All items tagged with SoC (130)
Synaptics Announces AudioSmart AS33970 Edge AI Headset Platform
October 18, 2021 by audioXpress Staff

Synaptics Announces AudioSmart AS33970 Edge AI Headset Platform

Synaptics announced its newest AudioSmart AS33970 headset platform SoC, directly targeting the fastest growing product categories, from work-from-anywhere TWS earbuds to hearables. As the San Jose, California-based company details, the new SoC offers the world’s first highly integrated AI-enabled ENC (Environmental Noise Cancellation) and hybrid ANC (Active Noise Cancellation) single-chip solution integrating neural and voice processing engines for optimal audio performance.
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CEVA, Beken and VisiSonics Announce Reference Design for 3D Spatial Audio in Headsets and TWS Earbuds
September 30, 2021 by audioXpress Staff

CEVA, Beken and VisiSonics Announce Reference Design for 3D Spatial Audio in Headsets and TWS Earbuds

CEVA, together with Beken Corporation, a key player in wireless communication solutions, and VisiSonics, the 3D spatial audio technologies specialists, announced the availability of a complete 3D audio reference design for the rapid deployment of headsets and True Wireless Stereo (TWS) earbuds supporting spatial audio for use in gaming, multimedia and conferencing. The integration delivers a complete 3D spatial audio hardware and software solution to consumer electronics OEMs and ODMs.
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Novatek Announces Turnkey SoC Solution With Support for DTS Play-Fi
September 29, 2021 by audioXpress Staff

Novatek Announces Turnkey SoC Solution With Support for DTS Play-Fi

DTS, now a wholly owned subsidiary of Xperi Holding Corporation, announced that Novatek Microelectronics, a major chip supplier for TVs, will be supporting DTS Play-Fi on its line of SoCs targeting the TV market. This turnkey solution from Novatek will enable manufacturers to build TVs that seamlessly connect to other DTS Play-Fi compatible products, including speakers and amplifiers.
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Laird Connectivity Launches BL5340 Bluetooth 5.2 Modules for High Performance LE Audio Applications
September 6, 2021 by audioXpress Staff

Laird Connectivity Launches BL5340 Bluetooth 5.2 Modules for High Performance LE Audio Applications

The new BL5340 Series of Bluetooth 5.2 and 802.15.4 modules from Laird Connectivity are now available. Based on Nordic Semiconductor’s nRF5340 system-on-chip (SoC), the BL5340 Series delivers a secure, high-performance dual-core MCU wireless solution with a choice of modules - BL5340 with nRF5340, or a power amplified variant (BL5340PA with nRF5340 + nRF21540), with integrated pre-certified PCB or Trace pad antenna options, and multiple tools for advanced Bluetooth LE product development.
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World’s Smallest UWB and BLE Low-Power Module for Connected Devices
September 3, 2021 by Cristina Costa

World’s Smallest UWB and BLE Low-Power Module for Connected Devices

Murata has launched the world’s smallest ultra-wideband (UWB) module – measuring just 10.5 mm × 8.3 mm × 1.44 mm – that combines elevated levels of accuracy and reliability with low-power to ensure compact and battery-driven connected devices operate as efficiently and cost-effectively as possible. Using short-range radio frequency (RF) technology, the Type 2AB UWB + Bluetooth low-energy (BLE) connectivity module can be used in a wide variety of applications where precise detection is essential.
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Knowles Offers AI-Enabled True Wireless Development Kit with Advanced Features
August 5, 2021 by audioXpress Staff

Knowles Offers AI-Enabled True Wireless Development Kit with Advanced Features

Knowles announced the availability of a new AI-enabled True Wireless Stereo (TWS) Development Platform that will certainly be welcomed by developers and manufacturers globally, looking to accelerate the product development process, from entry-level to premium applications. The new TWS development kit shortens the design cycle for OEMs, enabling advanced, differentiated products with contributed technology from Alango Technologies and Chatable, among others.
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Qualcomm Snapdragon Sound: Questions, Development, Audio Momentum and the Market
July 2, 2021 by Joao Martins

Qualcomm Snapdragon Sound: Questions, Development, Audio Momentum and the Market

In early March 2021, following a series of announcements in development platforms and solutions for wireless audio, Qualcomm announced Qualcomm Snapdragon Sound, a new end-to-end approach to promote high-resolution digital audio and enhanced voice communications across devices. The systems' approach combines and optimizes multiple Qualcomm technologies for mobile platforms, processing, connectivity, plus the latest aptX Adaptive audio technologies needed to improve the sound experience for consumers. But how can manufacturers and new brands benefit? Will there be a lossless extension for aptX Adaptive? We asked the questions to Jonny McClintock, Director of aptX Sales & Marketing at Qualcomm.
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Skullcandy Confirms Partnership with Bragi for Software Upgradable True Wireless Earbuds
June 29, 2021 by Joao Martins

Skullcandy Confirms Partnership with Bragi for Software Upgradable True Wireless Earbuds

Skullcandy, the headphone company from Park City, Utah, announced a partnership with Bragi, the inventor and largest intellectual property owner of true wireless headphones, now licensing its software to brands and manufacturers worldwide. The partnership enables Skullcandy to create truly smart, future-proof audio products, infused with easy-to-use, transformative technology incorporating Bragi’s software platform featuring embedded AI.
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Jacoti Announces OTC Ready Technologies for Over-the-Counter Hearing Aid Development Using Qualcomm 51XX SoCs
June 2, 2021 by audioXpress Staff

Jacoti Announces OTC Ready Technologies for Over-the-Counter Hearing Aid Development Using Qualcomm 51XX SoCs

Following the announcement of collaboration with Qualcomm, in October 2020, Jacoti BV, the Belgium-based medical technology company, now announced the immediate licensing availability of OTC Ready, Jacoti’s hearing software platform. OTC Ready enables headphone/earbud manufacturers using Qualcomm 51XX SoCs to address the likely requirements of the upcoming US over-the-counter hearing aid market.
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Toshiba Announces Smallest Bluetooth LE Module for Wearables Using Nordic’s nRF52811 SoC
May 18, 2021 by audioXpress Staff

Toshiba Announces Smallest Bluetooth LE Module for Wearables Using Nordic’s nRF52811 SoC

Nordic Semiconductor announced that Tokyo, Japan-based multinational conglomerate, Toshiba Corporation, has selected the 2.48 by 2.46mm wafer level chip scale package (WLCSP) version of Nordic’s nRF52811 Bluetooth Low Energy (Bluetooth LE) System-on-Chip (SoC) to provide the core processing power and wireless connectivity for its ‘Bluetooth module with SASP Technology’.
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