All items tagged with Bluetooth Low Energy (60)

Alif Semiconductor Now Sampling BLE and Matter Wireless Microcontroller with Neural Co-Processor for AI/ML Workloads

November 7, 2024 by Cristina Costa

Alif Semiconductor Now Sampling BLE and Matter Wireless Microcontroller with Neural Co-Processor for AI/ML Workloads

The Balletto Bluetooth MCU family was announced by Alif Semiconductor in April 2024, and the company is now sampling its development kit, the DK-B1, to enable rapid prototyping of products that require ultra-low power Bluetooth Low Energy or 802.15.4 wireless connectivity. The MCU is also the world's first BLE/Matter solution to feature a DSP engine and an NPU for efficient hardware acceleration of AI/ML workloads.

Bluetooth SIG Introduces Updated Specification for True Distance Awareness

September 3, 2024 by Joao Martins

Bluetooth SIG Introduces Updated Specification for True Distance Awareness

The Bluetooth Special Interest Group (SIG), the organization that oversees Bluetooth technology, announced the release of an updated specification that now includes Bluetooth Channel Sounding, a new secure, fine-ranging feature to enhance location abilities for Bluetooth connected devices. By enabling true distance awareness in billions of everyday devices, Bluetooth Channel Sounding opens countless possibilities for developers and users alike.

Ceva Bluetooth LE and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor’s Balletto Family of MCUs

July 23, 2024 by audioXpress Staff

Ceva Bluetooth LE and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor’s Balletto Family of MCUs

Ceva announced that Alif Semiconductor has licensed and deployed the Ceva-Waves Bluetooth Low Energy and 802.15.4 IPs in its Balletto family of wireless microcontrollers. The Balletto family is a complete Edge AI/ML microcontroller solution for wireless audio and smart home connected products with integrated Bluetooth Low Energy 5.3 and 802.15.4 (Matter) wireless subsystem and a dedicated network co-processor, enabling connectivity and class leading machine learning performance in a single chip.

Silicon Labs Streamlines Energy Harvesting Product Development for Battery-Free Wireless Connected Designs

April 22, 2024 by Cristina Costa

Silicon Labs Streamlines Energy Harvesting Product Development for Battery-Free Wireless Connected Designs

Silicon Labs has announced its most energy-efficient Wireless SoC to date with energy harvesting-ready capabilities. To signal Earth Day 2024, Silicon Labs launched its new xG22E family of Wireless SoCs, Silicon Labs' first-ever family designed to operate within the ultra-low power envelope required for battery-free, energy harvesting applications. The new family consists of the BG22E, MG22E, and FG22E, with "E" standing for "energy conservation."

VeriSilicon Now Offers Fully Compliant Bluetooth LE Audio IP Solutions

April 1, 2024 by Joao Martins

VeriSilicon Now Offers Fully Compliant Bluetooth LE Audio IP Solutions

VeriSilicon Microelectronics announced that its complete Bluetooth Low Energy (BLE) IP solution has achieved full LE Audio specification compliance, including certifications for the LE Audio protocol stack and Low Complexity Communications Codec (LC3). The Shanghai, China-based company is now able to offers manufacturers, ODMs and OEMs its own range of wireless audio and DSP solutions enabling higher quality audio streaming across various applications with lower power and cost.

IOT747 and AntennaWare Launch Reference Design for Wearable Applications

February 16, 2023 by Joao Martins

IOT747 and AntennaWare Launch Reference Design for Wearable Applications

IOT747, a Cambridge, UK-based supplier of wireless modules and solutions announced a partnership with AntennaWare, the Northern Ireland-based developer of Bluetooth and Ultra-Wideband (UWB) antenna solutions for wireless wearables. The partnership integrates AntennaWare BodyWave Antenna with the IDC737 Bluetooth module in an example reference design for long-range and wearable applications.

Specification Under Development Will Enable LC3plus High-Resolution Codec in Bluetooth LE Audio

December 7, 2022 by Joao Martins

Specification Under Development Will Enable LC3plus High-Resolution Codec in Bluetooth LE Audio

The Bluetooth LE Audio set of specifications, introducing the LC3 codec as the mandatory option for wireless audio streaming, is an important evolution compared to the current default SBC codec. Nevertheless, unlike the current Bluetooth Classic A2DP profile that specifies optional audio codecs, LE Audio didn't offer any options. A recent article in the Fraunhofer IIS blog confirms that a new specification is under development to allow support for the LC3plus high-resolution audio codec.

Bluetooth SIG Targets 6 GHz Frequency Band Mid-Band Spectrum Expansion Project

November 16, 2022 by audioXpress Staff

Bluetooth SIG Targets 6 GHz Frequency Band Mid-Band Spectrum Expansion Project

Following international trends and increasing use for Wi-Fi 6E, the Bluetooth Special Interest Group (SIG), the trade association that oversees Bluetooth technology, announced a new specification development project to define the operation of Bluetooth Low Energy (LE) in additional unlicensed mid-band spectrum, including the 6GHz frequency band. The new spectrum expansion project will help ensure that much needed Bluetooth performance enhancements can continue well into the future.

Microchip Announces New Arm-Based PIC with Built-in Bluetooth Low Energy Connectivity

October 19, 2022 by Cristina Costa

Microchip Announces New Arm-Based PIC with Built-in Bluetooth Low Energy Connectivity

Microchip Technology introduced its first Arm Cortex-M4F-based PIC microcontroller (MCU) family that solves basic wireless connectivity design challenges by integrating Bluetooth Low Energy functionality directly into one of a system’s most basic components, supported by one of the industry’s most comprehensive developer ecosystems. Microchip's new PIC32CX-BZ2 MCU family is available in SoCs QFN packages and complete PCB modules and antenna.

New High Quality, Low Latency Digital Wireless Transmission Solution Available from Audio Codecs

September 22, 2022 by Joao Martins

New High Quality, Low Latency Digital Wireless Transmission Solution Available from Audio Codecs

Audio Codecs, a new Belfast-based company and the developers of the Skylark digital audio data compression algorithm designed for low latency, joined forces with Virscient, a New Zealand based RF consultancy house, to launch a new wireless audio transmission module using Bluetooth Low Energy. The solution uses a Nordic Bluetooth LE SoC to transmit a 24-bit/48kHz high quality, low latency digital wireless microphone signal.

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