This VeriSilicon IP solution is applicable to mobile phones, Bluetooth headphones and earphones including True Wireless Stereo (TWS) earbuds, speakers, and other audio application scenarios. The LE Audio declaration of conformity can be accessed on the Bluetooth SIG's website by searching for its Qualified Design ID (QDID: 206187).
VeriSilicon’s complete BLE IP solution for the LE Audio specification includes RF IP, baseband IP, software protocol stack, and has already passed the Bluetooth 5.3 certification. This solution leverages BLE technology, offering lower power consumption, and employs Isochronous Channels transmission technology for lower audio transmission latency and improved signal quality. Moreover, the solution also supports Bluetooth LE Audio capabilities such as Auracast broadcast audio and Multi-Stream Audio.
According to VeriSilicon, this complete BLE IP solution integrates the company's self-implemented LC3 codec that delivers real-time, low-power, and low-distortion audio processing. It supports various calculation precisions including 16-bit, 32-bit fixed-point processing, and 32-bit floating-point processing, while also accommodating all audio profiles of LE Audio, thus catering to diverse application scenarios.
The IP portfolio has been deeply optimized for VeriSilicon's ZSP Digital Signal Processor (DSP) and mainstream processors like Arm Cortex-M and RISC-V, minimizing memory and CPU resource usage, although it can be easily ported to other MCUs and DSPs. VeriSilicon’s LC3 can be licensed independently for flexible integration. When integrated with VeriSilicon's BLE controller and protocol stack, it can also provide manufacturers with a complete LE Audio hardware and software solution, streamlining the development process for high-performance audio products.
"Through years of dedicated work in Bluetooth technology, we have developed hardware reference designs and application software solutions tailored to different market demands based on our proprietary IPs and IoT embedded software platforms. Obtaining full LE Audio certification will further empower our customers to develop next-generation audio products more efficiently with reduced power consumption and costs, thus expediting product launches," says Wiseway Wang, Senior Vice President and General Manager of Custom Silicon Platform Division at VeriSilicon.
"Moving forward, VeriSilicon will explore new LE Audio application scenarios, bringing more comprehensive solutions to customers. We also look forward to seeing our customers launch more innovative LE Audio products by leveraging VeriSilicon’s solutions to jointly propel the advancement of Bluetooth audio technology and market."
Founded in 2001 and headquartered in Shanghai, China, VeriSilicon Microelectronics has 7 design and R&D centers in China and the United States, as well as 11 sales and customer service offices worldwide. VeriSilicon currently has more than 1,800 employees.
VeriSilicon developed a variety of customized silicon solutions, including high-definition video, high-definition audio and voice, in-vehicle infotainment, video surveillance, IoT connectivity, smart wearable, high-end application processor, video transcoding acceleration, intelligent pixel processing, etc. In addition, VeriSilicon has six categories of in-house processor IPs in its GPU, NPU, VPU, DSP, ISP, and Display Processor IP families, as well as more than 1,500 analog and mixed signal IPs and RF IPs.
www.verisilicon.com
