All items tagged with product development (919)
Volumio Introduces Motivo Flagship Streamer, Transport and Headphone Amp
May 1, 2024 by Joao Martins

Volumio Introduces Motivo Flagship Streamer, Transport and Headphone Amp

Volumio, the Italian company that created the popular free music player, continues to invest in hardware and now announced the launch of a new flagship streamer and music player with a focus on user interface. Crafted to redefine the music experience, the Motivo streamer stands out with its 8" IPS multitouch display, being an integrated streamer\headphone amplifier based on the established ESS Sabre 9038 DAC and offering multiple I2S, USB, and S/PDIF digital outputs.
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A Look Inside Douglas Self’s "Small Signal Audio Design" 4th edition
April 3, 2024 by Jan Didden

A Look Inside Douglas Self’s "Small Signal Audio Design" 4th edition

Whether it is power amplifiers, vinyl reproduction preamplifiers, active crossover filters or, as in this case, small-signal circuits for a very wide range of applications, Douglas Self is one of those authors who consistently has produced reference works about technical audio. You may think that as a fourth edition, it would just be a refinement on the three editions that went before it but Self always adds new material and new insights to make it worthwhile to get this new book.
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Sonical and Sigma Connectivity Accelerate Hearables Product Development
April 2, 2024 by Joao Martins

Sonical and Sigma Connectivity Accelerate Hearables Product Development

Sonical, the company pioneering a fully integrated approach for the product development of headphones and hearables, with a real-time operating system that allows consumers to load their own apps has confirmed a development partnership with Sigma Connectivity, the leading Swedish technology design and engineering house. Sigma will help Sonical accelerate the market transition to Headphone 3.0 and the adoption of user driven wearable audio devices.
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VeriSilicon Now Offers Fully Compliant Bluetooth LE Audio IP Solutions
April 1, 2024 by Joao Martins

VeriSilicon Now Offers Fully Compliant Bluetooth LE Audio IP Solutions

VeriSilicon Microelectronics announced that its complete Bluetooth Low Energy (BLE) IP solution has achieved full LE Audio specification compliance, including certifications for the LE Audio protocol stack and Low Complexity Communications Codec (LC3). The Shanghai, China-based company is now able to offers manufacturers, ODMs and OEMs its own range of wireless audio and DSP solutions enabling higher quality audio streaming across various applications with lower power and cost.
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New Qualcomm S3 Gen 3 and Qualcomm S5 Gen 3 Sound Platforms Dramatically Expand Options for Mid-Tier Designs
March 26, 2024 by Joao Martins

New Qualcomm S3 Gen 3 and Qualcomm S5 Gen 3 Sound Platforms Dramatically Expand Options for Mid-Tier Designs

Qualcomm Technologies International announced the new Qualcomm S3 Gen 3 and Qualcomm S5 Gen 3 Sound Platforms, designed to allow OEMs deliver sound experiences never before possible at the S5 and S3 tiers. All Gen 3 devices support Bluetooth LE Audio and Auracast. The mid-tier S3 Gen 3 Sound Platform now allows customizations via 3rd party solutions from the Qualcomm Voice & Music Extension Program. And now there is a new quality option with aptX Lossless at 24-bit/48kHz.
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XMOS and DSP Concepts Partner to Accelerate Audio and Voice DSP Applications
March 25, 2024 by Joao Martins

XMOS and DSP Concepts Partner to Accelerate Audio and Voice DSP Applications

XMOS has announced a partnership with DSP Concepts, the company behind Audio Weaver. The UK AI and semiconductor experts have partnered with the Californian embedded audio software specialists to combine XMOS' highly-deterministic, low latency xcore.ai platform with DSP Concepts' Audio Weaver software. The combined solution enables developers to graphically design and debug audio and voice solutions utilizing multicores easily from one single canvas.
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Microchip Releases Qi v2.0 Standards-Compliant Wireless Dual-Pad Reference Design
March 20, 2024 by Cristina Costa

Microchip Releases Qi v2.0 Standards-Compliant Wireless Dual-Pad Reference Design

As major charger manufacturers, including those in the automotive industry, are working to implement Qi v2.0 (Qi2) standards, Microchip Technology has released a Qi2 dual-pad wireless power transmitter reference design. The new wireless dual-pad charging design - using fully-automotive qualified Microchip components - supports both Qi2's Extended Power Profile and Magnetic Power Profile with a single controller.
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Sustainability Drives New Peerless Audio HVS Speaker Series
March 19, 2024 by Joao Martins

Sustainability Drives New Peerless Audio HVS Speaker Series

Peerless Audio, the component business of Tymphany producing transducers since 1926, has announced the launch of its new HVS speaker series, intended to promote sustainable design practices that remain competitively priced. For the new HVS drivers Peerless significantly reduced the use of adhesives, replaced paper cones to prevent wastewater pollution, and minimized the use of rare earth materials, whilst maximizing meaningful acoustic performance, all while achieving comparable performance with improved audio consistency.
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Qualcomm S7 Pro, Micro-Power Wi-Fi, and XPAN Technology
March 14, 2024 by Joao Martins

Qualcomm S7 Pro, Micro-Power Wi-Fi, and XPAN Technology

Qualcomm S7 Pro, Micro-Power Wi-Fi, and XPAN Technology. An interview with John Turner, Senior Director, Product Management Voice and Music at Qualcomm Technologies International about the new Qualcomm S7 Pro platform that brings micro-power Wi-Fi and Bluetooth LE Audio to TWS earbuds. The same battery life, much better quality, high-res lossless audio, longer range, same user experience as Bluetooth on TWS earbuds. How does it work?
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Realtek Showcases Switchable Wi-Fi/Bluetooth Audio Solution at 2024 AWE China Expo
March 13, 2024 by Joao Martins

Realtek Showcases Switchable Wi-Fi/Bluetooth Audio Solution at 2024 AWE China Expo

Under the theme of "Realtek AI Changing the Future," the Taiwan semiconductor company will exhibit at the AWE China Expo (March 14-17, 2024), at the Shanghai New International Expo Centre (SNIEC). Showcasing the possibilities of AI in connected applications, Realtek will present a hybrid AIoT Audio SoC that supports both dual‑band Wi‑Fi 6 (2.4GHz/5GHz) and dual-mode Bluetooth 5.2 to enable low-latency, high resolution audio playback applications.
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