All items tagged with product development (407)

TDK Announces First MIPI Standard SoundWire MEMS Microphone

January 21, 2020 by audioXpress Staff

TDK Announces First MIPI Standard SoundWire MEMS Microphone

Among the many interesting demonstrations of new audio solutions for developers presented by TDK at CES 2020, the T5808 MIPI standard SoundWire microphone stands out as a "world's first," using the MIPI Alliance SoundWire compliant digital interface which allows bi-directional data flow. The T5808 is a multi-mode, low noise digital MEMS microphone in a small package, consisting of a MEMS microphone element and an impedance converter amplifier followed by a fourth-order Σ-Δ modulator.

MIPI I3C v1.1 Update for I2C Implementers Simplifies Development for Wearables and Connected Devices

January 20, 2020 by audioXpress Staff

MIPI I3C v1.1 Update for I2C Implementers Simplifies Development for Wearables and Connected Devices

The MIPI Alliance, the international organization that develops interface specifications for mobile and mobile-influenced industries, announced MIPI I3C v1.1, the first update to the interface that eliminates the historical pain points of I2C development. MIPI I3C v1.1 is a scalable, medium-speed, utility and control bus that connects peripherals to an application processor, streamlining integration and improving cost efficiencies in development.

Dirac and NXP Announce Collaboration to Support i.MX 8M Chipset Family with Premium Digital Audio

January 13, 2020 by audioXpress Staff

Dirac and NXP Announce Collaboration to Support i.MX 8M Chipset Family with Premium Digital Audio

Swedish sound pioneer Dirac and NXP Semiconductors announced a collaboration to combine one of the world’s most powerful audio chipsets with a market-leading digital audio platform. By equipping the NXP i.MX 8M family of chipsets with Dirac’s digital audio platform, OEMs can enable their devices with maximized, immersive, and adaptive sound across their complete range of products. The strategic partnership announcement was made at CES 2020.

Libre Wireless Technologies Introduces New Universal Wireless Audio Streaming and Multiroom Audio End Point

January 10, 2020 by audioXpress Staff

Libre Wireless Technologies Introduces New Universal Wireless Audio Streaming and Multiroom Audio End Point

During CES 2020, Libre Wireless Technologies announced a unique new industry-leading consumer wireless audio streaming solution characterized as the “Universal Audio Streaming Endpoint.” The new embedded solution, based on Libre’s latest LS9X mainstream WiFi media module, enables new audio product developments that seamlessly and concurrently support all major streaming ecosystems, directly in single-end and multiroom configurations.

Cadence Confirms Bluetooth LE Audio LC3 Codec Support for Tensilica HiFi DSPs

January 10, 2020 by audioXpress Staff

Cadence Confirms Bluetooth LE Audio LC3 Codec Support for Tensilica HiFi DSPs

Cadence Design Systems announced that an implementation of the Low Complexity Communications Codec (LC3) that is part of the next generation Bluetooth LE Audio specification, is available now for Cadence Tensilica HiFi DSPs and has even been delivered to a lead customer. LC3 provides higher audio quality at lower bandwidth and affords developers greater flexibility in making tradeoffs between audio quality, power consumption and other features for a more optimal user experience.

Synopsys Announces Bluetooth LE Audio LC3 Codec for ARC Processor

January 10, 2020 by audioXpress Staff

Synopsys Announces Bluetooth LE Audio LC3 Codec for ARC Processor

Synopsys collaborated with Fraunhofer IIS to release an implementation of the LC3 codec, part of the next-generation Bluetooth LE Audio specification. The new LC3 codec is optimized to deliver high-quality audio and voice playback in battery-powered devices incorporating ARC EM and HS DSP processors, and expands Synopsys' DesignWare Bluetooth Low Energy IP offerings and the portfolio of DesignWare ARC audio codecs and post-processing software.

Selective Noise Cancellation with ams AS3460 Digital Augmented Hearing Chip for True Wireless Earbuds Demonstrated at CES 2020

January 9, 2020 by audioXpress Staff

Selective Noise Cancellation with ams AS3460 Digital Augmented Hearing Chip for True Wireless Earbuds Demonstrated at CES 2020

ams showcased its new Earbud Innovation Demo Kit at CES 2020. The ready-to-use reference design shows how loose-fit true wireless earbuds can achieve selective noise cancellation for augmented hearing, while supporting features such as proximity sensing for automatic power saving and usability enhancements. Based on the new ams AS3460 Digital Augmented Hearing companion chip, the solution currently provides the world’s best performing noise cancellation for loose- and closed-fit earbuds.

CEVA Speeds the Development of True Wireless Stereo Earbuds with Support of Bluetooth LE Audio

January 8, 2020 by audioXpress Staff

CEVA Speeds the Development of True Wireless Stereo Earbuds with Support of Bluetooth LE Audio

CEVA, the wireless connectivity specialist, announced that it has enhanced its offerings for developers of true wireless stereo (TWS) earbuds and other wireless audio devices with the general release of the RivieraWaves Bluetooth Low Energy and Dual Mode IPs with support for LE Audio, the next generation of Bluetooth audio. The CEVA solution introduces new features that enhance audio quality and link robustness as well as enabling new audio sharing use cases.

Nordic Semiconductor Launches Bluetooth LE Audio Evaluation Platform

January 8, 2020 by audioXpress Staff

Nordic Semiconductor Launches Bluetooth LE Audio Evaluation Platform

Nordic Semiconductor announced it has launched an LE Audio Evaluation Platform in partnership with San Diego, CA-based Bluetooth Low Energy (Bluetooth LE) stack developer, Packetcraft. The LE Audio solution demonstrates the benefits of High-Quality Wireless LE Audio and is designed to support the new LE Audio specifications that are expected to be released by the Bluetooth Special Interest Group (SIG) during the first half of 2020.

Knowles Acquires Microphone Design Assets from ams AG

December 23, 2019 by audioXpress Staff

Knowles Acquires Microphone Design Assets from ams AG

Knowles Corporation, a market leader in advanced micro-acoustic, audio processing, and precision device solutions, announced it has acquired the MEMS microphone ASIC design business from Austrian company ams AG. The transaction includes intellectual property, rights to source ASIC wafers from multiple foundry partners, and the transfer of the ASIC design team, which will continue to be based in Switzerland.

«
1
2
3
4
5
6
7
8
...
40
41
»