All items tagged with wearables (163)
Bose and Bragi Unite to Provide Brands with Turn-Key, Licensable Audio Solutions for Headphones and Earbuds 
August 28, 2024 by Special Content

Bose and Bragi Unite to Provide Brands with Turn-Key, Licensable Audio Solutions for Headphones and Earbuds 

Bose, a global leader in audio innovation for the home, car and on-the-go, and Bragi, the pioneer of AI headphones, have announced a partnership aimed at delivering cutting-edge, turn-key licensable audio wearable solutions – simplifying the process of building high-quality audio products for brands worldwide.
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Nordic Semiconductor Introduces Smaller nRF7002 Wi-Fi 6 Companion IC for Compact Designs
August 14, 2024 by Cristina Costa

Nordic Semiconductor Introduces Smaller nRF7002 Wi-Fi 6 Companion IC for Compact Designs

Nordic Semiconductor announced the launch of a Wafer-Level Chip Scale Package (WLCSP) version of its nRF7002 Wi-Fi 6 Companion IC. The new package option offers the same functionality as the nRF7002 QFN variant but with a footprint reduction of over 60 percent - making the WLCSP the ideal choice for efficient, size-constrained designs for next-generation wireless devices.
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TDK Makes InvenSense SmartSound T5848 I²S MEMS Microphone Available in Distribution Channels
June 28, 2024 by Joao Martins

TDK Makes InvenSense SmartSound T5848 I²S MEMS Microphone Available in Distribution Channels

Following a very successful presence at Sensors Converge 2024 in Santa Clara, CA (June 25-26), where TDK promoted its range of MEMS microphones and sensors, the company announced worldwide distribution of its InvenSense SmartSound T5848 bottom port I²S MEMS microphone. This device is ideal to enable intelligent keyword, voice command and sound detection applications in ultra-low power designs, such has hearables and wearables. Originally announced at CES 2022, this MEMS microphone only now is available for general distribution.
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Ceva Adds New TinyML Optimized NPUs to Enable Edge AI Everywhere
June 24, 2024 by audioXpress Staff

Ceva Adds New TinyML Optimized NPUs to Enable Edge AI Everywhere

Ceva, a leading licensor of silicon and software IP that enables edge devices to connect, sense and infer data more reliably and efficiently, announced that it has extended its Ceva-NeuPro family of NPUs. These meet growing demand for efficient and specialized AI applications at the Edge, where power and processing power is often limited, particularly in consumer products such as TWS earbuds, wearables, smart speakers, smart appliances, home automation devices, cameras, and more.
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TDK Introduces Ultra-Thin Noise Suppression Permalloy Sheets
May 21, 2024 by Joao Martins

TDK Introduces Ultra-Thin Noise Suppression Permalloy Sheets

TDK Corporation extended its Flexield family of permalloy thin film sheets with the new IPM01 series, which features high-permeability and high loss in a lightweight and 0.006 mm ultra-thin design. This new material made possible due to TDK's proprietary manufacturing method, effectively shields lower-frequency band noise, which is becoming a growing issue in electric vehicles (EVs). Mass production of the product began May 2024.
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World's First UWB Personal Wireless Audio Platform Features AntennaWare Technology
May 10, 2024 by Joao Martins

World's First UWB Personal Wireless Audio Platform Features AntennaWare Technology

Launched at High End 2024, Remora PRO is the world's first wireless audio device to deliver a reliable and robust experience for consumer and professional applications, including latency-critical uses. Based on the platform developed by Sonical with its CosmOS and “appable” software ecosystem, Remora PRO utilizes BodyWave antenna technology to make wireless Ultra Wideband (UWB) audio work flawlessly in a wearable and portable form-factor.
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Goodix Technology Launches Next Generation Smart Amplifier for Mobile Applications
April 8, 2024 by audioXpress Staff

Goodix Technology Launches Next Generation Smart Amplifier for Mobile Applications

Goodix Technology launched a new generation smart amplifier targeting mobile audio designs. The new TFA9865 device leverages a proprietary, fully digital architecture and advanced manufacturing processes to improve audio performance. With extremely compact dimensions of just 2.2x2.2mm², the TFA9865 audio amplifier establishes a benchmark for the audio industry, offering higher power efficiency, and enhanced sound volume with reduced noise.
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Sonical and Sigma Connectivity Accelerate Hearables Product Development
April 2, 2024 by Joao Martins

Sonical and Sigma Connectivity Accelerate Hearables Product Development

Sonical, the company pioneering a fully integrated approach for the product development of headphones and hearables, with a real-time operating system that allows consumers to load their own apps has confirmed a development partnership with Sigma Connectivity, the leading Swedish technology design and engineering house. Sigma will help Sonical accelerate the market transition to Headphone 3.0 and the adoption of user driven wearable audio devices.
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Novosound Secures Patent For Wireless Wearable Ultrasound Imaging Platform
March 26, 2024 by Joao Martins

Novosound Secures Patent For Wireless Wearable Ultrasound Imaging Platform

Scottish sensor technology Novosound has secured a patent for its ultrasonic instrumentation system, with the company recently launching its related Slanj platform targeted at the medical and wearable device sectors worldwide. The new ultrasound imaging patent underpins Novosound's first-mover advantage to initiate efforts in consumer health, including blood pressure monitoring for smartwatches.
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Diodes Announces Smallest in Class 2A Schottky Rectifiers
March 15, 2024 by audioXpress Staff

Diodes Announces Smallest in Class 2A Schottky Rectifiers

Diodes announced three new Schottky rectifiers that are able to achieve the industry's highest current densities in their class, addressing market demands for smaller and more powerful electronic systems. Well-suited for space-constrained portable, mobile, and wearable designs, these are the first 2A Schottky rectifiers to be designed within the X3-DSN1406-2 package. With a footprint of 0.84mm2, this makes them the industry’s smallest in their class.
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