All items tagged with product development (919)
In-Ear Technology Meets Music Fidelity in audioXpress April 2024!
March 12, 2024 by audioXpress Staff

In-Ear Technology Meets Music Fidelity in audioXpress April 2024!

Read the latest Earbuds and Hearables market update. sensiBel experts explain everything about the advantages of Microphone Array Beamforming with Optical MEMS Microphones. GRAS' researchers share their findings about Ear Canal Geometry for In-Ear Headphone Testing. Learn how Hearing and Audio affects our perception of music fidelity. Jan Didden interviews Menno van der Veen. Andrew Russell shares his High-Performance 60-Watt Class A Amplifier project, and Tom Perazella explains how to build a Comprehensive AC Power Controller.
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Knowles Precision Devices Introduces Three-Cell Supercapacitors
March 12, 2024 by audioXpress Staff

Knowles Precision Devices Introduces Three-Cell Supercapacitors

Knowles Precision Devices, a segment of Knowles Corporation announced that its latest EDLC (Electric Double Layer Capacitor) supercapacitor modules are now available. Based on Knowles' Cornell Dubilier brand DGH and DSF Series supercapacitors, these new cutting-edge capacitors use a three-cell package for higher operating voltages (at up to 9 WVDC) and allow for printed circuit board space savings.
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Laird Connectivity Changes Name to Ezurio
March 12, 2024 by audioXpress Staff

Laird Connectivity Changes Name to Ezurio

Laird Connectivity, a recognized wireless technology supplier, announce it has rebranded as Ezurio. For decades, Laird Connectivity and Boundary Devices have provided industry-renowned expertise in wireless product design and embedded processor development. Now the company entered a new chapter building on that foundation as Ezurio, continuing forward with all current portfolios of products and services.
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AntennaWare Introduces New BodyWave UWB Antennas at Embedded World 2024
March 11, 2024 by Joao Martins

AntennaWare Introduces New BodyWave UWB Antennas at Embedded World 2024

Embedded World, in Nuremberg, Germany (April 9-11, 2024) will be the first opportunity for AntennaWare to present their new BodyWave antennas, which strengthen the company’s offering in the UWB frequency. Available in 2.4Ghz, DECT and UWB models, BodyWave antennas generate waves that flow efficiently around the body and support a communication link even when the body is blocking the signal. This new range of three BodyWave UWB antennas expand options for compact wearable applications.
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CUI Devices Launches New Audio Design Services
February 27, 2024 by audioXpress Staff

CUI Devices Launches New Audio Design Services

Oregon-based CUI Devices’ Audio Group announced the official launch of its new audio design services, with a team of sound specialists that are able to leverage advanced simulation tools and testing as well as decades of expertise to support developers and brands. Even for companies with their own in-house resources this level of support is able to optimize a range of audio parameters to specific system needs.
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STMicroelectronics Reveals Cable-Free Connectivity for eUSB Devices
February 21, 2024 by Cristina Costa

STMicroelectronics Reveals Cable-Free Connectivity for eUSB Devices

New short-range wireless point-to-point transceiver ICs from STMicroelectronics remove the need for cables and connectors in consumer-friendly accessories, wearables, and personal electronics. The new ST60A3H0 and ST60A3H contactless connectivity transceivers with eUSB2, UART, GPIO or I2C tunneling address all data-transfer challenges in a cost-effective way. Perfect for personal audio, headphone stands and charging docks.
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Cloud2GND Bumblebee Bluetooth LE Audio Demonstration Board
February 21, 2024 by Joao Martins

Cloud2GND Bumblebee Bluetooth LE Audio Demonstration Board

Cloud2GND, an engineering house specializing in electronic circuit design, embedded systems, protocols, and connected devices developed the Bumblebee LE Audio Demonstrator, the first chipmaker-independent platform for product developers to test and evaluate Bluetooth LE Audio and Auracast applications. Featuring the Panasonic PAN1783 Bluetooth Low Energy 5.3 module, the board is a ready-to-use platform with a class-D amplifier, AKM stereo ADC/DAC, MEMS microphone, NFC and is powered over USB or external power supply.
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Renesas to Acquire PCB Design Software Leader Altium
February 15, 2024 by Joao Martins

Renesas to Acquire PCB Design Software Leader Altium

Renesas Electronics announced an agreement to acquire all outstanding shares of the global leader in electronics design systems, Altium. The announcement, with important repercussions for product developers globally, enables Renesas to create a system-level integrated and open electronics system design and lifecycle management platform, leveraging Altium’s popular design software and cloud platform capabilities to increase innovation and overall productivity.
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Packetcraft Enables First-to-Market Auracast Transmitter from Ampetronic and Listen Technologies
February 12, 2024 by Joao Martins

Packetcraft Enables First-to-Market Auracast Transmitter from Ampetronic and Listen Technologies

Packetcraft has enabled the first commercially-available Auracast audio broadcaster system for professional deployment in public spaces. Announced at ISE 2024, Listen Technologies and Ampetronic have provided the first-to-market Auracast Audio Broadcast Device that is able to turn a public speaking space into a multi-access and hearing-assistance-tech enabled arena. The solution is enabled by Packetcraft's Bluetooth Auracast software.
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Dolphin Design Launches 12nm Silicon for Next-Generation Audio Devices
February 5, 2024 by Joao Martins

Dolphin Design Launches 12nm Silicon for Next-Generation Audio Devices

Dolphin Design, a leading supplier of high-performance analog, mixed-signal, processing intellectual property (IP) as well as ASIC design, has reached a significant milestone with the successful tape-out of its first TSMC 12nm FinFet test-chip containing its state-of-the-art audio IPs. This test chip is the first of its kind to offer a complete solution for audio designs combining high-performance, low-power in a minimal footprint.
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