Renesas Launches Highly Integrated Advanced Bluetooth Low Energy SoC

June 22 2022, 00:10
Renesas Electronics announced the SmartBond DA1470x Family of Bluetooth low energy (LE) solutions, which the Japanese corporation describes as "the world’s most advanced, integrated System-on-Chip (SoC) family for wireless connectivity." The new Renesas SmartBond DA1470x family features a small form factor with integrated applications and 2D graphics processors, voice activity detector and power management, enabling the development of very compact connected product designs.
 

The DA1470x family is the only solution in the Bluetooth LE space to integrate a power management unit, a hardware voice activity detector (VAD), a Graphics Processing Unit (GPU) and Bluetooth LE connectivity all into a single chip. This combined functionality provides smart connected devices with the most advanced sensor and graphical capabilities and seamless, ultra-low power, always-on audio processing. The new family is ideal for wearables like smart watches and fitness trackers; glucose monitor readers and other consumer medical and healthcare devices; home appliances with displays; industrial automation and security systems; and Bluetooth consoles such as e-bikes and gaming equipment.

"The DA1470x family expands on our successful strategy of integrating more functions, including greater processing power, expanded memory and improved power modules, along with VAD for always-on wake and command word detection,” says Sean McGrath, Vice President of the Connectivity and Audio Business Division in Renesas’ IoT, Industrial and Infrastructure Business Unit. “This feature-packed SoC product family enables developers to push the boundaries of connected consumer and industrial applications and future-proof their IoT products to fit the needs of multiple applications, while optimizing their bill of materials.”

The high level of integration further results in significant cost savings on the Bill of Materials (BoM), enabling cost-effective system solutions. It also reduces component count on the PCB enabling smaller form factor designs and freeing up space for additional components or larger batteries. With less components on the PCB, the reliability of the system is also improved, delivering a further reduction in the total cost of goods sold (COGS) of the end product.
 

The SmartBond DA1470x Family is already gaining acceptance in the market. For example, the DA14706 is at the heart of newly launched wearables, leveraging the Arm Cortex-M33 processor as the main application core and Cortex -M0+ as the sensor node controller. The device also features integrated 2D GPU and display controller supporting DPI, JDI parallel, DBI and Single/Dual/Quad SPI interfaces, integrated 720mA JEITA-compliant USB charger supports rechargeable Li-ion/Li-Po batteries, while the ultra-low power hardware VAD enables seamless and always-on audio processing. The integrated low quiescent current SIMO DC/DC converter of the PMU efficiently supplies internal system and external components. And the configurable MAC supports Bluetooth LE 5.2 and proprietary 2.4 GHz protocols.

Renesas has combined the new DA1470x with multiple components from its broad range of embedded processing, analog, power and connectivity portfolio to create reference designs for a Wearable Activity Tracker and an Instrument Panel for Light EVs and eBikes. The DA1470x Family consists of four new devices, all of which are in mass production and widely available now.
www.renesas.com/DA1470x
 
DA14706-00HZDEVKT-P SmartBond DA1470x Bluetooth Low Energy Development Kit Pro
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