All items tagged with SoC (132)

Nordic Semiconductor Launches Next-Generation nRF54L Series Wireless SoCs

November 12, 2024 by Joao Martins

Nordic Semiconductor Launches Next-Generation nRF54L Series Wireless SoCs

The nRF54L wireless SoCs are one of the biggest product launches of the electronica 2024 show in Munich, and they redefine once again Nordic Semiconductor’s lead in ultra-low power wireless for connected devices. The new nRF54L Series includes the previously announced nRF54L15, and the new nRF54L10 and nRF54L05 wireless SoCs. This advanced product series offers significantly enhanced efficiency, exceptional processing power, and versatile design options to meet a growing range of Bluetooth LE applications, including LE Audio and Auracast products.

STMicroelectronics and Qualcomm Enter Strategic Collaboration for Edge AI Wireless Connected Devices

October 1, 2024 by Cristina Costa

STMicroelectronics and Qualcomm Enter Strategic Collaboration for Edge AI Wireless Connected Devices

STMicroelectronics and Qualcomm Technologies International, announces a new strategic collaboration for the next generation of industrial and consumer connected solutions augmented by edge AI. The collaboration will pair STMicroelectronics' STM32 microcontroller ecosystem and Qualcomm's wireless connectivity solutions to allow simple, fast, and cost-effective designs of next-generation connected applications.

Microchip Technology Acquires Neuronix AI Labs

April 16, 2024 by audioXpress Staff

Microchip Technology Acquires Neuronix AI Labs

Microchip Technology has acquired Neuronix AI Labs to expand its capabilities for power-efficient, AI-enabled edge solutions deployed on field programmable gate arrays (FPGAs). Microchip’s mid-range PolarFire FPGAs and SoCs already lead the industry in terms of low power consumption, reliability and security capabilities. The acquisition of this technology will enable Microchip to develop cost-effective, large-scale edge deployments for use in applications on systems that have cost, size and power constraints and enable a multifold increase in AI/ML processing horsepower on low and mid-range FPGAs.

New Qualcomm S3 Gen 3 and Qualcomm S5 Gen 3 Sound Platforms Dramatically Expand Options for Mid-Tier Designs

March 26, 2024 by Joao Martins

New Qualcomm S3 Gen 3 and Qualcomm S5 Gen 3 Sound Platforms Dramatically Expand Options for Mid-Tier Designs

Qualcomm Technologies International announced the new Qualcomm S3 Gen 3 and Qualcomm S5 Gen 3 Sound Platforms, designed to allow OEMs deliver sound experiences never before possible at the S5 and S3 tiers. All Gen 3 devices support Bluetooth LE Audio and Auracast. The mid-tier S3 Gen 3 Sound Platform now allows customizations via 3rd party solutions from the Qualcomm Voice & Music Extension Program. And now there is a new quality option with aptX Lossless at 24-bit/48kHz.

Realtek Showcases Switchable Wi-Fi/Bluetooth Audio Solution at 2024 AWE China Expo

March 13, 2024 by Joao Martins

Realtek Showcases Switchable Wi-Fi/Bluetooth Audio Solution at 2024 AWE China Expo

Under the theme of "Realtek AI Changing the Future," the Taiwan semiconductor company will exhibit at the AWE China Expo (March 14-17, 2024), at the Shanghai New International Expo Centre (SNIEC). Showcasing the possibilities of AI in connected applications, Realtek will present a hybrid AIoT Audio SoC that supports both dual‑band Wi‑Fi 6 (2.4GHz/5GHz) and dual-mode Bluetooth 5.2 to enable low-latency, high resolution audio playback applications.

Audinate Launches Versatile Dante Pro S1 System-on-a-Chip

January 25, 2024 by Joao Martins

Audinate Launches Versatile Dante Pro S1 System-on-a-Chip

Audinate, the developer of Dante professional audio networking technology, announced Dante Pro S1, a compact and cost-effective system-on-a-chip (SoC) for professional equipment manufacturers. The compact and power-efficient SoC solution was designed to integrate Dante audio in low channel count devices such as microphones, conferencing systems, powered speakers, or AV plates, with scalability for future feature enhancements.

Ceva Brings Bluetooth Audio to Sunplus airlyra SoC Family

January 15, 2024 by audioXpress Staff

Ceva Brings Bluetooth Audio to Sunplus airlyra SoC Family

Ceva and Sunplus Technology, a leading chip provider for multimedia and automotive applications, have expanded their collaboration to integrate Ceva's latest generation RivieraWaves Bluetooth audio solution into the Sunplus airlyra family of HD audio processors targeting wireless speakers, soundbars and other premium wireless audio devices. The first wireless airlyra processors are already shipping with some of the world's premium audio brands.

Rayson Technology Launches Nordic-Powered Bluetooth LE Audio Module for Headphones, Speakers, and Audio Systems

January 4, 2024 by Joao Martins

Rayson Technology Launches Nordic-Powered Bluetooth LE Audio Module for Headphones, Speakers, and Audio Systems

Wireless communications company Rayson Technology has released a multiprotocol module based on Nordic Semiconductor’s nRF5340 System-on-Chip (SoC). The solution is designed for advanced Bluetooth LE Audio applications in consumer electronics as well as smart home. Measuring just 16.5 by 13.0 by 2.5mm, the BTM-N340X module supports LE Audio and its Low Complexity Communication Codec (LC3) for lower power wireless audio streaming applications.

December 20, 2023 by Joao Martins

WiSA Technologies Confirms Philips and Hisense TVs Transmitting WiSA E Multichannel Wireless Audio at CES 2024

Following the confirmation that Hisense would be introducing WiSA E wireless audio software on their TVs, WiSA Technologies announced an implementation of WiSA E direct from a Philips HDTV to external speakers. Transmitting high-quality multichannel audio direct from a TV enables a low-cost and flexible path for consumers to enhance the quality of their audio system. The 2024 Philips and Hisense TV models demonstrate the ease of implementing onboard high-quality multichannel wireless audio.

Feasycom and Nordic Semiconductor Unveil Dual-Mode Module Supporting Bluetooth Classic and LE Audio

December 14, 2023 by Joao Martins

Feasycom and Nordic Semiconductor Unveil Dual-Mode Module Supporting Bluetooth Classic and LE Audio

Nordic Semiconductor says it is shipping more than 1 million Bluetooth LE System-On-Chips (SoCs) every day, claiming market leadership in the emerging category. Expanding on the range of complete solutions for building LE Audio products, Nordic's nRF5340 dual-core SoC was designed to meet all requirements of LE Audio development. Using this SoC, Shenzhen Feasycom launched its FSC-BT631D advanced wireless audio module for dual-mode Bluetooth Classic audio and LE Audio product designs.

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