All items tagged with Bluetooth Low Energy (60)

Toshiba Announces Smallest Bluetooth LE Module for Wearables Using Nordic’s nRF52811 SoC

May 18, 2021 by audioXpress Staff

Toshiba Announces Smallest Bluetooth LE Module for Wearables Using Nordic’s nRF52811 SoC

Nordic Semiconductor announced that Tokyo, Japan-based multinational conglomerate, Toshiba Corporation, has selected the 2.48 by 2.46mm wafer level chip scale package (WLCSP) version of Nordic’s nRF52811 Bluetooth Low Energy (Bluetooth LE) System-on-Chip (SoC) to provide the core processing power and wireless connectivity for its ‘Bluetooth module with SASP Technology’.

Renesas Launches RX23W Module with Bluetooth for System Control and Wireless Communication on Connected Devices

April 9, 2021 by audioXpress Staff

Renesas Launches RX23W Module with Bluetooth for System Control and Wireless Communication on Connected Devices

Renesas Electronics Corporation introduced the RX23W Module with full Bluetooth 5.0 Low Energy support for system control and wireless communication on endpoint connected devices. Featuring the RX23W 32-bit RX MCU supporting fully integrated Bluetooth Low Energy communication, the new RX23W module is equipped with an antenna, oscillator and custom-matched circuit. A solution ready for the development of connected home appliances, healthcare and sports and fitness equipment.

CEVA Introduces Bluebud Turnkey IP Wireless Audio Platform for TWS Earbuds and Bluetooth Audio Devices

February 22, 2021 by Joao Martins

CEVA Introduces Bluebud Turnkey IP Wireless Audio Platform for TWS Earbuds and Bluetooth Audio Devices

CEVA unveiled Bluebud, a highly-integrated wireless audio platform aimed at standardizing DSP-enabled Bluetooth audio IP for fast-growing applications, including True Wireless Stereo (TWS) earbuds, hearables, gaming headsets, smartwatches and other wearable devices. The solution fully supports Bluetooth 5.2 and LE Audio design and is ready to support brands in the transition from Bluetooth Classic.

Renesas Acquires Dialog Semiconductor to Strengthen Leadership in Embedded Solutions

February 8, 2021 by audioXpress Staff

Renesas Acquires Dialog Semiconductor to Strengthen Leadership in Embedded Solutions

Japanese advanced semiconductor solutions manufacturer Renesas Electronics, and Dialog Semiconductor, an established supplier in power management, charging, AC/DC power conversion, Wi-Fi and Bluetooth low energy (BLE) technology solutions, announced they have reached an agreement towards an all-cash acquisition by Renesas of the entire capital of Dialog for EUR 67.50 per share, representing a total equity value of approximately EUR 4.9 billion (5.8 billion USD).

NXP Unveils New IW62X Family of 2x2 Wi-Fi 6 + Bluetooth Devices for Advanced Audio Applications and Connected Designs

October 9, 2020 by audioXpress Staff

NXP Unveils New IW62X Family of 2x2 Wi-Fi 6 + Bluetooth Devices for Advanced Audio Applications and Connected Designs

NXP Semiconductors announced its latest family of 2x2 Wi-Fi 6 (802.11ax) Dual Band + Bluetooth/BLE-Audio devices, designed to drive a new phase of connectivity innovation for all sorts of advanced audio, gaming and connected devices. Enabling the world’s first Wi-Fi 6 enabled gaming console (the new PlayStation 5), NXP’s optimized IW62X family of products will provide increased capacity, efficiency and performance for next-generation connectivity solutions including wireless speakers and all sorts of smart devices.

Amazon Reimagines Echo Smart Speaker Family for 2020

September 29, 2020 by Joao Martins

Amazon Reimagines Echo Smart Speaker Family for 2020

Amazon.com introduced its all-new line-up of Echo devices, featuring completely new designs, enhanced audio, more powerful hardware, and experiences that make Alexa voice assistant more engaging, and helpful. Most of the new Amazon products will be available at the end of October 2020, and that includes an all-new Echo (4th Gen), now with better sound and integrated smart home hub; the new Echo Dot and Echo Dot Kids Edition featuring the new spherical designs and improved audio, and Echo Show 10, the smart speaker with screen.

Bluetooth SIG to Begin Qualifying Products Using LC3 Codec

September 24, 2020 by Joao Martins

Bluetooth SIG to Begin Qualifying Products Using LC3 Codec

The Bluetooth Special Interest Group (SIG) announced it will start qualifying products using the LC3 Low Complexity Communication Codec, part of the new LE Audio Specification announced at CES 2020, back in January. Even though the organization doesn't expect the rest of the specifications that define all the use cases for LE Audio to be released before mid-year 2021, manufacturers are officially encouraged to start implementing the new Fraunhofer/Ericsson codec.

New Renesas RYZ012 Module Provides Multi-Standard Wireless Communication Supporting Bluetooth Low Energy 5 and IEEE802.15.4 Based Standards

August 6, 2020 by Cristina Costa

New Renesas RYZ012 Module Provides Multi-Standard Wireless Communication Supporting Bluetooth Low Energy 5 and IEEE802.15.4 Based Standards

Renesas Electronics announced sample shipment availability of the new RYZ012 Bluetooth module targeting ultra-low power applications in connected devices. The RYZ012 is Renesas' first Bluetooth Low Energy 5 module. It integrates a 2.4 GHz RF transceiver supporting the IEEE802.15.4 multi-standard wireless protocol, Bluetooth Low Energy (LE), Bluetooth LE Mesh, and ZigBee. The RYZ012 features a power draw of only 0.4µA during deep sleep (without SRAM retention) allowing developers to extend battery life.

Ambiq Micro Licenses CEVA’s Bluetooth Low Energy IP for Next-Generation SPOT Platforms

March 11, 2020 by audioXpress Staff

Ambiq Micro Licenses CEVA’s Bluetooth Low Energy IP for Next-Generation SPOT Platforms

CEVA announced that Ambiq Micro has licensed CEVA’s RivieraWaves Bluetooth low energy IP for use in its next-generation Subthreshold Power-Optimized Technology (SPOT) platforms integrating Bluetooth connectivity. CEVA’s Bluetooth low energy (BLE) IP is already powering Ambiq Micro’s Apollo3 Blue Family Wireless System-on-Chip (SoC), used in applications requiring intelligence everywhere, from wearables to animal trackers to smart home devices.

Goodix Licenses and Deploys CEVA Bluetooth Low Energy IP in SoCs Targeting Connected Devices

February 24, 2020 by Joao Martins

Goodix Licenses and Deploys CEVA Bluetooth Low Energy IP in SoCs Targeting Connected Devices

CEVA announced that Goodix Technology has licensed and deployed CEVA’s RivieraWaves Bluetooth low energy IP in its GR551x series of Bluetooth low energy System-on-Chip (SoCs). The GR551x series is designed to help users develop low-power Bluetooth-based products including smart mobile devices, wearables, and connected applications. Goodix just acquired NXP’s Voice and Audio Solutions (VAS) business.

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