All items tagged with product development (415)

MagnaChip Launches New MOSFET to Enhance Protection for Wireless Earphones While Recharging

February 25, 2020 by audioXpress Staff

MagnaChip Launches New MOSFET to Enhance Protection for Wireless Earphones While Recharging

MagnaChip Semiconductor, a designer and manufacturer of analog and mixed-signal semiconductor products from South Korea, announced the company is entering the wireless earphone market with the introduction of a new MOSFET solution that helps preventing the battery in these wireless devices from overcharging. This MOSFET is designed to control excessive current flowing into wireless earphones while recharging the battery in order to protect wireless earphones from being damaged.

Goodix Licenses and Deploys CEVA Bluetooth Low Energy IP in SoCs Targeting Connected Devices

February 24, 2020 by Joao Martins

Goodix Licenses and Deploys CEVA Bluetooth Low Energy IP in SoCs Targeting Connected Devices

CEVA announced that Goodix Technology has licensed and deployed CEVA’s RivieraWaves Bluetooth low energy IP in its GR551x series of Bluetooth low energy System-on-Chip (SoCs). The GR551x series is designed to help users develop low-power Bluetooth-based products including smart mobile devices, wearables, and connected applications. Goodix just acquired NXP’s Voice and Audio Solutions (VAS) business.

CEVA NB-IoT IP Completes Release 14 GCF Certification with Rohde & Schwarz

February 20, 2020 by audioXpress Staff

CEVA NB-IoT IP Completes Release 14 GCF Certification with Rohde & Schwarz

CEVA, the leading licensor of wireless connectivity and smart sensing technologies, and Rohde & Schwarz, a leading supplier of test and measurement equipment, announced that CEVA has successfully completed Protocol Conformance testing of the CEVA-Dragonfly NB2 IP platform for Narrowband IoT Release 14 as defined by the Global Certification Forum (GCF). The comprehensive testing was performed using the Rohde & Schwarz R&S CMW500 wideband radio communication tester, a GCF validated platform for NB-IoT protocol conformance testing.

Loudspeaker Failures and Protections (Part 1)

February 19, 2020 by Mike Klasco and Steve Tatarunis

Loudspeaker Failures and Protections (Part 1)

A new generation of effective and powerful speaker protection technology, using literally all the capabilities and power of pro sound rackmount loudspeaker management processors, is now being designed into mobile audio products that use very small loudspeakers. The implications are that mobile consumer electronics are going to play louder and sound better than ever. But to optimize speakers this way, we need to understand what causes loudspeakers to fail. This article was published originally in audioXpress, August 2013.

New Single Contact Charging and Communication Solution for True Wireless Earbuds from Maxim

February 5, 2020 by audioXpress Staff

New Single Contact Charging and Communication Solution for True Wireless Earbuds from Maxim

Designers of ultra-low-power portables and wearables can shrink the size of a power and communication interface to the charging dock by up to 80 percent with the new MAX20340, the industry’s smallest 2-pin bi-directional DC powerline communications (PLC) device from Maxim Integrated Products. Each MAX20340 PLC IC is only 1.84mm2 and does not require any large external components such as inductors, while hosting communication and power over the same line reduces potential points of failure and cost.

Keysight Helps Accelerate Industry Adoption of USB4 Standard

February 4, 2020 by audioXpress Staff

Keysight Helps Accelerate Industry Adoption of USB4 Standard

Keysight Technologies announced that the company's early research and development in high-speed digital technology will enable the industry to accelerate adoption of the recently released USB4 specification. The company confirmed it will offer cost-effective test and measurement solutions that accelerate the development, implementation and deployment of new USB4 compatible devices.

DirectOut Introduces RAV2 OEM Ravenna Network Audio Module

February 3, 2020 by audioXpress Staff

DirectOut Introduces RAV2 OEM Ravenna Network Audio Module

German connectivity specialists DirectOut have become the latest Ravenna OEM solutions vendor with the release of their new RAV2 high performance network audio module for integration into third party products. The new module also forms the Ravenna AoIP network core of DirectOut’s recently released PRODIGY Series of multifunction audio processors and converters for pro audio, broadcast, installation and studio applications.

TDK Announces First MIPI Standard SoundWire MEMS Microphone

January 21, 2020 by audioXpress Staff

TDK Announces First MIPI Standard SoundWire MEMS Microphone

Among the many interesting demonstrations of new audio solutions for developers presented by TDK at CES 2020, the T5808 MIPI standard SoundWire microphone stands out as a "world's first," using the MIPI Alliance SoundWire compliant digital interface which allows bi-directional data flow. The T5808 is a multi-mode, low noise digital MEMS microphone in a small package, consisting of a MEMS microphone element and an impedance converter amplifier followed by a fourth-order Σ-Δ modulator.

MIPI I3C v1.1 Update for I2C Implementers Simplifies Development for Wearables and Connected Devices

January 20, 2020 by audioXpress Staff

MIPI I3C v1.1 Update for I2C Implementers Simplifies Development for Wearables and Connected Devices

The MIPI Alliance, the international organization that develops interface specifications for mobile and mobile-influenced industries, announced MIPI I3C v1.1, the first update to the interface that eliminates the historical pain points of I2C development. MIPI I3C v1.1 is a scalable, medium-speed, utility and control bus that connects peripherals to an application processor, streamlining integration and improving cost efficiencies in development.

Dirac and NXP Announce Collaboration to Support i.MX 8M Chipset Family with Premium Digital Audio

January 13, 2020 by audioXpress Staff

Dirac and NXP Announce Collaboration to Support i.MX 8M Chipset Family with Premium Digital Audio

Swedish sound pioneer Dirac and NXP Semiconductors announced a collaboration to combine one of the world’s most powerful audio chipsets with a market-leading digital audio platform. By equipping the NXP i.MX 8M family of chipsets with Dirac’s digital audio platform, OEMs can enable their devices with maximized, immersive, and adaptive sound across their complete range of products. The strategic partnership announcement was made at CES 2020.

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