All items tagged with product development (903)
Orosound Labs Innovation Division Accelerates AI-Enabled Hearables
January 5, 2024 by Joao Martins

Orosound Labs Innovation Division Accelerates AI-Enabled Hearables

Orosound, a company with patented signal processing and noise-canceling technologies, has unveiled Orosound Labs, its advanced innovation division that has operated sub rosa for the last couple of years. As the company stands at the forefront of AI-enabled active noise cancellation and reduction technologies that are ready to be embedded in consumer brand products, Orosound Labs is committed to empowering partners with a faster and more reliable way to introduce hearables with unique AI features to the market.
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Lenbrook Media Group Created to Commercialize BluOS, MQA, and SCL6 Technologies
January 4, 2024 by Joao Martins

Lenbrook Media Group Created to Commercialize BluOS, MQA, and SCL6 Technologies

The Lenbrook Group of Companies, owner of NAD Electronics, PSB Speakers, Bluesound, and the renowned BluOS hi-res multiroom platform, has created a new business unit, Lenbrook Media Group. The mission is to more effectively enable the commercialization and development of Lenbrook's content management solutions, as well as pursue new licensing opportunities. With the BluOS content management platform at its core, this group will also oversee the growth of content encoding solutions MQA and SCL6, which Lenbrook acquired in the autumn of 2023.
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Newauro Brings Smart Speakers Into the Immersive Audio Domain at CES 2024
January 4, 2024 by Joao Martins

Newauro Brings Smart Speakers Into the Immersive Audio Domain at CES 2024

In July 2022, the Saffelberg Investment group acquired all assets, teams and rights of AURO-3D and founded a new company, Newauro, with the intention to further support the growth of the format and technology suite across all markets. Based in Belgium like the original Auro Technologies company, Newauro announced that it's collaborating with Eastech to demonstrate its latest AURO-Scene virtual immersive audio technology at CES 2024.
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Development & Design: The Impact of Microphone Specifications on Active Noise Cancellation Performance
January 3, 2024 by Nikolay Skovorodnikov

Development & Design: The Impact of Microphone Specifications on Active Noise Cancellation Performance

Active noise cancellation (ANC) is a popular feature for consumer electronics headsets, headphones, and earbuds. Designing effective ANC imposes particular specification requirements on audio chain components, including microphones. This article explains how to achieve better true wireless stereo ANC designs, offering valuable insights for this trending application.
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Tymphany and Fraunhofer IIS Present Spatial Audio Reference Designs for Headphones and Speakers at CES 2024
January 2, 2024 by audioXpress Staff

Tymphany and Fraunhofer IIS Present Spatial Audio Reference Designs for Headphones and Speakers at CES 2024

Following the announcement that Tymphany partnered with the Fraunhofer Institute for Integrated Circuits (IIS) in Germany to provide new state-of-the-art spatial audio solutions to audio manufacturers, Tymphany now confirms that at the CES 2024 show in Las Vegas, the two companies will demonstrate new reference designs for both headphones and speakers. These demonstrations will take place at Suite #26336 of the Venetian.
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ONiO Selects Exeger Powerfoyle Solar Cell Technology to Create Devices That Are 100% Battery-Free
December 21, 2023 by Joao Martins

ONiO Selects Exeger Powerfoyle Solar Cell Technology to Create Devices That Are 100% Battery-Free

ONiO, a pioneer in the development of advanced batteryless microcontrollers that can efficiently harness power from a wide range of sources, announced a strategic partnership with Exeger. ONiO chooses Powerfoyle as their preferred solar cell technology for product integration and will combine advanced microcontrollers with solar technology, driving forward the development of sustainable, low-maintenance electronics that are ready for immediate operation.
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GreenWaves Showcases World's First AI-Based Audio Solutions for the GAP9 Application Processor at CES 2024
December 19, 2023 by Joao Martins

GreenWaves Showcases World's First AI-Based Audio Solutions for the GAP9 Application Processor at CES 2024

GreenWaves Technologies will be at CES 2024 with an interesting showcase of AI for audio applications. The company's GAP9 advanced AI processor is in volume production, and GreenWaves will be able to show several solutions that are enabling market leading hearable products. Demonstrations include audio advanced source separation models, and active noise cancellation with neural network based acoustic scene detection, as well as immersive 3D sound.
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AAC and UltraSense Partner to Create Touch Experience Solutions for Cars and Consumer Electronics
December 19, 2023 by audioXpress Staff

AAC and UltraSense Partner to Create Touch Experience Solutions for Cars and Consumer Electronics

AAC Technologies announced a strategic partnership with UltraSense Systems to explore the company's SmartSurface tactile interfaces to create holistic touch experience solutions for automotive and consumer electronics markets. As consumers demand more intuitive touch interfaces, the AAC and UltraSense partnership can help accelerate the industry transition from mechanical buttons to solid-state digital buttons.
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Fraunhofer Cingo and upHear Now Integrated with Tymphany's Peerless Flow DSP
December 15, 2023 by Joao Martins

Fraunhofer Cingo and upHear Now Integrated with Tymphany's Peerless Flow DSP

The Fraunhofer Institute for Integrated Circuits (IIS), headquartered in Erlangen, Germany, and Tymphany have partnered to provide state-of-the-art spatial audio solutions to audio manufacturers. The two companies have worked together to integrate Fraunhofer's audio processing suites and audio technologies into Flow DSP, Tymphany's own DSP platform and design framework which allows creating immersive audio features in new audio products.
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Feasycom and Nordic Semiconductor Unveil Dual-Mode Module Supporting Bluetooth Classic and LE Audio
December 14, 2023 by Joao Martins

Feasycom and Nordic Semiconductor Unveil Dual-Mode Module Supporting Bluetooth Classic and LE Audio

Nordic Semiconductor says it is shipping more than 1 million Bluetooth LE System-On-Chips (SoCs) every day, claiming market leadership in the emerging category. Expanding on the range of complete solutions for building LE Audio products, Nordic's nRF5340 dual-core SoC was designed to meet all requirements of LE Audio development. Using this SoC, Shenzhen Feasycom launched its FSC-BT631D advanced wireless audio module for dual-mode Bluetooth Classic audio and LE Audio product designs.
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