All items tagged with product development (417)

Avnet Unveils MaaXBoard for Low-Cost Embedded Computing and Edge AI Development

November 14, 2019 by Cristina Costa

Avnet Unveils MaaXBoard for Low-Cost Embedded Computing and Edge AI Development

Avnet is now offering a single board computer which allows developers to focus more on the software side of their projects. The new MaaXBoard is a low-cost, production-ready qualified platform, based on the NXP i.MX 8M applications processor, ideal for embedded computing and applications that leverage AI at the edge. It supports design engineers and end-users seeking to create automation, multimedia, AI and smart home applications with reduced cost and time-to-market.

Alango Far-Field Voice Enhancement Package Now Available on NXP RT600 Processor

November 13, 2019 by audioXpress Staff

Alango Far-Field Voice Enhancement Package Now Available on NXP RT600 Processor

DSP processing software specialist firm, Alango has been working to port the company's Voice Enhancement Package (VEP) to the NXP i.MX RT600 cross-over processor family, which is optimized for 32-bit immersive audio applications combining a high-performance Cadence Tensilica Hi-Fi 4 audio DSP core with a next-generation Cortex-M33 core. VEP is a set of Alango proprietary far-field voice enhancement technologies developed to improve human to machine interaction in a variety of applications.

Acconeer and Imagimob Combine Radar Technology and Edge AI for Gesture Control Applications

November 12, 2019 by audioXpress Staff

Acconeer and Imagimob Combine Radar Technology and Edge AI for Gesture Control Applications

By combining Edge AI software from Imagimob, a company specializing in artificial intelligence development, with Pulsed Coherent Radar technology from Acconeer, the radar sensor specialists, the two Swedish companies have created an innovative platform for gesture control that is perfect for consumer electronics products. Scheduled to be demonstrated at CES 2020 (January 7-10) in Las Vegas, the solution will be implemented for application with wireless headphones, trained to recognize five hand gestures with high accuracy and close to zero latency.

New TI Burr-Brown Audio Quad-Channel ADC Captures Voice at Four Time Larger Distances

November 5, 2019 by audioXpress Staff

New TI Burr-Brown Audio Quad-Channel ADC Captures Voice at Four Time Larger Distances

No more yelling at smart speakers. Texas Instruments (TI) introduced a new audio analog-to-digital converter (ADC) capable of capturing clear audio up to four times farther away than competing devices. The new TI Burr-Brown TLV320ADC5140 audio ADC enables far-field voice capture and achieves a 120-dB dynamic range for clear, high-fidelity audio in smart home applications. The TLV320ADC5140 is the industry’s smallest quad-channel audio ADC with this level of performance.

Chirp and Synaptics Join Forces to Empower Smart Home Devices with Data-Over-Sound Connectivity

November 4, 2019 by audioXpress Staff

Chirp and Synaptics Join Forces to Empower Smart Home Devices with Data-Over-Sound Connectivity

Chirp, the pioneers in data-over-sound, have joined forces with one of the leading companies in human machine interface (HMI) hardware and software solutions, Synaptics, in an effort to bring low-powered connectivity to consumer smart home devices. The collaboration targets seamless smart device experiences by embedding Chirp’s data-over-sound software into Synaptics’ edge computing SoCs.

Smallest Low-Power Wireless Power Receiver for In-Case TWS Charging

October 30, 2019 by Cristina Costa

Smallest Low-Power Wireless Power Receiver for In-Case TWS Charging

Integrated Device Technology (IDT), a wholly owned subsidiary of Renesas Electronics Corporation, announced the availability of its new P9222-R wireless power receiver, the industry’s smallest and optimized for wireless charging cases used to charge true wireless stereo (TWS) earbuds, hearing aids and other small, battery-powered consumer devices. Unlike other available solutions, the P9222-R is cost-optimized, highly efficient, feature rich and proven in high-volume applications with major consumer electronics manufacturers.

Infineon Expands CoolGaN Portfolio with New Device Tailored for Premium Audio Systems

October 29, 2019 by audioXpress Staff

Infineon Expands CoolGaN Portfolio with New Device Tailored for Premium Audio Systems

Infineon Technologies broadened its CoolGaN series with two new devices: the CoolGaN 400 V and the CoolGaN 600 V. Gallium nitride (GaN) offers fundamental advantages over silicon, with outstanding specific dynamic on-state resistance and smaller capacitances compared to silicon MOSFETs. The new CoolGaN 400 V device will appeal to audio product designers looking for a premium solution for home or professional Class D amplifiers.

TDK Expands PiezoListen Lineup of Ultra-Thin Piezo Speakers with a Wider Dynamic Range

October 29, 2019 by audioXpress Staff

TDK Expands PiezoListen Lineup of Ultra-Thin Piezo Speakers with a Wider Dynamic Range

TDK Corporation has expanded its lineup of ultra-thin PiezoListen speakers with new types featuring a wider dynamic range and higher sound pressure level (SPL) in the low frequency range, even at voltages up to 24 VP-P. The PiezoListen series of piezo speakers now includes the PHUA6630 wide dynamic range speaker with an operating frequency range of 400 Hz to 20 kHz. Also new in the series are two new sound positioning speakers with an operating frequency range of 1000 Hz to 20 kHz.

XMOS VocalFusion 2-Mic Dev Kit for Alexa Voice Service Qualified by Amazon

October 29, 2019 by audioXpress Staff

XMOS VocalFusion 2-Mic Dev Kit for Alexa Voice Service Qualified by Amazon

Amazon has qualified the VocalFusion 2-mic dev kit for Alexa Voice Services launched by XMOS for smart TVs and set-top boxes in July 2019. The qualification highlights the opportunity for manufacturers to build Amazon Alexa voice capabilities into their products more easily and cost effectively than ever before. Amazon highlights the product’s engineering innovation, enabling lower cost voice capabilities with all the performance of a 4-mic solution, and paving the way for mass market implementation of far-field applications.

Sonion Combines Voice Pick Up Bone Sensor With Qualcomm Bluetooth SoC to Improve Speech Intelligibility

October 21, 2019 by audioXpress Staff

Sonion Combines Voice Pick Up Bone Sensor With Qualcomm Bluetooth SoC to Improve Speech Intelligibility

Sonion, the manufacturer of components and solutions for hearing aids and in-ear headphones, announced that it is now a member of the Qualcomm Extension Program and will offer the Sonion Voice Pick Up Bone Sensor on the Qualcomm Ultra-Low Power QCC5100 Bluetooth SoC series in Q1 2020. The combination will allow other audio manufacturers to implement reliable voice quality and voice recognition applications that are not hindered by surrounding noise.

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