All items tagged with product development (878)

Cardinal Peak and Audinate Announce Strategic Partnership Dante Networked Audio and Video Solutions

January 24, 2024 by Joao Martins

Cardinal Peak and Audinate Announce Strategic Partnership Dante Networked Audio and Video Solutions

Cardinal Peak, the recognized product design and engineering services provider, and Audinate, the developer of Dante audio networking technology, have announced a strategic development partnership aimed at reducing time to market and development costs for new Dante-enabled pro audio and video products. With more manufacturers interested in Dante integration in a growing number of products, Cardinal Peak will support product engineering efforts.

Ceva Brings Bluetooth Audio to Sunplus airlyra SoC Family

January 15, 2024 by audioXpress Staff

Ceva Brings Bluetooth Audio to Sunplus airlyra SoC Family

Ceva and Sunplus Technology, a leading chip provider for multimedia and automotive applications, have expanded their collaboration to integrate Ceva's latest generation RivieraWaves Bluetooth audio solution into the Sunplus airlyra family of HD audio processors targeting wireless speakers, soundbars and other premium wireless audio devices. The first wireless airlyra processors are already shipping with some of the world's premium audio brands.

Frontier Unveils Partnership with Realtek for New AURIA Connected Audio Module

January 12, 2024 by audioXpress Staff

Frontier Unveils Partnership with Realtek for New AURIA Connected Audio Module

Frontier Smart Technologies unveiled a collaboration with Realtek for its AURIA Bluetooth LE Audio and Wi-Fi module, which features Auracast support. The audio module has been designed and engineered for simple integration into various audio products, and comes with a customizable SDK, rich I/O, comprehensive documentation and technical support. The latest Realtek Ameba chips ensure support for the latest technologies.

Analog Devices Presents New-Generation ADAU1797 Low Power Audio Processor at CES 2024

January 9, 2024 by Joao Martins

Analog Devices Presents New-Generation ADAU1797 Low Power Audio Processor at CES 2024

Analog Devices is now sampling its latest audio processor and low power ANC codec, the ADAU1797. This high-performance device with integrated HiFi 3z and FastDSP cores is able to efficiently support front-end audio processing with beamforming and noise reduction, as well as neural network-assisted speech recognition (ASR) processing. An ideal, low latency, low power, three times more powerful processor for true wireless stereo (TWS) ANC earbuds and headphones.

Packetcraft Introduces Wireless Multi-Microphone Demo Kit based on Bluetooth LE Audio to Accelerate New Category of Peripherals

January 8, 2024 by Joao Martins

Packetcraft Introduces Wireless Multi-Microphone Demo Kit based on Bluetooth LE Audio to Accelerate New Category of Peripherals

At CES 2024, Packetcraft announced a new Wireless Multi-Microphone Demo Kit based on Bluetooth LE Audio technology that incorporates the company’s newly available Link Robustness Package. Packetcraft’s software solution supports a new standards-based ultra-low latency solution for wireless microphone accessories. These can typically be integrated into mobile devices and computers, in addition to supporting specialized commercial audio applications, voice announcement systems, and conference room wireless microphones.

Orosound Labs Innovation Division Accelerates AI-Enabled Hearables

January 5, 2024 by Joao Martins

Orosound Labs Innovation Division Accelerates AI-Enabled Hearables

Orosound, a company with patented signal processing and noise-canceling technologies, has unveiled Orosound Labs, its advanced innovation division that has operated sub rosa for the last couple of years. As the company stands at the forefront of AI-enabled active noise cancellation and reduction technologies that are ready to be embedded in consumer brand products, Orosound Labs is committed to empowering partners with a faster and more reliable way to introduce hearables with unique AI features to the market.

Lenbrook Media Group Created to Commercialize BluOS, MQA, and SCL6 Technologies

January 4, 2024 by Joao Martins

Lenbrook Media Group Created to Commercialize BluOS, MQA, and SCL6 Technologies

The Lenbrook Group of Companies, owner of NAD Electronics, PSB Speakers, Bluesound, and the renowned BluOS hi-res multiroom platform, has created a new business unit, Lenbrook Media Group. The mission is to more effectively enable the commercialization and development of Lenbrook's content management solutions, as well as pursue new licensing opportunities. With the BluOS content management platform at its core, this group will also oversee the growth of content encoding solutions MQA and SCL6, which Lenbrook acquired in the autumn of 2023.

Newauro Brings Smart Speakers Into the Immersive Audio Domain at CES 2024

January 4, 2024 by Joao Martins

Newauro Brings Smart Speakers Into the Immersive Audio Domain at CES 2024

In July 2022, the Saffelberg Investment group acquired all assets, teams and rights of AURO-3D and founded a new company, Newauro, with the intention to further support the growth of the format and technology suite across all markets. Based in Belgium like the original Auro Technologies company, Newauro announced that it's collaborating with Eastech to demonstrate its latest AURO-Scene virtual immersive audio technology at CES 2024.

Development & Design: The Impact of Microphone Specifications on Active Noise Cancellation Performance

January 3, 2024 by Nikolay Skovorodnikov

Development & Design: The Impact of Microphone Specifications on Active Noise Cancellation Performance

Active noise cancellation (ANC) is a popular feature for consumer electronics headsets, headphones, and earbuds. Designing effective ANC imposes particular specification requirements on audio chain components, including microphones. This article explains how to achieve better true wireless stereo ANC designs, offering valuable insights for this trending application.

Tymphany and Fraunhofer IIS Present Spatial Audio Reference Designs for Headphones and Speakers at CES 2024

January 2, 2024 by audioXpress Staff

Tymphany and Fraunhofer IIS Present Spatial Audio Reference Designs for Headphones and Speakers at CES 2024

Following the announcement that Tymphany partnered with the Fraunhofer Institute for Integrated Circuits (IIS) in Germany to provide new state-of-the-art spatial audio solutions to audio manufacturers, Tymphany now confirms that at the CES 2024 show in Las Vegas, the two companies will demonstrate new reference designs for both headphones and speakers. These demonstrations will take place at Suite #26336 of the Venetian.

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