All items tagged with Bluetooth Low Energy (62)

Ambiq Micro Licenses CEVA’s Bluetooth Low Energy IP for Next-Generation SPOT Platforms

March 11, 2020 by audioXpress Staff

Ambiq Micro Licenses CEVA’s Bluetooth Low Energy IP for Next-Generation SPOT Platforms

CEVA announced that Ambiq Micro has licensed CEVA’s RivieraWaves Bluetooth low energy IP for use in its next-generation Subthreshold Power-Optimized Technology (SPOT) platforms integrating Bluetooth connectivity. CEVA’s Bluetooth low energy (BLE) IP is already powering Ambiq Micro’s Apollo3 Blue Family Wireless System-on-Chip (SoC), used in applications requiring intelligence everywhere, from wearables to animal trackers to smart home devices.

Goodix Licenses and Deploys CEVA Bluetooth Low Energy IP in SoCs Targeting Connected Devices

February 24, 2020 by Joao Martins

Goodix Licenses and Deploys CEVA Bluetooth Low Energy IP in SoCs Targeting Connected Devices

CEVA announced that Goodix Technology has licensed and deployed CEVA’s RivieraWaves Bluetooth low energy IP in its GR551x series of Bluetooth low energy System-on-Chip (SoCs). The GR551x series is designed to help users develop low-power Bluetooth-based products including smart mobile devices, wearables, and connected applications. Goodix just acquired NXP’s Voice and Audio Solutions (VAS) business.

Rohde & Schwarz Presents Next Generation Test Solutions for Bluetooth Low Energy Up to Version 5.2

February 19, 2020 by audioXpress Staff

Rohde & Schwarz Presents Next Generation Test Solutions for Bluetooth Low Energy Up to Version 5.2

The Rohde & Schwarz CMW platform of Bluetooth testers already support the new Bluetooth Low Energy (LE) version 5.2 power control test routines. At the moment of release, these are the only T&M instruments that measure all specified RF tests up to Bluetooth LE 5.0 over the air, and are ready to support also the new LE Audio specification. This unique solution has already been submitted to the Bluetooth SIG for the specification of a new Bluetooth LE test mode.

Bluetooth SIG Unveils LE Audio, the Next Generation of Bluetooth Audio

January 7, 2020 by audioXpress Staff

Bluetooth SIG Unveils LE Audio, the Next Generation of Bluetooth Audio

At CES 2020, the Bluetooth Special Interest Group (SIG) announced the upcoming release of LE Audio, the next generation of Bluetooth audio. Two years on the making, Bluetooth LE Audio will enhance the performance of wireless audio, add support for hearing aids, and introduce Audio Sharing, a new use case with the potential to once again change the way we experience audio and connect with the world around us as Bluetooth did when it cut the cord 20 years ago to create the wireless audio market.

Qualcomm Introduces New Amazon Alexa Development Kit for Affordable Smart Home Products

October 31, 2019 by audioXpress Staff

Qualcomm Introduces New Amazon Alexa Development Kit for Affordable Smart Home Products

Qualcomm Technologies, a subsidiary of Qualcomm, announced a new development kit based on the Qualcomm QCA4020 multimode SoC that is qualified by Amazon’s Alexa Voice Service (AVS) for AWS IoT Core connected devices. The new Qualcomm Home Hub 100 kit supports Alexa Voice Service using a microcontroller (MCU) and Real-Time Operating System (RTOS) with Multimode Connectivity and adds to Qualcomm's’ line up of voice enabling products including kits that can allow OEMs to easily integrate Alexa into smart speakers and hearables.

Skyworks Enables Nordic Semiconductor High-efficiency, Long-Range Bluetooth Solutions

August 13, 2019 by audioXpress Staff

Skyworks Enables Nordic Semiconductor High-efficiency, Long-Range Bluetooth Solutions

High performance analog semiconductor and wireless networking manufacturer Skyworks Solutions announced that its advanced connectivity engines are being leveraged by Nordic Semiconductor for ultra-low power wireless communications. Specifically, Nordic is utilizing Skyworks’ family of fully-integrated front-end solutions in conjunction with their multi-protocol system-on-chip (SoC) for Bluetooth Low Energy (LE) and emerging Bluetooth 5 applications.

u-blox Acquires Rigado’s Bluetooth Modules Business

August 2, 2019 by audioXpress Staff

u-blox Acquires Rigado’s Bluetooth Modules Business

Swiss company u‑blox, a global provider of positioning and wireless communication technologies, announced it acquired Rigado’s Bluetooth modules business in an Asset Purchase Agreement. Rigado is an Oregon-based provider of Edge‑as‑a-Service gateway solutions for Commercial IoT applications, and began offering certified wireless modules in 2015, implementing Nordic Semiconductor’s nRF52840 Bluetooth Low Energy (Bluetooth LE) SoC.

Cypress Low-Power Bluetooth MCUs Extend Range and Battery Life in Voice and Audio Applications

April 15, 2019 by audioXpress Staff

Cypress Low-Power Bluetooth MCUs Extend Range and Battery Life in Voice and Audio Applications

Cypress Semiconductor announced two low-power, dual-mode Bluetooth 5.0 and Bluetooth Low Energy (BLE) microcontrollers (MCUs) that include support for Bluetooth mesh networking, and provide simultaneous Bluetooth 5.0 audio and BLE connections, delivering low-power wireless solutions that enable music and voice commands for battery-powered personal devices. With the new CYW20819 and CYW20820 MCUs, designers can also develop low-cost, low-power Bluetooth mesh network devices.

Bluetooth Low Energy Market Set to Triple by 2023, Reaching 1.6 Billion Device Shipments

April 5, 2019 by audioXpress Staff

Bluetooth Low Energy Market Set to Triple by 2023, Reaching 1.6 Billion Device Shipments

Bluetooth Low Energy (BLE) devices are forecasted to reach over 1.6 billion annual shipments by 2023 according to market research firm ABI Research. Increasing opportunities in smart home, beacons and asset tracking, emerging IoT applications, alongside growth in existing key markets and the emergence of audio over BLE will enable the technology to achieve a CAGR of 27% between 2018 and 2023, tripling in size.

Murata Announces Lowest Power Wi-Fi and Bluetooth 5 Combo Module for Portable Audio Applications

March 27, 2019 by audioXpress Staff

Murata Announces Lowest Power Wi-Fi and Bluetooth 5 Combo Module for Portable Audio Applications

Murata has collaborated with Cypress Semiconductor to develop the Type 1LV (CYW43012) solution that the company states is the lowest power, small form factor Wi-Fi and Bluetooth module currently available. This product improves battery life in wearables, smart home products, and portable audio applications. When comparing Type 1LV (CYW43012) to the previous Type 1DX (CYW4343W) solution, power usage is approximately 54 percent lower in DTIM 1, 60 percent in DTIM 3, up to 50 percent for 2.4 GHz RX, and 28 percent for 2.4 GHz TX.

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