All items tagged with wearables (171)
Silicon Labs Unveils BG29 Bluetooth LE Wireless SoC for Miniature Devices
March 12, 2025 by audioXpress Staff

Silicon Labs Unveils BG29 Bluetooth LE Wireless SoC for Miniature Devices

Silicon Labs announced its new Series 2 BG29 family of wireless SoCs, designed to bring high compute and connectivity to the smallest form factor Bluetooth Low Energy (LE) devices without compromising performance. A highly efficient, high memory, low-power, and ultra compact SoC designed for secure and high performance wireless networking applications, this new BG29 SoC is ideal for today's most intensive Bluetooth LE applications in wearables, health and medical devices, asset trackers, and battery-powered sensors.
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STMicroelectronics Reveals New STM32 Ultra-Low Power MCUs and Wireless Microcontrollers
March 5, 2025 by Joao Martins

STMicroelectronics Reveals New STM32 Ultra-Low Power MCUs and Wireless Microcontrollers

STMicroelectronics has introduced new STM32U3 microcontrollers (MCUs) with power-saving innovations that ease deployment of smart connected devices, especially in remote locations. The company has also unveiled the next generation of its STM32 power-efficient short-range wireless microcontrollers that simplify connecting consumer and industrial devices. The two new MCUs leverage near-threshold chip design to set a record performance-per-watt efficiency benchmark.
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China Audio Industry Association Promotes Global Audio Summit 2025
January 27, 2025 by Joao Martins

China Audio Industry Association Promotes Global Audio Summit 2025

The annual Global Audio Summit promoted by the China Audio Industry Association (CAIA) will be held at the Zhangjiang Science Hall in Shanghai, March 26-27, 2025. Promoting unique business opportunities for all, and a deeper understanding of the audio industry in China, the 2025 CAIA Global Audio Summit will be once again the most valuable knowledge and networking event for companies from all over the world.
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Sonde Health Integrates Voice-Based Health Monitoring Technology Into Qualcomm's Snapdragon S7+ Gen 1 Sound Platform
January 10, 2025 by Cristina Costa

Sonde Health Integrates Voice-Based Health Monitoring Technology Into Qualcomm's Snapdragon S7+ Gen 1 Sound Platform

A pioneer in voice-based health tracking, Sonde Health demonstrated the integration of vocal biomarker health tracking in small-footprint chipsets for hearing aids, earbuds, headphones, and other wearables. The solution, presented at CES 2025, delivers on the promise for voice-based health monitoring technology, benefiting from the convergence of voice artificial intelligence (AI) integrated into consumer earbuds.
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PIMIC and ZillTek Launch Integrated Edge AI and Microphone Noise Cancellation Solution
December 23, 2024 by Joao Martins

PIMIC and ZillTek Launch Integrated Edge AI and Microphone Noise Cancellation Solution

PIMIC, a new company working on ultra-low-power AI technology, unveiled the Clarity NC100, a Deep Neural Network (DNN)-based Environmental Noise Cancellation (ENC) chip that sets a new benchmark for performance and edge AI compute efficiency. Working in partnership with Taiwan-based MEMS microphone developer ZillTek, at CES 2025 the Californian company will present an integrated edge AI chip and digital microphone designed to address noise cancellation challenges in a single package.
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AAVAA Improves Hands-Free Accessibility on Apple Devices
November 18, 2024 by Joao Martins

AAVAA Improves Hands-Free Accessibility on Apple Devices

AAVAA, the Canadian company developing technology solutions to improve accessibility for individuals with disabilities, as well as enabling hands-free command and control in a variety of consumer and professional applications, has announced that its line of control devices is now compatible with macOS, iOS, and iPadOS. With this announcement, AAVAA expands on Apple’s own accessibility features with a hands-free control interface that requires minimal setup.
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Nordic Semiconductor Launches Next-Generation nRF54L Series Wireless SoCs
November 12, 2024 by Joao Martins

Nordic Semiconductor Launches Next-Generation nRF54L Series Wireless SoCs

The nRF54L wireless SoCs are one of the biggest product launches of the electronica 2024 show in Munich, and they redefine once again Nordic Semiconductor’s lead in ultra-low power wireless for connected devices. The new nRF54L Series includes the previously announced nRF54L15, and the new nRF54L10 and nRF54L05 wireless SoCs. This advanced product series offers significantly enhanced efficiency, exceptional processing power, and versatile design options to meet a growing range of Bluetooth LE applications, including LE Audio and Auracast products.
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Global Sources 2024 Hong Kong Shows With Record Number of Exhibitors and Less Visitors
November 5, 2024 by audioXpress Staff

Global Sources 2024 Hong Kong Shows With Record Number of Exhibitors and Less Visitors

The October 2024 Global Sources Hong Kong Shows at AsiaWorld-Expo have concluded after an intense month of activities. The three-phase show program, spanning multiple sectors including Consumer Electronics, Electronic Components, Smart Home, Lifestyle, Sports & Outdoor, and Baby & Children, attracted nearly 5,000 premium Asian suppliers and showcased over 500,000 innovative products, setting a new record for exhibitor participation.
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Bose and Bragi Unite to Provide Brands with Turn-Key, Licensable Audio Solutions for Headphones and Earbuds 
August 28, 2024 by Special Content

Bose and Bragi Unite to Provide Brands with Turn-Key, Licensable Audio Solutions for Headphones and Earbuds 

Bose, a global leader in audio innovation for the home, car and on-the-go, and Bragi, the pioneer of AI headphones, have announced a partnership aimed at delivering cutting-edge, turn-key licensable audio wearable solutions – simplifying the process of building high-quality audio products for brands worldwide.
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Nordic Semiconductor Introduces Smaller nRF7002 Wi-Fi 6 Companion IC for Compact Designs
August 14, 2024 by Cristina Costa

Nordic Semiconductor Introduces Smaller nRF7002 Wi-Fi 6 Companion IC for Compact Designs

Nordic Semiconductor announced the launch of a Wafer-Level Chip Scale Package (WLCSP) version of its nRF7002 Wi-Fi 6 Companion IC. The new package option offers the same functionality as the nRF7002 QFN variant but with a footprint reduction of over 60 percent - making the WLCSP the ideal choice for efficient, size-constrained designs for next-generation wireless devices.
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