All items tagged with SoC (140)
Synaptics Launches Ultra-Low-Power Triple Combo Wireless SoC Family with Auracast
March 11, 2025 by Joao Martins

Synaptics Launches Ultra-Low-Power Triple Combo Wireless SoC Family with Auracast

Synaptics has extended its Veros Triple Combo connectivity portfolio with the launch of the latest SYN461x family of ultra-low-power Wi-Fi 2.4/5/6 GHz, Bluetooth 6.0, Bluetooth LE Audio with Auracast, and IEEE 802.15.4 (Zigbee/Thread) systems on chip (SoCs). Designed for embedded applications in Edge AI connected devices, the Veros SYN461x family is optimized for system integration, size, and rapid time to market.
Read more...
Frontier Reports High Demand for its Auracast-Ready AURIA Audio Platform
February 21, 2025 by Joao Martins

Frontier Reports High Demand for its Auracast-Ready AURIA Audio Platform

Frontier is celebrating being first to market with its AURIA FS2345 module, which allowed the company to gain multiple design-ins over the past few months since its launch. Originally presented at IFA 2023, the AURIA module featuring a 5th generation Realtek Ameba SoC was launched in 2024 and allowed the company to be ahead in making available a Bluetooth LE Audio and Wi-Fi 6 module with support for Auracast.
Read more...
Wireless Audio: Ultra-Low Latency Audio Transmission Over Bluetooth LE Audio
February 19, 2025 by Jonny McClintock

Wireless Audio: Ultra-Low Latency Audio Transmission Over Bluetooth LE Audio

While Bluetooth technology does not provide a complete solution for live performance audio, it still has a key role to play. In particular, the value of a standards-based approach manifests with the availability of low-cost Bluetooth LE-compatible transceivers from a variety of SoC vendors. Building on these readily available devices, manufacturers can engineer systems that are strongly optimized for live and professional applications. But what latency performance targets should those products meet?
Read more...
MediaTek and Ceva Expand Spatial Audio Mobile Entertainment Experiences
January 9, 2025 by Joao Martins

MediaTek and Ceva Expand Spatial Audio Mobile Entertainment Experiences

Ceva and MediaTek announced a partnership to enhance the mobile entertainment experience, bringing the Ceva-RealSpace Elevate multichannel spatial audio with head tracking solution to the recently introduced MediaTek Dimensity 9400 flagship 5G smartphone chip using Bluetooth LE Audio. At CES 2025, Ceva demonstrated impressive spatial audio examples, creating a true-to-life listening experience beyond traditional stereo and surround sound systems on True Wireless Stereo (TWS) earbuds and headphones.
Read more...
ARIA Sensing Unveils Hydrogen 3D UWB Radar System-On-Chip for 3D Detection
December 31, 2024 by Cristina Costa

ARIA Sensing Unveils Hydrogen 3D UWB Radar System-On-Chip for 3D Detection

Italian company ARIA Sensing announced the launch of Hydrogen, a groundbreaking Ultra-Wideband (UWB) Radar System-On-Chip (SoC) that sets a new benchmark as the first to offer 3D beamforming with programmable bandwidth up to 1.8GHz. The new UWB radar SoC delivers scalable 1D/2D/3D detection and unparalleled radar-waveform features, becoming an ideal device to sense presence, position, vital-signs, and gestures, with the world's highest resolution and ultra-low power consumption.
Read more...
Airoha Technology Launches Flagship Wireless AI Audio SoC
December 30, 2024 by Joao Martins

Airoha Technology Launches Flagship Wireless AI Audio SoC

Airoha Technology announced the launch of a new flagship wireless audio chip with integrated AI processing. The AB1595 chip integrates essential functions that currently require multiple chips into one single system-on-chip (SoC). The announcement follows a recent press conference where the MediaTek subsidiary confirmed its intention to lead the market as a Bluetooth audio supplier and to outgrow the industry with AI-powered solutions in 2025.
Read more...
Fasetto to Promote Sound Over Power Lines Audio Solutions at CES 2025
December 18, 2024 by Joao Martins

Fasetto to Promote Sound Over Power Lines Audio Solutions at CES 2025

Fasetto, the latest company to bet on signal distribution over power lines, will exhibit its expanded Audio Cu solutions at CES 2025. Fasetto says it has overcome all obstacles of moving data cleanly over the power lines in all environments, a feat that took many years to achieve. Fasetto is currently offering Audio Cu adapters for home audio, but also for DJ controllers, and an SoC for embedded systems, which can be licensed for integration in TVs and professional audio systems.
Read more...
Synaptics Announces New Dual-Core Bluetooth 5.4 and Matter Veros SoC
December 16, 2024 by Joao Martins

Synaptics Announces New Dual-Core Bluetooth 5.4 and Matter Veros SoC

Synaptics expanded its Veros family of connectivity devices with the SYN20708 dual-core system on chip (SoC) for Bluetooth 5.4 and IEEE 802.15.4. The Matter-compliant SoC supports Bluetooth (BT) Classic, Bluetooth Low Energy (BLE), Zigbee, and Thread protocols concurrently on both cores, allowing simultaneous connections to multiple endpoints in heterogeneous network environments, with overall lower system cost.
Read more...
Nordic Semiconductor Launches Next-Generation nRF54L Series Wireless SoCs
November 12, 2024 by Joao Martins

Nordic Semiconductor Launches Next-Generation nRF54L Series Wireless SoCs

The nRF54L wireless SoCs are one of the biggest product launches of the electronica 2024 show in Munich, and they redefine once again Nordic Semiconductor’s lead in ultra-low power wireless for connected devices. The new nRF54L Series includes the previously announced nRF54L15, and the new nRF54L10 and nRF54L05 wireless SoCs. This advanced product series offers significantly enhanced efficiency, exceptional processing power, and versatile design options to meet a growing range of Bluetooth LE applications, including LE Audio and Auracast products.
Read more...
STMicroelectronics and Qualcomm Enter Strategic Collaboration for Edge AI Wireless Connected Devices
October 1, 2024 by Cristina Costa

STMicroelectronics and Qualcomm Enter Strategic Collaboration for Edge AI Wireless Connected Devices

STMicroelectronics and Qualcomm Technologies International, announces a new strategic collaboration for the next generation of industrial and consumer connected solutions augmented by edge AI. The collaboration will pair STMicroelectronics' STM32 microcontroller ecosystem and Qualcomm's wireless connectivity solutions to allow simple, fast, and cost-effective designs of next-generation connected applications.
Read more...