All items tagged with Bluetooth LE Audio (148)

MediaTek and Ceva Expand Spatial Audio Mobile Entertainment Experiences

January 9, 2025 by Joao Martins

MediaTek and Ceva Expand Spatial Audio Mobile Entertainment Experiences

Ceva and MediaTek announced a partnership to enhance the mobile entertainment experience, bringing the Ceva-RealSpace Elevate multichannel spatial audio with head tracking solution to the recently introduced MediaTek Dimensity 9400 flagship 5G smartphone chip using Bluetooth LE Audio. At CES 2025, Ceva demonstrated impressive spatial audio examples, creating a true-to-life listening experience beyond traditional stereo and surround sound systems on True Wireless Stereo (TWS) earbuds and headphones.

Creative and Mimi Join Forces to Elevate Personalized Audio

January 3, 2025 by Joao Martins

Creative and Mimi Join Forces to Elevate Personalized Audio

Creative Technology and Mimi have teamed up to offer more personalized audio options with the launch of the Aurvana Ace Mimi, the latest TWS earbuds to join the brand's Aurvana series. This collaboration offers users customized audio tuned to their unique hearing profiles, with the assurance that the xMEMS dual-driver system will respond accordingly without distortion. The Aurvana Ace Mimi also deliver LDAC high resolution audio support for the best audio experience on wireless earbuds.

Ceva Unveils First Multi-Protocol Wireless Connectivity Platform IP Featuring Next Generation Bluetooth High Data Throughput

January 2, 2025 by Joao Martins

Ceva Unveils First Multi-Protocol Wireless Connectivity Platform IP Featuring Next Generation Bluetooth High Data Throughput

Ceva announced the first complete multi-protocol wireless connectivity platform that supports Bluetooth High Data Throughput (HDT). This next generation technology meets the pressing need for Bluetooth devices looking to support streaming of even larger media at higher data rates. The new Ceva-Waves Links200 IP platform is designed to dramatically enhance wireless audio capabilities and support advanced applications like 7.1 audio systems.

Airoha Technology Launches Flagship Wireless AI Audio SoC

December 30, 2024 by Joao Martins

Airoha Technology Launches Flagship Wireless AI Audio SoC

Airoha Technology announced the launch of a new flagship wireless audio chip with integrated AI processing. The AB1595 chip integrates essential functions that currently require multiple chips into one single system-on-chip (SoC). The announcement follows a recent press conference where the MediaTek subsidiary confirmed its intention to lead the market as a Bluetooth audio supplier and to outgrow the industry with AI-powered solutions in 2025.

Synaptics Announces New Dual-Core Bluetooth 5.4 and Matter Veros SoC

December 16, 2024 by Joao Martins

Synaptics Announces New Dual-Core Bluetooth 5.4 and Matter Veros SoC

Synaptics expanded its Veros family of connectivity devices with the SYN20708 dual-core system on chip (SoC) for Bluetooth 5.4 and IEEE 802.15.4. The Matter-compliant SoC supports Bluetooth (BT) Classic, Bluetooth Low Energy (BLE), Zigbee, and Thread protocols concurrently on both cores, allowing simultaneous connections to multiple endpoints in heterogeneous network environments, with overall lower system cost.

StreamUnlimited Revamps Development Modules for Future-Proof Flexibility

December 3, 2024 by Joao Martins

StreamUnlimited Revamps Development Modules for Future-Proof Flexibility

As a leading engineering house for audio development, supplying software and hardware solutions for connected audio products, StreamUnlimited relies on a series of development modules that respond to all major application areas and form-factors. The company now reengineered its hardware modules to ensure extended longevity and that modules remain compatible with advancing technologies, enabling manufacturers to extend product lifecycles and provide greater value to end-users.

Bluetooth Wireless Audio, Innovations in Audio, and More in audioXpress December 2024

November 12, 2024 by audioXpress Staff

Bluetooth Wireless Audio, Innovations in Audio, and More in audioXpress December 2024

audioXpress December 2024 features a comprehensive report on Bluetooth LE Audio and Auracast, the suppliers and development ecosystem. Jonny McClintock adds insights on Ultra-Low Latency Audio Transmission over Bluetooth LE Audio. Plus three reviews of the QuantAsylum QA403 Audio Analyzer, the DPS-2 Power Supply and LNI-2 DC Filter and Stabilizer from RME Audio, and the SPL Phonitor 3 DAC, Headphone Amplifier and Monitor Controller. Hans Polak details his extensive experiments on Moving Magnet Cartridges.

Nordic Semiconductor Launches Next-Generation nRF54L Series Wireless SoCs

November 12, 2024 by Joao Martins

Nordic Semiconductor Launches Next-Generation nRF54L Series Wireless SoCs

The nRF54L wireless SoCs are one of the biggest product launches of the electronica 2024 show in Munich, and they redefine once again Nordic Semiconductor’s lead in ultra-low power wireless for connected devices. The new nRF54L Series includes the previously announced nRF54L15, and the new nRF54L10 and nRF54L05 wireless SoCs. This advanced product series offers significantly enhanced efficiency, exceptional processing power, and versatile design options to meet a growing range of Bluetooth LE applications, including LE Audio and Auracast products.

Alif Semiconductor Now Sampling BLE and Matter Wireless Microcontroller with Neural Co-Processor for AI/ML Workloads

November 7, 2024 by Cristina Costa

Alif Semiconductor Now Sampling BLE and Matter Wireless Microcontroller with Neural Co-Processor for AI/ML Workloads

The Balletto Bluetooth MCU family was announced by Alif Semiconductor in April 2024, and the company is now sampling its development kit, the DK-B1, to enable rapid prototyping of products that require ultra-low power Bluetooth Low Energy or 802.15.4 wireless connectivity. The MCU is also the world's first BLE/Matter solution to feature a DSP engine and an NPU for efficient hardware acceleration of AI/ML workloads.

Alango Unveils Sound Processing Module for Qualcomm S7 SoC

November 4, 2024 by Joao Martins

Alango Unveils Sound Processing Module for Qualcomm S7 SoC

Alango Technologies announced a new digital sound processing module for Qualcomm's Bluetooth SoCs, including the latest S7 Gen1 Sound platform that features five times the compute power, three times the DSP processing power, and almost 100 times on-device AI processing power compared to previous solutions. According to Alango, this first to market platform offers a pre-integrated, ready-to-use modular solution for the latest generation of hearables and advanced audio designs.

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