The reference design leverages Beken’s BK3288X Bluetooth Audio SoC series featuring the CEVA-X2 Audio DSP running VisiSonics' RealSpace 3D audio software, together with CEVA’s MotionEngine Hear head tracking algorithms. This highly-optimized hardware plus software solution offers OEMs and ODMs a cost-effective, ready-to-deploy SoC with best-in-class performance, using any audio encoding format, to introduce best-in-class 3D audio hearing experience for VR, AR and the new generation of motion-aware earbuds. The single chip-based reference design provides a self-sufficient 3D audio solution, fully residing on the headset side, eliminating the need for a 3D audio rendering engine on the host device, which also enables a lower latency design.
"We are pleased to partner with CEVA and Beken to create a reference design that includes our industry-leading RealSpace 3D Audio technology,” says Dr. Ramani Duraiswami, CEO, VisiSonics. “Our joint reference design offers consumer electronics OEMs and ODMs a complete hardware and software solution to add 3D spatial audio to their product line of headsets and TWS earbuds.”
“Over the past decade, we have been at the forefront of the wireless audio revolution, powering hundreds of millions of Bluetooth-enabled audio devices,” adds Weifeng Wang, VP of Engineering, Beken Corporation. “Spatial audio brings the wireless audio user experience to the next level and we’re pleased to partner with CEVA and VisiSonics to make it easy for our customers to leverage this exciting new technology in a cost-effective, power-efficient turnkey offering. We look forward to see the innovative use cases that the mass market adoption of spatial audio will drive for the audio, gaming and AR/VR industries.”
"Spatial audio is an incredibly hot market right now, as the Android and PC ecosystems look to build on the industry momentum behind its use in music and gaming to create immersive audio experiences," says Moshe Sheier, Vice President of Marketing at CEVA. "Our collaboration with Beken and VisiSonics aims to help OEMs and ODMs address this burgeoning market with a fully-featured, self-sufficient turnkey solution for spatial audio that can be rapidly deployed in headsets and earbuds."
The 3D Audio Reference Design is available now directly from CEVA, and the associated software package combining VisiSonics’ RealSpace 3D audio with CEVA’s MotionEngine Hear is available now for licensing by CEVA and VisiSonics.
Beken Corporation was founded in December 2004 by a technical team from Silicon Valley. Today, the company is a well-known supplier of wireless connectivity chips for connected devices, headquartered in Zhangjiang High-Technology Park, Pudong New District, Shanghai, and with subsidiaries and technical divisions in Shenzhen, Hong Kong, Taipei, Beijing, Hangzhou and Athens.
www.bekencorp.com | www.visisonics.com | www.ceva-dsp.com
