All items tagged with product development (480)

Murata Develops Compact Multilayer Ceramic Capacitor

June 5, 2020 by audioXpress Staff

Murata Develops Compact Multilayer Ceramic Capacitor

Murata Manufacturing Co., Ltd. has developed the GRM011R60J104M multi-layer ceramic capacitor, which the company claims is the world’s first to feature a maximum capacitance of 0.1µF in 008004 inch size (0.25×0.125mm). Mass production of this new product is scheduled to begin in 2020. Applications can be valuable in wearables devices and compact audio players, among many other products that require large numbers of more compact capacitors.

Gesture-Controlled and Edge-AI In-Ear Headphones Joint Development Effort Funded in Sweden

June 3, 2020 by Joao Martins

Gesture-Controlled and Edge-AI In-Ear Headphones Joint Development Effort Funded in Sweden

Swedish companies Acconeer, Imagimob and Flexworks decided to join forces in a project to develop gesture-controlled in-ear headphones. Using the profound expertise of the three companies, the project will be a unique combination of research in advanced radar technology, expertise in AI (deep learning) and expertise in designing and manufacturing consumer electronics products. A first working prototype is expected within the first year of the project.

Qualcomm Introduces Mobile Wireless Connectivity Chips with 6 GHz Wi-Fi 6E and Bluetooth 5.2

May 29, 2020 by audioXpress Staff

Qualcomm Introduces Mobile Wireless Connectivity Chips with 6 GHz Wi-Fi 6E and Bluetooth 5.2

Qualcomm Technologies, launched a flagship portfolio of mobile connectivity systems that represent the most advanced Wi-Fi 6E offerings of their kind. Building upon the company's existing Wi-Fi 6 and Bluetooth audio solutions, the new Qualcomm FastConnect 6900 and Qualcomm FastConnect 6700 systems feature the fastest available Wi-Fi speeds in the industry (up to 3.6 Gbps) on a mobile Wi-Fi offering, low latency and the latest Bluetooth 5.2 advancements delivering improved audio experiences for classic and emerging LE Audio use cases.

Cirrus Logic Launches Advanced Haptic and Sensing IC Solutions for Richer, Immersive User Experiences

May 28, 2020 by audioXpress Staff

Cirrus Logic Launches Advanced Haptic and Sensing IC Solutions for Richer, Immersive User Experiences

With the goal of elevating the user experience for a wide range of consumer devices, Cirrus Logic is leveraging its low-power, low-latency mixed-signal processing technology to develop an advanced product portfolio of haptic and sensing integrated circuits (ICs) that enable increased functionality and sleek buttonless designs for smartphones, PCs, wearables, gaming, virtual reality and automotive applications. Cirrus Logic’s haptic products and sophisticated haptic feedback technology enable sleeker, more robust end products with fewer mechanical controls for new responsive and immersive user experiences.

Dennis Fink joins THAT Corporation’s Applications Group

May 28, 2020 by audioXpress Staff

Dennis Fink joins THAT Corporation’s Applications Group

THAT Corporation announced that Dennis Fink has joined the company as Senior Applications Engineer. In this position, Dennis will focus his extensive audio design skills on support for new products currently in development as well as the company’s existing integrated circuit (IC) portfolio. An audio industry veteran with many years as principal engineer in respected audio manufacturers adds depth to THAT’s support team.

DSP Concepts Launches AWE Core OS Audio-Processing Engine Optimized for Multi-Core Development

May 21, 2020 by audioXpress Staff

DSP Concepts Launches AWE Core OS Audio-Processing Engine Optimized for Multi-Core Development

DSP Concepts launched AWE Core OS, a new variant of the audio-processing engine powering its Audio Weaver platform, optimized for multi-core development. The Audio Weaver platform that already powers more than 40 million devices worldwide is now optimized to dramatically reduce the costs and components typically required to build new audio features. DSP Concepts built this solution specifically for automotive brands to address complexities and costs associated with creating new audio experiences.

Microchip Reveals Software Development Kit and Neural Network IP for Easily Creating Low-Power FPGA Smart Embedded Solutions

May 18, 2020 by audioXpress Staff

Microchip Reveals Software Development Kit and Neural Network IP for Easily Creating Low-Power FPGA Smart Embedded Solutions

Microchip Technology is determined to meet the growing need for power-efficient inferencing in edge applications by making it easier for software developers to implement their algorithms in PolarFire field-programmable gate arrays (FPGAs). As a significant addition to its solutions portfolio in this segment, Microchip’s VectorBlox Accelerator Software Development Kit (SDK) helps developers take advantage of Microchip’s PolarFire FPGAs for creating low-power, flexible overlay-based neural network applications without learning an FPGA tool flow.

NXP Extends Wireless MCU Family with New Devices Featuring Enhanced Bluetooth 5 Capabilities

May 18, 2020 by Cristina Costa

NXP Extends Wireless MCU Family with New Devices Featuring Enhanced Bluetooth 5 Capabilities

NXP Semiconductors announced the availability of new devices within its KW3x family of microcontrollers (MCUs). The new KW39/38/37 MCUs add Bluetooth 5.0 long-range capabilities and expanded Bluetooth advertising channels. These enhancements are made while offering seamless migration with hardware, software and tools compatibility with the previous generation of devices, KW34/35/36. The new wireless MCU solutions allow developers to address emerging use cases within automotive applications.

Next-Generation AVR DA Microcontroller Family From Microchip Enables Real-Time Control, Connectivity and HMI Applications

May 7, 2020 by audioXpress Staff

Next-Generation AVR DA Microcontroller Family From Microchip Enables Real-Time Control, Connectivity and HMI Applications

As the Internet of Things (IoT) delivers greater connectivity for industrial and home applications and as connected vehicles enhance cabin and operational features, higher-performance microcontrollers are required for better real-time control as well as to enable enhanced human machine interface applications. Microchip Technology announced its next generation AVR DA family of microcontrollers (MCUs) – its first Functional Safety Ready AVR MCU family with Peripheral Touch Controller (PTC).

Electrocomponents Introduces OKdo E1 Single Board Computer for Low-Cost Development of Connected Devices

May 5, 2020 by audioXpress Staff

Electrocomponents Introduces OKdo E1 Single Board Computer for Low-Cost Development of Connected Devices

OKdo, the new brand that is now part of the Electrocomponents Group (RS, Allied, DesignSpark), introduced its first own-branded single board computer (SBC), the E1. The E1 board features an NXP LPC55S69 microcontroller, which offers a high-performance, secure low-cost entry to the development of connected devices, and represents the start of the next phase in the company's evolution towards providing an accessible range of software, hardware, services and solutions.

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