All items tagged with product development (912)
Arduino and Truesense Partner to Bring UWB Technology to Millions
October 29, 2024 by Cristina Costa

Arduino and Truesense Partner to Bring UWB Technology to Millions

Arduino announced its latest partnership with Truesense, a leading provider of ultra-wideband (UWB) technology, known for its innovative software and hardware solutions for developers. This collaboration enhances the Arduino ecosystem of hardware products, software solutions, and cloud services, providing developers with a new valuable set of tools, focused on delivering highly accurate real-time location systems and tracking solutions.
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Sound Semiconductor New Mixer Chip Provides Voltage Control of Six Inputs into a Single Output
October 25, 2024 by audioXpress Staff

Sound Semiconductor New Mixer Chip Provides Voltage Control of Six Inputs into a Single Output

Sound Semiconductor announced the ProCircuit 6-into-1 Voltage Controlled Mixer. Based on a new-generation Operational Transconductance Amplifier (OTA), the patent pending SSI2190 allows current-mode linear control of each channel. Differential voltage inputs provide design flexibility, and a high-compliance current output makes summing from multiple sources - including other SSI2190’s - an easy endeavor.
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Peerless and Dirac Announce Strategic Partnership for Room Correction Integration
October 23, 2024 by Joao Martins

Peerless and Dirac Announce Strategic Partnership for Room Correction Integration

Peerless, a Tymphany subsidiary, and Dirac, the Swedish digital audio processing specialists, announced a strategic partnership to improve sound reproduction across the home and professional audio markets. The partnership integrates Dirac’s Dirac Live solution into Peerless’ Flow DSP audio development platform to enable manufacturers of home audio and professional audio systems to more seamlessly and efficiently integrate premium room correction into their product portfolio.
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A2B Audio Bus: Two Alternative Power Schemes
October 23, 2024 by Brewster LaMacchia

A2B Audio Bus: Two Alternative Power Schemes

In the second article about the latest generation A2B technology from Analog Devices - expanded with the release of the AD2437 chip - Brewster LaMacchia explores the latest possibilities for audio applications in many other areas other than automotive audio. After reviewing the three generations of A2B technology, LaMacchia expands on the alternative power schemes that deserve some investigation for multichannel digital audio applications. This article was originally published in audioXpress, August 2024.
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IOT747 Releases Low 20ms Latency Mode for IDC777 Module
October 22, 2024 by Joao Martins

IOT747 Releases Low 20ms Latency Mode for IDC777 Module

IOT747 announced a new low latency feature for its IDC777 ultra-low power module. The IDC777 is a fully integrated dual mode LE Audio (LC3 Codec Auracast and Unicast) and Classic Bluetooth module, optimized for Bluetooth wireless audio designs. With this new 20ms low latency stereo mode, the IDC777 module supports even further flexibility for device customization, enabling applications for gaming and an improved experience for Auracast audio sharing and broadcasting.
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Synaptics Launches Veros High-Performance Wireless Combo SoCs
October 17, 2024 by audioXpress Staff

Synaptics Launches Veros High-Performance Wireless Combo SoCs

Synaptics launched the Veros Seamless Intelligent Connectivity brand with two high-performance systems on chip (SoCs) for Wi-Fi 6E, Bluetooth, and 802.15.4. The two new wireless combo chips from Synaptics, the SYN4383 triple combo (Wi-Fi/Bluetooth/802.15.4) and tri-band (2.4GHz, 5GHz, 6GHz ), and the SYN43756E, also a multi-protocol, tri-band solution that offers a cost-effective version aimed at products not requiring 802.15.4 support, enable product developers to integrate essential wireless protocols including Bluetooth LE Audio.
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Focal Announces New Lensys Professional Closed-Back Headphones
October 8, 2024 by audioXpress Staff

Focal Announces New Lensys Professional Closed-Back Headphones

Focal has released a new closed-back professional headphone model. The new Lensys Professional headphones are designed specifically for professional studio applications, and with a US-suggested retail price of $699 USD they need to offer convincing arguments. The French company has been developing a range of unique innovations for its high end audio headphones, which are now applied in this latest professionals model.
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SVS Launches Flagship 17-Ultra R|Evolution Subwoofers with Digital Control
October 7, 2024 by Alfred Moody

SVS Launches Flagship 17-Ultra R|Evolution Subwoofers with Digital Control

SVS, a name that everyone immediately identifies with powerful subwoofers, launched its new flagship 17-Ultra R|Evolution subwoofer series. Previewed at CEDIA 2024 in Denver, the two new 17-Ultra subwoofer designs represent a ground-up design approach for the Ohio-based audio brand, including a custom 17" high-excursion woofer with dual voice coil windings, a digital processing stage, and full room correction optimization through a smartphone app.
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STMicroelectronics and Qualcomm Enter Strategic Collaboration for Edge AI Wireless Connected Devices
October 1, 2024 by Cristina Costa

STMicroelectronics and Qualcomm Enter Strategic Collaboration for Edge AI Wireless Connected Devices

STMicroelectronics and Qualcomm Technologies International, announces a new strategic collaboration for the next generation of industrial and consumer connected solutions augmented by edge AI. The collaboration will pair STMicroelectronics' STM32 microcontroller ecosystem and Qualcomm's wireless connectivity solutions to allow simple, fast, and cost-effective designs of next-generation connected applications.
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Ceva and Edge Impulse Join Forces to Enable Faster Development of Edge AI Applications
September 24, 2024 by audioXpress Staff

Ceva and Edge Impulse Join Forces to Enable Faster Development of Edge AI Applications

Ceva and Edge Impulse announced a collaboration to rapidly develop, train and deploy advanced embedded machine learning (ML) applications on Ceva's neural processing units with cycle-accurate performance, even before physical hardware is available. This first-of-its-kind collaboration based around Ceva's NPU IP ensures that developers can accurately benchmark and refine the performance of their edge AI models using Edge Impulse's platform, significantly accelerating the time-to-market.
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