All items tagged with product development (878)
Silicon Labs Announces New Bluetooth SoC and MCU Ideal for Small Form-Factor Devices
March 16, 2023 by audioXpress Staff

Silicon Labs Announces New Bluetooth SoC and MCU Ideal for Small Form-Factor Devices

Silicon Labs continues to expand its range of wireless solutions for connected devices, and during Embedded World 2023 in Germany, the company introduced two new integrated circuit families designed for the smallest form factor IoT devices: the xG27 family of Bluetooth systems on chips (SoCs) and the BB50 microcontroller unit (MCU).
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EM Microelectronic Licenses Packetcraft Host and Controller Software with Support for Bluetooth 5.4 PAwR, LE Audio and Auracast
March 13, 2023 by audioXpress Staff

EM Microelectronic Licenses Packetcraft Host and Controller Software with Support for Bluetooth 5.4 PAwR, LE Audio and Auracast

At Embedded World 2023, Packetcraft announced their latest Bluetooth 5.4 host and controller software is enabling EM Microelectronic’s flagship em | bleu (EM9305). The em | bleu single chip is a small form factor and ultra-low energy consuming Bluetooth LE SoC or companion IC solution supporting the very latest Bluetooth technology including PAwR, LE Audio and Auracast broadcast audio.
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Realtek Semiconductor and Alango Technologies Partner to Offer Joint Solution for Hearables
March 13, 2023 by Joao Martins

Realtek Semiconductor and Alango Technologies Partner to Offer Joint Solution for Hearables

Realtek Semiconductor (Taiwan) and Alango Technologies (Israel) have announced a collaboration to provide a joint solution that delivers the Alango PersonaSound suite of software technologies, ported and optimized for the latest Realtek Bluetooth SoCs. This collaboration aims to address the global problem of hearing loss, which affects 1.5 billion people worldwide.
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SPARK Microsystems Receives CDN $48 Million Investment To Drive UWB Wireless Development
March 13, 2023 by Joao Martins

SPARK Microsystems Receives CDN $48 Million Investment To Drive UWB Wireless Development

SPARK Microsystems announced the closing of CDN $34 million Series B financing, with an additional CDN $14 million available subject to meeting operational milestones. Led by Idealist Capital, a prominent investment firm focused on the energy transition and decarbonization, the round includes existing investors Cycle Capital, Economic Development Canada (EDC), Real Ventures, and ND Capital. The new funding will drive mass market commercialization for ultra-energy efficient, UWB-based wireless electronic devices and sensors.
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OCA Alliance Introduces New Technologies, New Standards, and Receives Support From New Members
March 9, 2023 by Joao Martins

OCA Alliance Introduces New Technologies, New Standards, and Receives Support From New Members

The ISE 2023 show in Barcelona saw the OCA Alliance bring forward several new developments and announcements that will continue to push the horizons of the AES70 control standard. During the show, presentations, demonstrations, and new members to the trade association showcased current and future technologies and tools that will further broaden the Open Control Architecture (OCA) Ecosystem.
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XMOS Launches XVF3800 High-Performance Voice Processor for Enterprise and Consumer Voice Conferencing Platforms
March 7, 2023 by Joao Martins

XMOS Launches XVF3800 High-Performance Voice Processor for Enterprise and Consumer Voice Conferencing Platforms

Anticipating the company's presentation at Embedded World 2023, XMOS has launched the XVF3800, a quick-to-market, high-performance voice processor for enterprise and consumer voice conferencing platforms. The XVF3800 combines acoustic echo cancellation (AEC), multiple adaptive beamformers, noise suppression, AGC, and more, and will be available along with a development kit, the XK-VOICE-SQ66.
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STMicroelectronics Announces All-in-One Motion and Bone-Conduction Sensor for Hearables
March 7, 2023 by audioXpress Staff

STMicroelectronics Announces All-in-One Motion and Bone-Conduction Sensor for Hearables

STMicroelectronics has announced the LSM6DSV16BX, a unique highly integrated sensor that delivers important space savings inside hearable devices or general-purpose TWS earbuds, including for sports. The new device delivers longer listening experiences and superior hearing by combining a 6-axis inertial measurement unit (IMU) for head tracking and activity detection with an audio accelerometer for detecting voice through bone conduction in a frequency range that exceeds 1KHz.
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STMicroelectronics Receives USB-IF Certification for Complete 140W USB PD 3.1 Solution
March 6, 2023 by Cristina Costa

STMicroelectronics Receives USB-IF Certification for Complete 140W USB PD 3.1 Solution

STMicroelectronics has achieved USB-IF (USB Implementers Forum) certification of two ICs for use in adapter (source) and device (sink) sides of a USB Power Delivery (USB PD) EPR power supply/charger product. The new ICs extend the range of a universal charger to 140W, allowing for a single AC to DC adapter to charge equipment such as computers, smart-home actuators, power tools, and e-bikes, as well as traditional applications including smartphones, TWS earbuds, and Bluetooth speakers.
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Building a Haptic Dimension: The Science Behind the Taction Transporter
March 2, 2023 by James Biggs and John Steinberg

Building a Haptic Dimension: The Science Behind the Taction Transporter

Haptic motors are finding applications in gaming, music, VR/AR, and therapeutic/wellness. The Transporter is a patented transducer that delivers faster more accurate bass and is designed to work with the main audio driver in headphones. It subtly vibrates against the user’s skin to produce an extra dimension that can be described as a high-fidelity extension. Silmon J. Biggs and John Steinberg, the two masterminds behind Taction Technology share the story of this development. This article was originally published in audioXpress, January 2023.
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PSB Speakers, Sonical and MQA Announce Partnership to Create Next-Generation Headphones
February 28, 2023 by Joao Martins

PSB Speakers, Sonical and MQA Announce Partnership to Create Next-Generation Headphones

PSB Speakers, together with hearables start-up Sonical and audio codecs specialists MQA, announced a partnership that intends to define a new category of high-resolution audio headphones. The collaboration is aimed at creating true hifi headphones and smart earbuds, combining MQA's SCL6 high resolution wireless audio transmission and Sonical’s CosmOS platform. Planned for release under the PSB Speakers brand by Q1 2024, the resulting products will be the first headphones to feature Sonical’s ear computing platform, enabling a variety of apps and software upgrades.
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