All items tagged with SoC (130)

Silicon Labs Announces New Bluetooth SoC and MCU Ideal for Small Form-Factor Devices

March 16, 2023 by audioXpress Staff

Silicon Labs Announces New Bluetooth SoC and MCU Ideal for Small Form-Factor Devices

Silicon Labs continues to expand its range of wireless solutions for connected devices, and during Embedded World 2023 in Germany, the company introduced two new integrated circuit families designed for the smallest form factor IoT devices: the xG27 family of Bluetooth systems on chips (SoCs) and the BB50 microcontroller unit (MCU).

EM Microelectronic Licenses Packetcraft Host and Controller Software with Support for Bluetooth 5.4 PAwR, LE Audio and Auracast

March 13, 2023 by audioXpress Staff

EM Microelectronic Licenses Packetcraft Host and Controller Software with Support for Bluetooth 5.4 PAwR, LE Audio and Auracast

At Embedded World 2023, Packetcraft announced their latest Bluetooth 5.4 host and controller software is enabling EM Microelectronic’s flagship em | bleu (EM9305). The em | bleu single chip is a small form factor and ultra-low energy consuming Bluetooth LE SoC or companion IC solution supporting the very latest Bluetooth technology including PAwR, LE Audio and Auracast broadcast audio.

Realtek Semiconductor and Alango Technologies Partner to Offer Joint Solution for Hearables

March 13, 2023 by Joao Martins

Realtek Semiconductor and Alango Technologies Partner to Offer Joint Solution for Hearables

Realtek Semiconductor (Taiwan) and Alango Technologies (Israel) have announced a collaboration to provide a joint solution that delivers the Alango PersonaSound suite of software technologies, ported and optimized for the latest Realtek Bluetooth SoCs. This collaboration aims to address the global problem of hearing loss, which affects 1.5 billion people worldwide.

OPPO Unveils 12Mbps Data Rate Bluetooth Wireless Audio SoC at MWC 2023

March 2, 2023 by Joao Martins

OPPO Unveils 12Mbps Data Rate Bluetooth Wireless Audio SoC at MWC 2023

On the opening day of Mobile World Congress (MWC) 2023 in Barcelona, OPPO announced a selection of flagship devices, new core connectivity products and technologies, as well as its latest R&D breakthroughs in chip technology. On the audio domain, OPPO promised to revolutionize the industry and leave Bluetooth limitations behind with its MariSilicon Y flagship audio SoC. A world first for Bluetooth wireless audio, the new SoC promises a 12Mbps data rate.

Wireless Audio and Bluetooth LE Audio - Assistance, Hearables, and Headphones 3.0

February 16, 2023 by Joao Martins

Wireless Audio and Bluetooth LE Audio - Assistance, Hearables, and Headphones 3.0

What happened at CES 2023 related to wireless audio and Bluetooth LE Audio. And what might happen at MWC 2023. And why there's lots more happening in assistance, hearables, and Headphones 3.0. This article discusses Bluetooth LE Audio and Android 13. Bluetooth 5.4 updates. Sennheiser's MobileConnect Assistive Listening app that actually works over Wi-Fi. Sonical, Antennaware, et all, Headphone 3.0. UWB, and high-quality wireless audio. Originally published in The Audio Voice 410, February 16 2023.

February 6, 2023 by Joao Martins

WiSA Technologies Begins Shipping WiSA E Multichannel Audio Development Kits to Initial Beta Customers

WiSA Technologies, a leading provider of wireless audio technologies for home theater already adopted by Bang & Olufsen, Harman, Klipsch, Savant, LG Electronics and many others, announced its first shipments of WiSA E development kits to leading audio brands developing multichannel audio systems. Using the 5GHz portion of the Wi-Fi band, WiSA E offers high-performance, high-quality wireless audio transmission and reception at an affordable price.

Dirac-Enabled BES Chipsets Now Available To Global Headphone Manufacturers

January 19, 2023 by audioXpress Staff

Dirac-Enabled BES Chipsets Now Available To Global Headphone Manufacturers

Swedish digital audio processing pioneer Dirac and leading multinational chipset maker BES announced a partnership to pre-integrate the Dirac Virtuo and Dirac Opteo software onto BES chipsets to be used by leading headphone manufacturers to deliver optimized performance in any headphone type. The announcement was made at CES 2023, where it was confirmed that boAt, Monoprice, and Sudio are the first headphone brands to leverage these Dirac-enabled BES chipsets in their devices.

Nordic Semiconductor Selects Packetcraft Controller Software Delivering Advanced Bluetooth LE Audio Capability

January 3, 2023 by Joao Martins

Nordic Semiconductor Selects Packetcraft Controller Software Delivering Advanced Bluetooth LE Audio Capability

Packetcraft, a leading provider of Bluetooth embedded stacks and software solutions, announced their Bluetooth Qualified LE Controller is shipping with Nordic Semiconductor’s flagship nRF5340 dual-core Bluetooth 5.3 SoC enabling LE Audio in commercial products. At CES 2023, Packetcraft is already showcasing Bluetooth LE Audio and Auracast broadcast audio applications using Nordic’s nRF5340 SoC, including from Sonical, EMSi and Fanstel.

Synaptics Launches KatanaConnect Miniature Wireless AI Vision and Audio Module

November 25, 2022 by audioXpress Staff

Synaptics Launches KatanaConnect Miniature Wireless AI Vision and Audio Module

Synaptics launched an interesting new AI System on Module (SoM) at electronica 2022. KatanaConnect combines the Katana low-power Edge AI SoC with Wi-Fi / Bluetooth wireless connectivity in an ultra-small-form-factor package to deliver AI-enabled computer vision and audio sensing capabilities. The SoM, developed with leading module vendor AMPAK, is a ready-to-use solution that enables rapid implementation of AI sensing features for connected designs targeting a range of applications, including smart home and security, and many others.

MediaTek Launches Flagship Dimensity 9200 Smartphone Chipset with Support for Bluetooth LE Audio

November 9, 2022 by audioXpress Staff

MediaTek Launches Flagship Dimensity 9200 Smartphone Chipset with Support for Bluetooth LE Audio

MediaTek launched the Dimensity 9200, its latest 5G chipset powering the next era of flagship smartphones. Boasting extreme performance and intelligent power efficiency, the new SoC brings immersive all-day gaming experiences, ultra-sharp image capturing and support for both mmWave 5G and sub-6GHz connectivity to consumers around the globe. Most importantly for the audio industry, this new solution will bring Bluetooth LE Audio support to many smartphones in 2023.

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