanced dual-processor wireless chip that supports new features and enhanced performance with extended battery life. The fusion of 32-bit ultra-low-power microcontroller and highly integrated Bluetooth 5 (BLE) and IEEE 802.15.4 radio creates a high-performing wireless platform for feature-rich smart connected objects.
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Qualcomm Introduces New Low Power Bluetooth Audio SoC Series for Wireless Earbuds and Hearables
January 9, 2018 by audioXpress Staff

Qualcomm Introduces New Low Power Bluetooth Audio SoC Series for Wireless Earbuds and Hearables

At CES 2018, Qualcomm introduced the new Qualcomm Low Power Bluetooth SoC QCC5100 series that is designed to help manufacturers develop a new generation of compact, feature-rich, wireless earbuds, hearables and headsets. The new low power, feature-rich Bluetooth solution includes support for voice assistant services, Qualcomm TrueWireless Stereo, Qualcomm aptX HD audio and integrated hybrid ANC.
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Avnet and Aaware Introduce New Sound Capture Platform to Enable Advanced Voice Interface Applications
January 5, 2018 by audioXpress Staff

Avnet and Aaware Introduce New Sound Capture Platform to Enable Advanced Voice Interface Applications

Global Distribution Platform Avnet and Aaware, an emerging global supplier of sound capture technology for far-field, voice-enabled products, introduced Aaware’s Sound Capture Platform, designed to provide product development teams with higher performance, scale and flexibility. The solution leverages Avnet’s MiniZed Zynq SoC development platform to improve sound capture performance for smart home, industrial and robotics applications.
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Nordic Semiconductor-Powered Bluetooth Low Energy Remote Module Provides High Quality Audio Streaming Solution for OEMs
September 7, 2017 by audioXpress Staff

Nordic Semiconductor-Powered Bluetooth Low Energy Remote Module Provides High Quality Audio Streaming Solution for OEMs

Nordic Semiconductor announced that Shanghai, China-based RFsen has selected Nordic’s Bluetooth 5-compatible low energy nRF52832 System-on-Chip (SoC) for its ‘BT5 Bi-Direction Audio Remote Module’. The module allows OEM manufacturers to provide bi-directional wireless audio streaming between, for example, a smart TV, set-top box, sound box or sound bar, and a user’s Bluetooth 4.0 (and later) Android smartphone or tablet.
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Libre Wireless Technologies Introduces Mic-to-Cloud Voice Module with Integrated Far Field Voice Interface/Control Based on DSP Group’s SmartVoice Technology
September 6, 2017 by audioXpress Staff

Libre Wireless Technologies Introduces Mic-to-Cloud Voice Module with Integrated Far Field Voice Interface/Control Based on DSP Group’s SmartVoice Technology

Libre Wireless Technologies announced the launch of their new LS5BV LibreSync module featuring fully integrated and optimized far field voice interface capabilities as well as extensive music streaming and multiroom audio features. This small and low power mic-to-cloud module uses DSP Group’s SmartVoice technology and HDClear SoC with sophisticated algorithms for detecting and processing far field voice, including advanced noise reduction, echo cancellation, music barge-in and audio processing features.
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Qualcomm Releases Next-Generation DDFA Audio Amplifier Technology
June 21, 2017 by audioXpress Staff

Qualcomm Releases Next-Generation DDFA Audio Amplifier Technology

Qualcomm Technologies International made exciting audio announcements in platforms and technologies for the development of next-generation audio products during its voice and music developer conference, held recently in Shenzhen, China. At the event, the company announced its new Smart Audio Platform for smart and networked speakers. Additionally, Qualcomm introduced its next generation Qualcomm DDFA audio amplifier technology for high-resolution audio devices including wireless speakers, soundbars, networked audio and headphone amplifiers.
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Qualcomm Announces Multiple New Audio Platforms to Support New Use Cases for Next Generation of Wireless Speakers, Headphones and Hearables
June 21, 2017 by audioXpress Staff

Qualcomm Announces Multiple New Audio Platforms to Support New Use Cases for Next Generation of Wireless Speakers, Headphones and Hearables

During its voice and music developer conference held recently in Shenzhen, China, Qualcomm made two exciting audio announcements. The company announced its new Smart Audio Platform to help manufacturers accelerate the development and commercialization of smart and networked speakers. Qualcomm also announced multiple new audio platforms for next-gen wireless speakers, headphones and hearables, each one uniquely tailored to support new market demands, particularly as consumers rapidly adopt wireless audio devices.
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