All items tagged with SoC (130)

Ambiq Introduces Ultra-Low Powered Development Solution for Voice-Enabled Connected Devices

May 12, 2021 by audioXpress Staff

Ambiq Introduces Ultra-Low Powered Development Solution for Voice-Enabled Connected Devices

Ambiq introduced the new Ambiq Voice-on-SPOT (VoS) Kit, designed for manufacturers to introduce voice-command into their IoT devices with faster time-to-market. The Ambiq VoS Kit offers a complete, always-on, always-listening, voice-to-cloud solution for local voice commands and/or voice assistant integration in battery-powered connected devices.

CEVA to Acquire Intrinsix to Offer Full Turnkey SoC Platforms

May 10, 2021 by audioXpress Staff

CEVA to Acquire Intrinsix to Offer Full Turnkey SoC Platforms

CEVA announced that it agreed to acquire Massachusetts-based Intrinsix Corp., a leading chip design specialist, for approximately $33 million in cash, subject to working capital and other customary purchase price adjustments. The closing of the acquisition is anticipated to take place during the second quarter of 2021. The acquisition allows CEVA to offer IP, software and chip development.

Renesas and SiFive Partner to Jointly-Develop Next-Generation High-End RISC-V Solutions for Automotive Applications

April 22, 2021 by audioXpress Staff

Renesas and SiFive Partner to Jointly-Develop Next-Generation High-End RISC-V Solutions for Automotive Applications

Renesas Electronics, a leading supplier of advanced semiconductor solutions, and SiFive, specialized in RISC-V processors and silicon solutions, announced a strategic partnership to jointly develop next-generation, high-end RISC-V solutions for automotive applications. The partnership will also include SiFive licensing the use of their RISC-V core IP portfolio to Renesas.

Infineon Introduces New AIROC Wi-Fi 6/6E and Bluetooth 5.2 Combo Devices for High-Quality Video and Audio Streaming

April 9, 2021 by Cristina Costa

Infineon Introduces New AIROC Wi-Fi 6/6E and Bluetooth 5.2 Combo Devices for High-Quality Video and Audio Streaming

Infineon Technologies expanded its wireless portfolio with new high-performance, reliable and secure devices. The newly developed AIROC brand now includes the industry’s first 1x1 Wi-Fi 6/6E and Bluetooth 5.2 combo SoC for enterprise and industrial applications, and its first 2x2 Wi-Fi 6/6E and Bluetooth 5.2 combo SoC for multimedia, consumer and automotive applications. The new wireless connectivity combo devices deliver robust performance and minimal latency, making them ideal for high-quality video and audio streaming applications.

CEVA Introduces Bluebud Turnkey IP Wireless Audio Platform for TWS Earbuds and Bluetooth Audio Devices

February 22, 2021 by Joao Martins

CEVA Introduces Bluebud Turnkey IP Wireless Audio Platform for TWS Earbuds and Bluetooth Audio Devices

CEVA unveiled Bluebud, a highly-integrated wireless audio platform aimed at standardizing DSP-enabled Bluetooth audio IP for fast-growing applications, including True Wireless Stereo (TWS) earbuds, hearables, gaming headsets, smartwatches and other wearable devices. The solution fully supports Bluetooth 5.2 and LE Audio design and is ready to support brands in the transition from Bluetooth Classic.

SEGGER Embedded Studio Now Available With Apple M1-Optimized Build

February 16, 2021 by audioXpress Staff

SEGGER Embedded Studio Now Available With Apple M1-Optimized Build

SEGGER announced its Embedded Studio build for the newly released Apple M1, Apple’s first ARM-based system-on-chip (SoC) designed specifically for Mac. Embedded Studio is SEGGER’s cross-platform Integrated Development Environment (IDE) for ARM/Cortex and RISC-V. According to the company, the build for the Apple M1 platform - the first commercial embedded system IDE optimized for the M1 - allows very impressive results.

Devialet Introduces Improved Phantom I All-in-One Speaker

February 4, 2021 by Joao Martins

Devialet Introduces Improved Phantom I All-in-One Speaker

Since its release, Devialet’s flagship compact speaker Phantom established a new reference in home audio. By combining a radical design with a series of innovative, proprietary technologies, Phantom consistently shattered expectations in terms of sound reproduction, while establishing a whole new business model for the French brand. Now, for 2021, Devialet updated the original Phantom with a new audio processing SoC, new matte finishes, and all the latest wireless audio technologies.

Jieli Joins TempowOS Chipset Partner Program for TWS Designs

February 1, 2021 by audioXpress Staff

Jieli Joins TempowOS Chipset Partner Program for TWS Designs

Tempow, the Bluetooth-specialist, Paris-based startup, announced a new partnership with Zhuhai Jieli Technology, a leading chipset manufacturer in the TWS Bluetooth SoC segment. Jieli Technology is joining Tempow's chipset partner program to deploy TempowOS, an operating system for True Wireless Earbuds, on its flagship AC897N and AD697N extreme low power Bluetooth TWS solutions.

Qualcomm and Amazon Deepen Strategic Engagement with the Pre-Integration of Alexa Custom Assistant with Snapdragon Automotive Cockpit Platform

January 27, 2021 by Joao Martins

Qualcomm and Amazon Deepen Strategic Engagement with the Pre-Integration of Alexa Custom Assistant with Snapdragon Automotive Cockpit Platform

Qualcomm Technologies and Amazon announced new joint efforts to pre-integrate the Alexa Custom Assistant with the Qualcomm Snapdragon Automotive Cockpit Platforms - the new-generation of automotive-optimized SoCs from Qualcomm. This new system is designed to support automotive OEMs and Tier-1 suppliers to build customizable, in-vehicle intelligent assistants and is offered as an extension module to the Alexa Automotive Software Development Kit (SDK).

DSP Group Unveils DBM10 Low-Power Edge AI/ML SoC with Dedicated Neural Network Inference Processor

January 7, 2021 by audioXpress Staff

DSP Group Unveils DBM10 Low-Power Edge AI/ML SoC with Dedicated Neural Network Inference Processor

DSP Group announced the DBM10, a new low-power, cost-effective artificial intelligence (AI) and machine learning (ML) system-on-chip (SoC). This new open platform, with a cost- and power-optimized architecture, enables rapid development of AI and ML applications for mobile, wearables, hearables, and connected devices in general. It provides a complete platform in terms of voice and audio processing, without compromising the battery life of new designs, and allowing developers to implement their own differentiating algorithms.

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