All items tagged with SoC (130)

Goodix Licenses and Deploys CEVA Bluetooth Low Energy IP in SoCs Targeting Connected Devices

February 24, 2020 by Joao Martins

Goodix Licenses and Deploys CEVA Bluetooth Low Energy IP in SoCs Targeting Connected Devices

CEVA announced that Goodix Technology has licensed and deployed CEVA’s RivieraWaves Bluetooth low energy IP in its GR551x series of Bluetooth low energy System-on-Chip (SoCs). The GR551x series is designed to help users develop low-power Bluetooth-based products including smart mobile devices, wearables, and connected applications. Goodix just acquired NXP’s Voice and Audio Solutions (VAS) business.

Nordic Semiconductor Launches Bluetooth LE Audio Evaluation Platform

January 8, 2020 by audioXpress Staff

Nordic Semiconductor Launches Bluetooth LE Audio Evaluation Platform

Nordic Semiconductor announced it has launched an LE Audio Evaluation Platform in partnership with San Diego, CA-based Bluetooth Low Energy (Bluetooth LE) stack developer, Packetcraft. The LE Audio solution demonstrates the benefits of High-Quality Wireless LE Audio and is designed to support the new LE Audio specifications that are expected to be released by the Bluetooth Special Interest Group (SIG) during the first half of 2020.

Jabra Unveils Improved Elite Active 75t True Wireless Earbuds Made-for-Active Lifestyles

January 7, 2020 by audioXpress Staff

Jabra Unveils Improved Elite Active 75t True Wireless Earbuds Made-for-Active Lifestyles

At CES 2020, Jabra unveiled the Elite Active 75t true wireless earbuds, the active lifestyle edition of the recently announced Elite 75t true wireless earbuds. Taking advantage of the ultra-low-power Qualcomm QCC5126 Bluetooth audio SoC from Qualcomm Technologies, the Jabra Elite Active 75t is 22 percent smaller and boasts an 89 percent increase in battery life from its predecessor, the Elite Active 65t. The earbuds are built with a durable coating for dust and sweat resistance and are IP57 rated, making them waterproof.

ON Semiconductor to Demonstrate Advanced Audio Processing at CES 2020

December 18, 2019 by Cristina Costa

ON Semiconductor to Demonstrate Advanced Audio Processing at CES 2020

ON Semiconductor will showcase a wide range of innovative technologies for smart home, connected buildings and personal connected devices at CES 2020. Powering portable voice-controlled applications will be the latest LC823455 ultra-low-power audio processor, supporting high-resolution audio processing. This highly integrated SoC, featuring an Arm Cortex−M3 Dual Core CPU and proprietary 32−bit DSP Core (LPDSP32) wit support for high−resolution 32−bit/192kHz audio.

Sonion Combines Voice Pick Up Bone Sensor With Qualcomm Bluetooth SoC to Improve Speech Intelligibility

October 21, 2019 by audioXpress Staff

Sonion Combines Voice Pick Up Bone Sensor With Qualcomm Bluetooth SoC to Improve Speech Intelligibility

Sonion, the manufacturer of components and solutions for hearing aids and in-ear headphones, announced that it is now a member of the Qualcomm Extension Program and will offer the Sonion Voice Pick Up Bone Sensor on the Qualcomm Ultra-Low Power QCC5100 Bluetooth SoC series in Q1 2020. The combination will allow other audio manufacturers to implement reliable voice quality and voice recognition applications that are not hindered by surrounding noise.

Microchip Introduces New Bluetooth 5.0-Qualified, Dual-Mode Audio IC and Certified Module with LDAC Codec Support

October 8, 2019 by Joao Martins

Microchip Introduces New Bluetooth 5.0-Qualified, Dual-Mode Audio IC and Certified Module with LDAC Codec Support

Microchip introduced the new BM83 SoC, a Bluetooth 5.0 certified dual-mode audio module that contains an on-board Bluetooth stack and audio profiles and supports 24-bit/96kHz high-resolution audio formats to enable high-fidelity wireless audio, including support for Sony’s high fidelity LDAC codec. The combined solution is intended for both new speaker and headphone designs, offering differentiated features.

Bowers & Wilkins Introduces 2019 Line of Wireless Headphones with Cutting-Edge Specifications

September 20, 2019 by audioXpress Staff

Bowers & Wilkins Introduces 2019 Line of Wireless Headphones with Cutting-Edge Specifications

With consumers increasingly aware of active noise cancellation (ANC) technology, more robust Bluetooth wireless connectivity, and fast charging via USB-C, manufacturers are feeling the need to upgrade their existing models. And Bowers & Wilkins decided to do it all at once with two new in-ear, one over-ear, and one on-ear model, adopting the latest available platform and technologies from Qualcomm, including the latest aptX Adaptive Bluetooth transmission.

Sogou Portable Smart Recorder C1 Leverages Nordic’s nRF52810 Bluetooth 5 SoC

August 7, 2019 by audioXpress Staff

Sogou Portable Smart Recorder C1 Leverages Nordic’s nRF52810 Bluetooth 5 SoC

Sogou, a Beijing, China-based technology company, has selected Nordic Semiconductor’s nRF52810 Bluetooth Low Energy (Bluetooth LE) System-on-Chip (SoC) to provide the wireless connectivity for its Smart Recorder C1. Unveiled in Marc 2019 and now available, this Bluetooth LE portable voice recorder employs Nordic’s nRF52810 SoC to wirelessly transfer voice recordings to a smartphone app for transcription. According to Sogou, the device is able to achieve up to 95 percent speech-to-text accuracy in Chinese language.

u-blox Acquires Rigado’s Bluetooth Modules Business

August 2, 2019 by audioXpress Staff

u-blox Acquires Rigado’s Bluetooth Modules Business

Swiss company u‑blox, a global provider of positioning and wireless communication technologies, announced it acquired Rigado’s Bluetooth modules business in an Asset Purchase Agreement. Rigado is an Oregon-based provider of Edge‑as‑a-Service gateway solutions for Commercial IoT applications, and began offering certified wireless modules in 2015, implementing Nordic Semiconductor’s nRF52840 Bluetooth Low Energy (Bluetooth LE) SoC.

Audinate Announces Dante Reference Design for Popular NXP i.MX 8M Mini ARM-based Applications Processor

July 23, 2019 by audioXpress Staff

Audinate Announces Dante Reference Design for Popular NXP i.MX 8M Mini ARM-based Applications Processor

Audinate and NXP Semiconductors have collaborated to introduce a new reference design kit for the popular NXP i.MX 8M Mini QuadLite SoC – providing Dante audio-over-IP to OEMs as on-chip software. Following the announced shift from purpose-built hardware to software-based solutions running on standardized hardware, and a similar agreement to supply software running on Linux for x86 and ARM processors, Audinate now extends the support to NXP’s i.MX 8M processors.

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