All items tagged with product development (953)
Cloud2GND Bumblebee Bluetooth LE Audio Demonstration Board
February 21, 2024 by Joao Martins

Cloud2GND Bumblebee Bluetooth LE Audio Demonstration Board

Cloud2GND, an engineering house specializing in electronic circuit design, embedded systems, protocols, and connected devices developed the Bumblebee LE Audio Demonstrator, the first chipmaker-independent platform for product developers to test and evaluate Bluetooth LE Audio and Auracast applications. Featuring the Panasonic PAN1783 Bluetooth Low Energy 5.3 module, the board is a ready-to-use platform with a class-D amplifier, AKM stereo ADC/DAC, MEMS microphone, NFC and is powered over USB or external power supply.
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Renesas to Acquire PCB Design Software Leader Altium
February 15, 2024 by Joao Martins

Renesas to Acquire PCB Design Software Leader Altium

Renesas Electronics announced an agreement to acquire all outstanding shares of the global leader in electronics design systems, Altium. The announcement, with important repercussions for product developers globally, enables Renesas to create a system-level integrated and open electronics system design and lifecycle management platform, leveraging Altium’s popular design software and cloud platform capabilities to increase innovation and overall productivity.
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Packetcraft Enables First-to-Market Auracast Transmitter from Ampetronic and Listen Technologies
February 12, 2024 by Joao Martins

Packetcraft Enables First-to-Market Auracast Transmitter from Ampetronic and Listen Technologies

Packetcraft has enabled the first commercially-available Auracast audio broadcaster system for professional deployment in public spaces. Announced at ISE 2024, Listen Technologies and Ampetronic have provided the first-to-market Auracast Audio Broadcast Device that is able to turn a public speaking space into a multi-access and hearing-assistance-tech enabled arena. The solution is enabled by Packetcraft's Bluetooth Auracast software.
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Dolphin Design Launches 12nm Silicon for Next-Generation Audio Devices
February 5, 2024 by Joao Martins

Dolphin Design Launches 12nm Silicon for Next-Generation Audio Devices

Dolphin Design, a leading supplier of high-performance analog, mixed-signal, processing intellectual property (IP) as well as ASIC design, has reached a significant milestone with the successful tape-out of its first TSMC 12nm FinFet test-chip containing its state-of-the-art audio IPs. This test chip is the first of its kind to offer a complete solution for audio designs combining high-performance, low-power in a minimal footprint.
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Audinate Launches Versatile Dante Pro S1 System-on-a-Chip
January 25, 2024 by Joao Martins

Audinate Launches Versatile Dante Pro S1 System-on-a-Chip

Audinate, the developer of Dante professional audio networking technology, announced Dante Pro S1, a compact and cost-effective system-on-a-chip (SoC) for professional equipment manufacturers. The compact and power-efficient SoC solution was designed to integrate Dante audio in low channel count devices such as microphones, conferencing systems, powered speakers, or AV plates, with scalability for future feature enhancements.
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Cardinal Peak and Audinate Announce Strategic Partnership Dante Networked Audio and Video Solutions
January 24, 2024 by Joao Martins

Cardinal Peak and Audinate Announce Strategic Partnership Dante Networked Audio and Video Solutions

Cardinal Peak, the recognized product design and engineering services provider, and Audinate, the developer of Dante audio networking technology, have announced a strategic development partnership aimed at reducing time to market and development costs for new Dante-enabled pro audio and video products. With more manufacturers interested in Dante integration in a growing number of products, Cardinal Peak will support product engineering efforts.
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Ceva Brings Bluetooth Audio to Sunplus airlyra SoC Family
January 15, 2024 by audioXpress Staff

Ceva Brings Bluetooth Audio to Sunplus airlyra SoC Family

Ceva and Sunplus Technology, a leading chip provider for multimedia and automotive applications, have expanded their collaboration to integrate Ceva's latest generation RivieraWaves Bluetooth audio solution into the Sunplus airlyra family of HD audio processors targeting wireless speakers, soundbars and other premium wireless audio devices. The first wireless airlyra processors are already shipping with some of the world's premium audio brands.
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Frontier Unveils Partnership with Realtek for New AURIA Connected Audio Module
January 12, 2024 by audioXpress Staff

Frontier Unveils Partnership with Realtek for New AURIA Connected Audio Module

Frontier Smart Technologies unveiled a collaboration with Realtek for its AURIA Bluetooth LE Audio and Wi-Fi module, which features Auracast support. The audio module has been designed and engineered for simple integration into various audio products, and comes with a customizable SDK, rich I/O, comprehensive documentation and technical support. The latest Realtek Ameba chips ensure support for the latest technologies.
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Analog Devices Presents New-Generation ADAU1797 Low Power Audio Processor at CES 2024
January 9, 2024 by Joao Martins

Analog Devices Presents New-Generation ADAU1797 Low Power Audio Processor at CES 2024

Analog Devices is now sampling its latest audio processor and low power ANC codec, the ADAU1797. This high-performance device with integrated HiFi 3z and FastDSP cores is able to efficiently support front-end audio processing with beamforming and noise reduction, as well as neural network-assisted speech recognition (ASR) processing. An ideal, low latency, low power, three times more powerful processor for true wireless stereo (TWS) ANC earbuds and headphones.
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Packetcraft Introduces Wireless Multi-Microphone Demo Kit based on Bluetooth LE Audio to Accelerate New Category of Peripherals
January 8, 2024 by Joao Martins

Packetcraft Introduces Wireless Multi-Microphone Demo Kit based on Bluetooth LE Audio to Accelerate New Category of Peripherals

At CES 2024, Packetcraft announced a new Wireless Multi-Microphone Demo Kit based on Bluetooth LE Audio technology that incorporates the company’s newly available Link Robustness Package. Packetcraft’s software solution supports a new standards-based ultra-low latency solution for wireless microphone accessories. These can typically be integrated into mobile devices and computers, in addition to supporting specialized commercial audio applications, voice announcement systems, and conference room wireless microphones.
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