All items tagged with SoC (132)

Qualcomm and Amazon Deepen Strategic Engagement with the Pre-Integration of Alexa Custom Assistant with Snapdragon Automotive Cockpit Platform

January 27, 2021 by Joao Martins

Qualcomm and Amazon Deepen Strategic Engagement with the Pre-Integration of Alexa Custom Assistant with Snapdragon Automotive Cockpit Platform

Qualcomm Technologies and Amazon announced new joint efforts to pre-integrate the Alexa Custom Assistant with the Qualcomm Snapdragon Automotive Cockpit Platforms - the new-generation of automotive-optimized SoCs from Qualcomm. This new system is designed to support automotive OEMs and Tier-1 suppliers to build customizable, in-vehicle intelligent assistants and is offered as an extension module to the Alexa Automotive Software Development Kit (SDK).

DSP Group Unveils DBM10 Low-Power Edge AI/ML SoC with Dedicated Neural Network Inference Processor

January 7, 2021 by audioXpress Staff

DSP Group Unveils DBM10 Low-Power Edge AI/ML SoC with Dedicated Neural Network Inference Processor

DSP Group announced the DBM10, a new low-power, cost-effective artificial intelligence (AI) and machine learning (ML) system-on-chip (SoC). This new open platform, with a cost- and power-optimized architecture, enables rapid development of AI and ML applications for mobile, wearables, hearables, and connected devices in general. It provides a complete platform in terms of voice and audio processing, without compromising the battery life of new designs, and allowing developers to implement their own differentiating algorithms.

Nordic Semiconductor nRF5340 for Bluetooth 5.2 and LE Audio Applications Now Available

December 4, 2020 by audioXpress Staff

Nordic Semiconductor nRF5340 for Bluetooth 5.2 and LE Audio Applications Now Available

Nordic Semiconductor has announced that its nRF5340 high-end multiprotocol Bluetooth 5.2 System-on-Chip (SoC) has entered volume production. The world’s first dual Arm Cortex-M33 wireless SoC is now available and offers all the advanced features and security required for the next-generation of connected audio applications including LE Audio and advanced wearables. The new SoC is now widely commercially available through Nordic’s distribution network.

ams Helps Differentiate New PaMu Quiet True Wireless Earbuds with Best-In-Class ANC and Augmented Hearing

November 4, 2020 by Joao Martins

ams Helps Differentiate New PaMu Quiet True Wireless Earbuds with Best-In-Class ANC and Augmented Hearing

Austrian high performance sensor manufacturer ams announced it provided an optimized digital Active Noise Cancellation (ANC) solution as a differentiating component to Padmate’s PaMu Quiet earbuds. The new cutting-edge TWS earbuds from the Chinese brand feature the latest ams AS3460 Digital Augmented Hearing combined with a Qualcomm Bluetooth SoC to deliver advanced ANC in a competitively priced, comfortable design with a design similar to the AirPods Pro.

Dirac Introduces Spatial Audio Solution for Direct Chipset Integration Into Next-Generation Wireless Headphones

September 30, 2020 by audioXpress Staff

Dirac Introduces Spatial Audio Solution for Direct Chipset Integration Into Next-Generation Wireless Headphones

Swedish digital audio pioneer Dirac announced that its latest spatial audio solution, which leverages the company's patented Dynamic HRTF technology, is now available for direct integration into the digital signal processors (DSP) of Bluetooth wireless headphones. The solution is now compatible with chipsets from Qualcomm, BES, and MediaTek and allows headphone manufacturers to deliver spatial audio to consumers, independent of playback devices or media players.

Microchip Launches Industry’s First SoC FPGA Development Kit Based on the RISC-V Instruction Set Architecture

September 18, 2020 by audioXpress Staff

Microchip Launches Industry’s First SoC FPGA Development Kit Based on the RISC-V Instruction Set Architecture

The rising adoption of the free and open RISC-V Instruction Set Architecture (ISA) is driving the need for an affordable, standardized development platform that embeds RISC-V technology and leverages the diverse RISC-V ecosystem. To meet this need, Microchip Technology is offering the industry’s first RISC-V based System-on-Chip (SoC) Field-Programmable Gate Array (FPGA) development kit for its own low-power, low-cost, PolarFire SoC FPGA.

Apollo4 SoC Family from Ambiq Redefines Ultra-low Power in Wearables, Connected Devices and Always-on Voice-Processing

September 14, 2020 by audioXpress Staff

Apollo4 SoC Family from Ambiq Redefines Ultra-low Power in Wearables, Connected Devices and Always-on Voice-Processing

Ambiq unveiled its latest Apollo4 SoC family, enabling next generation endpoint devices with record-setting energy efficiency - running as low as 3µA/MHz - and new levels of performance. The new Apollo4 systems enable manufacturers to create leading-edge endpoint devices leveraging the unique SPOT platform with Ambiq’s easy-to-use, rich peripheral set. The Apollo4 is available now with CSP and BGA package offerings, as well as an Apollo4 Blue SoC with Bluetooth LE.

Actively Smart True Wireless Earbuds: How to Augment Your Hearing

September 3, 2020 by Joao Martins

Actively Smart True Wireless Earbuds: How to Augment Your Hearing

IFA 2020, in Berlin, Germany, was "the first major global fair for consumer and home electronics" to physically take place since the pandemic. This limited push to promote a trade show again, lead some major consumer electronics companies and brands to converge their announcements in the week from September 1-5, with showcases streamed to the world live from the Berlin exhibition grounds. Some announcements were relevant to the audio industry and included the Qualcomm press conference, which used the opportunity to launch its latest Adaptive ANC platform, an important step towards smart true wireless earbuds.

Intel Announces Thunderbolt 4 Specification: Technology Changes Fast, Reality Moves Slower

July 16, 2020 by Joao Martins

Intel Announces Thunderbolt 4 Specification: Technology Changes Fast, Reality Moves Slower

Intel revealed new details about Thunderbolt 4, the next generation of its universal cable connectivity solution. delivering increased minimum performance requirements, expanded capabilities, and USB4 specification compliance. This means that even though USB4 remains the good-enough universal solution for all consumer devices, Intel intends to ensure Thunderbolt will remain on its own path to offer the most powerful and reliable alternative for power users - professional users, corporate and media applications. And that enables Intel to sell hardware, while keeping control of at least the certification processes.

Nordic Unveils New Bluetooth 5.2 SoC Optimized for Compact, Two-Layer PCB Wireless Products

June 19, 2020 by audioXpress Staff

Nordic Unveils New Bluetooth 5.2 SoC Optimized for Compact, Two-Layer PCB Wireless Products

Nordic Semiconductor announced the nRF52805 Bluetooth 5.2 System-on-Chip (SoC), the seventh addition to its popular and proven nRF52 Series. The new nRF52805 SoC offers Bluetooth LE high-throughput 2 Mbps and enhanced Channel Selection Algorithm #2 for improved coexistence, and 2.4 GHz proprietary protocols for cost-constrained applications. This SoC is an ideal Bluetooth LE solution for high-volume, compact wireless applications.

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