All items tagged with Bluetooth LE Audio (20)

CEVA Introduces Bluebud Turnkey IP Wireless Audio Platform for TWS Earbuds and Bluetooth Audio Devices

February 22, 2021 by Joao Martins

CEVA Introduces Bluebud Turnkey IP Wireless Audio Platform for TWS Earbuds and Bluetooth Audio Devices

CEVA unveiled Bluebud, a highly-integrated wireless audio platform aimed at standardizing DSP-enabled Bluetooth audio IP for fast-growing applications, including True Wireless Stereo (TWS) earbuds, hearables, gaming headsets, smartwatches and other wearable devices. The solution fully supports Bluetooth 5.2 and LE Audio design and is ready to support brands in the transition from Bluetooth Classic.

Qualcomm Announces QCC305x SoC Series for True Wireless Earbud Designs with Bluetooth LE Audio Support

December 16, 2020 by audioXpress Staff

Qualcomm Announces QCC305x SoC Series for True Wireless Earbud Designs with Bluetooth LE Audio Support

Qualcomm Technologies International, unveiled the Qualcomm QCC305x SoCs, designed specifically to help brands differentiate across a range of tiers in the very fast-moving truly wireless earbud category. The new SoCs are designed to meet demand for advanced wireless audio use cases, and enable end-to-end support for the new Bluetooth LE Audio standard. The QCC305x series also adds support for ultra-low-power digital ANC technology, Qualcomm Adaptive ANC, Qualcomm TrueWireless Mirroring, and wake word activated voice assistants.

CEVA Receives Bluetooth SIG Qualification for Its RivieraWaves Bluetooth Low Energy 5.2 Platform

November 23, 2020 by audioXpress Staff

CEVA Receives Bluetooth SIG Qualification for Its RivieraWaves Bluetooth Low Energy 5.2 Platform

CEVA announced that its RivieraWaves Bluetooth Low Energy (LE) 5.2 Platform has achieved Bluetooth SIG Qualification. As the first IP company to receive Bluetooth LE 5.2 qualification, CEVA enables its licensees to reduce their product development risk and so benefit with expedited time-to-market and end-product qualification process. Since September 2020, the Bluetooth Special Interest Group (SIG) started qualifying products using the new LE Audio Specification, announced in January 2020.

NXP Unveils New IW62X Family of 2x2 Wi-Fi 6 + Bluetooth Devices for Advanced Audio Applications and Connected Designs

October 9, 2020 by audioXpress Staff

NXP Unveils New IW62X Family of 2x2 Wi-Fi 6 + Bluetooth Devices for Advanced Audio Applications and Connected Designs

NXP Semiconductors announced its latest family of 2x2 Wi-Fi 6 (802.11ax) Dual Band + Bluetooth/BLE-Audio devices, designed to drive a new phase of connectivity innovation for all sorts of advanced audio, gaming and connected devices. Enabling the world’s first Wi-Fi 6 enabled gaming console (the new PlayStation 5), NXP’s optimized IW62X family of products will provide increased capacity, efficiency and performance for next-generation connectivity solutions including wireless speakers and all sorts of smart devices.

Bluetooth SIG to Begin Qualifying Products Using LC3 Codec

September 24, 2020 by Joao Martins

Bluetooth SIG to Begin Qualifying Products Using LC3 Codec

The Bluetooth Special Interest Group (SIG) announced it will start qualifying products using the LC3 Low Complexity Communication Codec, part of the new LE Audio Specification announced at CES 2020, back in January. Even though the organization doesn't expect the rest of the specifications that define all the use cases for LE Audio to be released before mid-year 2021, manufacturers are officially encouraged to start implementing the new Fraunhofer/Ericsson codec.

Apollo4 SoC Family from Ambiq Redefines Ultra-low Power in Wearables, Connected Devices and Always-on Voice-Processing

September 14, 2020 by audioXpress Staff

Apollo4 SoC Family from Ambiq Redefines Ultra-low Power in Wearables, Connected Devices and Always-on Voice-Processing

Ambiq unveiled its latest Apollo4 SoC family, enabling next generation endpoint devices with record-setting energy efficiency - running as low as 3µA/MHz - and new levels of performance. The new Apollo4 systems enable manufacturers to create leading-edge endpoint devices leveraging the unique SPOT platform with Ambiq’s easy-to-use, rich peripheral set. The Apollo4 is available now with CSP and BGA package offerings, as well as an Apollo4 Blue SoC with Bluetooth LE.

Fraunhofer IIS Licenses LC3 Audio Codec Software to Microsoft

July 10, 2020 by audioXpress Staff

Fraunhofer IIS Licenses LC3 Audio Codec Software to Microsoft

The Fraunhofer Institute for Integrated Circuits IIS announced the licensing of its LC3 software implementation to Microsoft Corp. LC3 (Low Complexity Communication Codec) is the audio codec adopted for Bluetooth LE Audio, a new audio architecture designed to boost the performance of Bluetooth Audio – for voice calls as well as for media playback including music. Following the news that Microsoft had licensed the xHE-AAC codec and MPEG-D DRC software implementation from Fraunhofer IIS, the addition of LC3 is a logic step.

Qualcomm Introduces Mobile Wireless Connectivity Chips with 6 GHz Wi-Fi 6E and Bluetooth 5.2

May 29, 2020 by audioXpress Staff

Qualcomm Introduces Mobile Wireless Connectivity Chips with 6 GHz Wi-Fi 6E and Bluetooth 5.2

Qualcomm Technologies, launched a flagship portfolio of mobile connectivity systems that represent the most advanced Wi-Fi 6E offerings of their kind. Building upon the company's existing Wi-Fi 6 and Bluetooth audio solutions, the new Qualcomm FastConnect 6900 and Qualcomm FastConnect 6700 systems feature the fastest available Wi-Fi speeds in the industry (up to 3.6 Gbps) on a mobile Wi-Fi offering, low latency and the latest Bluetooth 5.2 advancements delivering improved audio experiences for classic and emerging LE Audio use cases.

CEVA to Host Online Seminar Series for Wireless Connectivity, Bluetooth LE Audio, and Voice User Interfaces

May 27, 2020 by audioXpress Staff

CEVA to Host Online Seminar Series for Wireless Connectivity, Bluetooth LE Audio, and Voice User Interfaces

CEVA, a leading licensor of cutting-edge wireless connectivity and smart sensing technologies, announced that it will host a series of online seminars in June, exploring the benefits of including smart sensing and AI at the Edge in embedded designs, and the latest IoT and 5G cellular connectivity solutions. The “CEVA Technology Virtual Seminar 2020: Spring Edition” will be held over four dates, with each educational seminar focused on the challenges and trends in a specific technology domain, and hosted by CEVA product specialists and engineering experts.

Bluetooth LE Audio and LC3: Market Overview, Technology Trends and Forecast from SAR Insight & Consulting

March 19, 2020 by audioXpress Staff

Bluetooth LE Audio and LC3: Market Overview, Technology Trends and Forecast from SAR Insight & Consulting

Cinemas, gamers and the hard of hearing could all benefit from Bluetooth 5.2, according to the latest "Bluetooth LE Audio and LC3: Market Overview, Technology Trends and Forecast" report from SAR Insight & Consulting. Bluetooth will continue to be a popular and flexible way to connect devices, thanks in part to the technology being refreshed to remain relevant to component manufacturers and consumers, says SAR Insight & Consulting.

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