All items tagged with reference design (62)

xMEMS and Bujeon Launch 2-Way Hybrid MEMS Driver Solution for Hi-Res TWS Earbuds

February 22, 2023 by Joao Martins

xMEMS and Bujeon Launch 2-Way Hybrid MEMS Driver Solution for Hi-Res TWS Earbuds

xMEMS Labs and Bujeon Electronics have partnered to create a family of 2-way speaker modules to accelerate design of next generation high-resolution and lossless audio-capable TWS earbuds. The solution integrates a high-performance 9mm dynamic driver custom-designed by Bujeon with an xMEMS' Cowell tweeter, the world’s smallest monolithic MEMS microspeaker at just 22mm. The reference design combines an xMEMS Aptos MEMS speaker amplifier to create a "drop-in" solution compatible with today’s leading TWS system-on-chips.

IOT747 and AntennaWare Launch Reference Design for Wearable Applications

February 16, 2023 by Joao Martins

IOT747 and AntennaWare Launch Reference Design for Wearable Applications

IOT747, a Cambridge, UK-based supplier of wireless modules and solutions announced a partnership with AntennaWare, the Northern Ireland-based developer of Bluetooth and Ultra-Wideband (UWB) antenna solutions for wireless wearables. The partnership integrates AntennaWare BodyWave Antenna with the IDC737 Bluetooth module in an example reference design for long-range and wearable applications.

GaN Systems and Axign Unveil 1000W Class-D Heatsinkless Audio Amplifier Design

January 6, 2023 by Joao Martins

GaN Systems and Axign Unveil 1000W Class-D Heatsinkless Audio Amplifier Design

GaN power semiconductors pioneer GaN Systems has once again teamed up with Dutch company Axign to unveil an even more powerful, 1000W Class-D GaN audio amplifier board at CES 2023. The new reference design merges best-in-class technologies from GaN Systems and Axign to enable unique audio systems that are smaller, more efficient, and offer better audio quality. The design is ideal for automotive, professional, and prosumer audio applications.

Axign Introduces Advanced Sound Processors and Power Stages for Class-D Audio Amplifier Solutions

January 6, 2023 by Joao Martins

Axign Introduces Advanced Sound Processors and Power Stages for Class-D Audio Amplifier Solutions

Axign continues to expand on its mission to deliver better audio quality for connected home audio products, where the audio path is digital, making sense to stay in the digital domain all the way to the loudspeakers. At CES 2023, Axign's post-filter feedback loop technology for Class-D amplifiers with balanced feedback from the loudspeaker has expanded with the launch of two new Axign Sound Processors, optimized for the lowest power consumption levels.

Syntiant Partners with Telink and Murata to Present New Edge AI Audio Solutions at CES 2023

December 26, 2022 by Joao Martins

Syntiant Partners with Telink and Murata to Present New Edge AI Audio Solutions at CES 2023

Syntiant is heading to CES 2023 with an exciting range of announcements and presentations of end-to-end edge AI solutions for always-on applications. The company will unveil a new reference design created in partnership with Telink that will enable ODMs and OEMs to easily and quickly deploy complete, ultra-low-power, deep learning voice processing applications in remote controls. Another major announcement is the launch of the Murata Type2DA neural decision processor module for edge AI audio and sensor applications.

Knowles Releases New TWS Reference Design Tuned to the Knowles Preferred Listening Response Curve

September 29, 2022 by Joao Martins

Knowles Releases New TWS Reference Design Tuned to the Knowles Preferred Listening Response Curve

Knowles announced the availability of KN2, a True Wireless Stereo (TWS) reference design tuned to the Knowles Preferred Listening Response Curve, incorporating results of the company's study for music listening on in-ear designs. KN2 features a state-of-art hybrid dual driver system paired with an advanced Bluetooth system-on-chip (SoC) and active noise cancellation (ANC) system along with other advanced features.

Audioscenic and Tectonic Audio Labs to Demonstrate Spatial Audio Reproduction Reference Design at AES AVAR 2022

August 11, 2022 by audioXpress Staff

Audioscenic and Tectonic Audio Labs to Demonstrate Spatial Audio Reproduction Reference Design at AES AVAR 2022

Audioscenic Limited, the British 3D Audio technology startup and Tectonic Audio Labs have joined forces once again to introduce the new Virtua Spatial Audio hardware development kit (HDK) at AVAR 2022. This is Audio Engineering Society’s fourth International Conference on Audio for Virtual and Augmented Reality and will be held at Digipen Institute of Technology in Redmond, Washington, USA on August 15–17, 2022.

Fluent.ai and Knowles Partner on Embedded Voice Recognition for Appliances

July 18, 2022 by audioXpress Staff

Fluent.ai and Knowles Partner on Embedded Voice Recognition for Appliances

Fluent.ai and Knowles developed a reference design for an embedded voice-controlled washing machine using Fluent.ai’s patented speech-to-intent technology, which leverages natural and flexible voice commands to trigger essential appliance actions. The solution combines Fluent.ai’s small footprint embedded voice recognition running on Knowles’ AISonic Audio Edge Processor, enabling reduced BOM costs for manufacturers of smart home white goods.

GaN Technology in Audio Power Amplification

July 6, 2022 by Stuart Yaniger

GaN Technology in Audio Power Amplification

In this review of the GaN Systems amplifier evaluation kit, Stuart Yaniger shares his explorations of the features and benefits of GaN (gallium nitride) power semiconductors, and explains why the technology is not only enabling great sounding audio amplifiers but is also bound to completely disrupt the Class-D segment in high power ratings. This article was originally published in audioXpress, April 2022.

Renesas Launches Highly Integrated Advanced Bluetooth Low Energy SoC

June 22, 2022 by Cristina Costa

Renesas Launches Highly Integrated Advanced Bluetooth Low Energy SoC

Renesas Electronics announced the SmartBond DA1470x Family of Bluetooth low energy (LE) solutions, which the Japanese corporation describes as "the world’s most advanced, integrated System-on-Chip (SoC) family for wireless connectivity." The new Renesas SmartBond DA1470x family features a small form factor with integrated applications and 2D graphics processors, voice activity detector and power management, enabling the development of very compact connected product designs.

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