All items tagged with reference design (71)

AVAtronics Announces Reference Design for its Wideband Adaptive Active Noise Cancellation and Speech Enhancement Engine

May 5, 2025 by Joao Martins

AVAtronics Announces Reference Design for its Wideband Adaptive Active Noise Cancellation and Speech Enhancement Engine

AVAtronics, the Lausanne-based Swiss company that developed a unique wideband active noise cancelling technology with multiple applications in personal audio and hearing assistance, announced the availability of a new reference design available for product developers. The project is the result of a cooperation with the Mint Design Group, a team of experienced product developers and designers with a heavy focus on audio from Lund, Sweden.

Cirrus Logic Unveils Flexible Audio Solution for Intel Core Ultra Processors

January 8, 2025 by audioXpress Staff

Cirrus Logic Unveils Flexible Audio Solution for Intel Core Ultra Processors

Cirrus Logic announced a collaboration with Intel to launch a reference design based on the new Intel Core Ultra processors (series 2), formerly codenamed Arrow Lake, with Cirrus Logic’s high-quality audio solutions. According to Cirrus Logic, the reference design represents a significant advancement in PC audio technology, delivering enhanced sound quality, low power consumption, and flexible audio options for a wide range of PC segments.

IDUN Audio Partners with Merry Electronics to Enable Spatial Audio in New Headphone Designs

December 17, 2024 by Joao Martins

IDUN Audio Partners with Merry Electronics to Enable Spatial Audio in New Headphone Designs

IDUN audio, the Danish embedded spatial audio technology specialists announced a strategic partnership with Taiwan-based Merry Electronics. IDUN audio will showcase three new spatial audio integrations for personal audio during CES 2025, all running on Merry's brand new reference designs for true wireless stereo (TWS) earbuds, a new OWS open ear clip solution, and the recently announced new dual driver headphones.

xMEMS Labs and Merry Electronics Showcase Two-Way Headphone Reference Design at CES 2025

December 3, 2024 by Joao Martins

xMEMS Labs and Merry Electronics Showcase Two-Way Headphone Reference Design at CES 2025

Underscoring the potential of solid-state MEMS microspeakers over-the-ear headphones, xMEMS Labs and Merry Electronics announced they will demonstrate a new production-ready reference design at CES 2025. Targeting both premium wireless over-the-ear headphones and gaming applications, Merry highlights xMEMS’ patented 2-way module architecture as a way to improve spatial audio accuracy and reduce weight for gamers, among other benefits.

Enabling Lossless Spatial Audio in Wireless Headphones Using Integrated Wi-Fi

November 13, 2024 by Joao Martins

Enabling Lossless Spatial Audio in Wireless Headphones Using Integrated Wi-Fi

InnoPhase IoT, a semiconductor company specializing in ultra-low power Wi-Fi, and GreenWaves Technologies, the company pioneering ultra-low power AI and DSP processors for hearables and connected devices, announced the development of a lossless audio reference design for Wi-Fi headphones. In collaboration with Danish pioneer IDUN Audio, InnoPhase and GreenWaves have created a platform that enables Spatial Audio for hearables and headphones with extended range and long battery life.

A2B Audio Bus: Two Alternative Power Schemes

October 23, 2024 by Brewster LaMacchia

A2B Audio Bus: Two Alternative Power Schemes

In the second article about the latest generation A2B technology from Analog Devices - expanded with the release of the AD2437 chip - Brewster LaMacchia explores the latest possibilities for audio applications in many other areas other than automotive audio. After reviewing the three generations of A2B technology, LaMacchia expands on the alternative power schemes that deserve some investigation for multichannel digital audio applications. This article was originally published in audioXpress, August 2024.

AMPACS Announces Industry's First 2-Way Over-Ear Headphone Reference Design Based on xMEMS MEMS Speakers

July 23, 2024 by Joao Martins

AMPACS Announces Industry's First 2-Way Over-Ear Headphone Reference Design Based on xMEMS MEMS Speakers

Furthering the integration of solid-state microspeakers in over-the-ear headphones, global ODM/OEM AMPACS announced a turnkey 2-way headphone solution designed in collaboration with MEMS pioneer xMEMS Labs. The patented 2-way module architecture improves spatial audio accuracy and reduces weight, among other benefits versus conventional single-driver architectures. Pre-production prototypes are ready now, and the production-ready solution will be available in September 2024.

Arendi Launches Nordic-Powered Auracast TV Streamer

July 16, 2024 by Joao Martins

Arendi Launches Nordic-Powered Auracast TV Streamer

Swiss embedded electronics designer, Arendi, has unveiled a Bluetooth LE Audio and Auracast broadcast audio TV streamer. The Arendi Auracast TV Streamer employs Nordic Semiconductor's dual core nRF5340 SoC and nRF21540 RF front-end module (FEM) to deliver low power, long range, reliable wireless connectivity with improved audio quality. The streamer provides stereo audio to both Bluetooth LE Audio or Auracast-enabled headphones, speakers, or hearing aids.

New EPC High-Power GaN-Based Class-D Audio Reference Design Now Available

May 17, 2024 by Joao Martins

New EPC High-Power GaN-Based Class-D Audio Reference Design Now Available

Encouraging developers to design high-performance Class-D audio amplifiers leveraging GaN FETs, EPC has launched the new EPC9192 reference design enabling high power and high efficiency Class-D audio amplifiers in a modular design that is ideal for customization. The EPC9192 showcases the high performance capabilities of EPC's 200V, EPC2307 eGaN FETs in a ground-referenced, split dual supply Single-Ended (SE) design, delivering an impressive 700W per channel into a 4Ω load.

Audinate Launches Versatile Dante Pro S1 System-on-a-Chip

January 25, 2024 by Joao Martins

Audinate Launches Versatile Dante Pro S1 System-on-a-Chip

Audinate, the developer of Dante professional audio networking technology, announced Dante Pro S1, a compact and cost-effective system-on-a-chip (SoC) for professional equipment manufacturers. The compact and power-efficient SoC solution was designed to integrate Dante audio in low channel count devices such as microphones, conferencing systems, powered speakers, or AV plates, with scalability for future feature enhancements.

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