All items tagged with Bluetooth Low Energy (59)

First Bluetooth LE Audio Product on the Market Is From Sennheiser and Is a TV Transmitter Solution

August 18, 2022 by Joao Martins

First Bluetooth LE Audio Product on the Market Is From Sennheiser and Is a TV Transmitter Solution

Sennheiser - or better said, Sennheiser Hearing, the consumer division of Sonova - has leveraged the latest Bluetooth LE Audio technology and LC3 codec to update its TV Listening product portfolio. The Sennheiser RS 120-W wireless on-ear headphones are therefore the first in the market to support the updated Bluetooth specifications and offer no less than three different sound modes, working with advanced LE audio transmission to enhance one of the oldest concepts in the brand's portfolio.

SPARK Microsystems Shows Way-Forward for Wireless Audio Over UWB

July 28, 2022 by Joao Martins

SPARK Microsystems Shows Way-Forward for Wireless Audio Over UWB

SPARK Microsystems, a Canadian fabless semiconductor company specializing in next-generation ultra-wideband (UWB), has recently teamed up with the UWB Alliance, the international non-profit organization dedicated to the promotion and growth of UWB, in a joint effort to test the coexistence and aggregation capabilities of the technology in environments where other UWB or other wireless protocols and radio devices are in use. And wireless audio is among the most promising applications that SPARK Microsystems is testing over UWB.

Renesas Launches Highly Integrated Advanced Bluetooth Low Energy SoC

June 22, 2022 by Cristina Costa

Renesas Launches Highly Integrated Advanced Bluetooth Low Energy SoC

Renesas Electronics announced the SmartBond DA1470x Family of Bluetooth low energy (LE) solutions, which the Japanese corporation describes as "the world’s most advanced, integrated System-on-Chip (SoC) family for wireless connectivity." The new Renesas SmartBond DA1470x family features a small form factor with integrated applications and 2D graphics processors, voice activity detector and power management, enabling the development of very compact connected product designs.

Renesas Develops World's Smaller and Lower Power Bluetooth Low Energy RF Transceiver

February 25, 2022 by audioXpress Staff

Renesas Develops World's Smaller and Lower Power Bluetooth Low Energy RF Transceiver

Renesas Electronics announced the development of two 2.4 GHz RF transceiver technologies that support the Bluetooth Low Energy (LE) low-power, near-field communication standard. The new technologies also achieve a smaller mounting area and better power efficiency. Renesas presented these technologies at International Solid-State Circuits Conference 2022 (ISSCC 2022), held between February 20 and 24 in San Francisco.

Telit Launches WE310G4 Dual-Band Wi-Fi Module with BLE 5.0

January 28, 2022 by audioXpress Staff

Telit Launches WE310G4 Dual-Band Wi-Fi Module with BLE 5.0

Wireless connectivity specialists Telit announced the launch of their new WE310G4 module, which enables manufacturers to add dual-band Wi-Fi and Bluetooth Low Energy (BLE) 5.0 connectivity quickly and cost-effectively to their products. Based on Realtek's Ameba system on chip (SoC), the WE310G4 is ideal for a wide variety of embedded designs, including smart home devices and appliances, wearables, fitness trackers, smart city sensors, aftermarket telematics and industrial automation sensors.

ONsemi Expands Portfolio of Bluetooth LE Solutions With Innovative Smart Sensing Features

November 29, 2021 by Cristina Costa

ONsemi Expands Portfolio of Bluetooth LE Solutions With Innovative Smart Sensing Features

ONsemi (previously known as ON Semiconductor), a semiconductor manufacturer with a vast product portfolio of power, signal conditioning, interfaces, and sensing technologies, announced its new, secure RSL15 wireless microcontroller (MCU) that provides the industry’s lowest power consumption. Enabled with Bluetooth Low Energy 5.2 wireless connectivity, the RSL15 addresses the growing demand of connected applications requiring security without sacrificing power consumption.

World’s Smallest UWB and BLE Low-Power Module for Connected Devices

September 3, 2021 by Cristina Costa

World’s Smallest UWB and BLE Low-Power Module for Connected Devices

Murata has launched the world’s smallest ultra-wideband (UWB) module – measuring just 10.5 mm × 8.3 mm × 1.44 mm – that combines elevated levels of accuracy and reliability with low-power to ensure compact and battery-driven connected devices operate as efficiently and cost-effectively as possible. Using short-range radio frequency (RF) technology, the Type 2AB UWB + Bluetooth low-energy (BLE) connectivity module can be used in a wide variety of applications where precise detection is essential.

Sennheiser Introduces Evolution Wireless Digital Microphone Systems for Corporate and Education Spaces

June 1, 2021 by audioXpress Staff

Sennheiser Introduces Evolution Wireless Digital Microphone Systems for Corporate and Education Spaces

Sennheiser designed the new Evolution Wireless Digital, offering a professional wireless microphone system that is easier to use, based on an easy, app-based process, while retaining all the multi-channel capability and reliability that users have come to expect of UHF and 1G8 microphones. The different systems are ideal for corporations and schools were users have to setup audio for themselves.

Nordic Launches Apple Find My Network Compatible Software Development Kit

May 27, 2021 by audioXpress Staff

Nordic Launches Apple Find My Network Compatible Software Development Kit

Nordic Semiconductor announced the availability of its Apple Find My network compatible Software Development Kit (SDK). The SDK enables manufacturers and brands to easily build Find My network capable Bluetooth Low Energy (Bluetooth LE) devices that maximize battery performance leveraging Nordic’s nRF52 or nRF53 Series System-on-Chip's (SoC) ultra-low power consumption.

Toshiba Announces Smallest Bluetooth LE Module for Wearables Using Nordic’s nRF52811 SoC

May 18, 2021 by audioXpress Staff

Toshiba Announces Smallest Bluetooth LE Module for Wearables Using Nordic’s nRF52811 SoC

Nordic Semiconductor announced that Tokyo, Japan-based multinational conglomerate, Toshiba Corporation, has selected the 2.48 by 2.46mm wafer level chip scale package (WLCSP) version of Nordic’s nRF52811 Bluetooth Low Energy (Bluetooth LE) System-on-Chip (SoC) to provide the core processing power and wireless connectivity for its ‘Bluetooth module with SASP Technology’.

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