All items tagged with wearables (157)

NGK Showcases Ultra-Thin EnerCera Batteries for Connected Devices and Powerfoyle-Based Position Tracker at electronica 2022

November 9, 2022 by Joao Martins

NGK Showcases Ultra-Thin EnerCera Batteries for Connected Devices and Powerfoyle-Based Position Tracker at electronica 2022

NGK Insulators will participate in electronica 2022 from November 15-18, in Munich, Germany for the first time. The Japanese multinational will use the opportunity to showcase its latest solar powered indoor/outdoor position tracker using Exeger's Powerfoyle technology, together with its latest EnerCera thin and flexible ceramic batteries, ideal for wearable and small connected devices, including headphones and portable audio applications.

AntennaWare Addresses Body Blocking Issues In The UWB Market

November 8, 2022 by Joao Martins

AntennaWare Addresses Body Blocking Issues In The UWB Market

Antennaware Ltd, a company that specializes in solving the body blocking problems normally associated with close range RF designs, has launched a new addition to its Bodywave antenna range that specifically targets the Ultra-Wideband (UWB) radio market. The company's latest antenna is specifically designed to elevate wearable performance by extending range and drastically reducing drop out.

Ubilite Introduces Wi-Fi SoC With Less-Than-Bluetooth Power Consumption

September 14, 2022 by Joao Martins

Ubilite Introduces Wi-Fi SoC With Less-Than-Bluetooth Power Consumption

Ubilite announced the immediate availability of its UBI206 platform and SoC, targeted specifically for ultra-low power wireless applications. The UBI206 is a highly integrated single device that enables a vast number of connected products with a minimal number of external components. Although originally designed targeting industrial IoT applications, the chip enables truly ultra-low power Wi-Fi audio streaming solutions with a 10-fold improvement in power consumption.

NFC Forum Defines Card Emulation Device Class Specification for Low-Cost Wearable Solutions

September 6, 2022 by Joao Martins

NFC Forum Defines Card Emulation Device Class Specification for Low-Cost Wearable Solutions

The NFC Forum unveiled a new NFC Device Class specification that provides device manufacturers and OEMs with a miniature, low-cost, sustainable solution for wireless wearable devices. The Card Emulation (CE) Device class is the first of its kind answering an industry need for wearable devices that provide basic functionality and longer battery life in a tiny footprint while maintaining interoperability with the current NFC ecosystem.

Worldwide Wearable Shipments Will Reach 344 Million by the End of 2022

August 12, 2022 by audioXpress Staff

Worldwide Wearable Shipments Will Reach 344 Million by the End of 2022

Demand for wearables and accessories slowed during 2021 due to economic and geopolitical factors impacting consumer's priorities. Despite this decline, global technology intelligence firm ABI Research expects continuous growth until 2027. More than 300 million wearables devices were shipped by the end of 2021 and will reach around 344 million by the end of this year. Additionally, more than 650 million of these devices are expected to be shipped worldwide by 2027, a CAGR of 13.2% between 2022 and 2027.

CEVA Celebrates 15 Billionth CEVA-powered Chip Shipped

August 9, 2022 by audioXpress Staff

CEVA Celebrates 15 Billionth CEVA-powered Chip Shipped

CEVA, Inc., the wireless connectivity and smart sensing technologies licensing company, announced that cumulative royalty-bearing chip shipments that include CEVA IP surpassed 15 billion units during the second quarter of 2022. This significant milestone has been achieved as CEVA approaches it’s 20-year anniversary of being a public company. While the first 10 billion CEVA-powered shipments spanned more than 15 years, the next 5 billion shipments took less than three and a half years.

Renesas and Cyberon Partner to Deliver Integrated Voice User Interface Solutions Supporting Over 40 Global Languages

June 30, 2022 by Joao Martins

Renesas and Cyberon Partner to Deliver Integrated Voice User Interface Solutions Supporting Over 40 Global Languages

Renesas Electronics, the advanced semiconductor solutions supplier, and Cyberon, a leading embedded speech solution provider, have partnered to deliver voice user interface (VUI) solutions using Renesas’ entire RA MCU line. Renesas RA customers will now have complimentary access to Cyberon’s industry-leading continuous command-based VUI toolchain, enabling them to add voice-recognition to a variety of endpoint applications, including home appliances and wearables.

Putting the Smart in Smart Devices - The Future of Hearables Is Voice Controlled

June 22, 2022 by Probal Lala

Putting the Smart in Smart Devices - The Future of Hearables Is Voice Controlled

To expand our readers' perspective on the topic of true wireless earbuds and hearables, defined as ear-worn electronic devices, this article discusses how hearable technology is at the intersection of wearables and headphones, and was designed for multi-purpose use, including voice transmission, sound amplification, and wireless communications. The CEO of Fluent.ai details how consumers' expectations for using earbuds everywhere, including for work communications in noisy public environments, is pushing technology to face the challenges at the source, on-device. This article was originally published in audioXpress, April 2022.

Texas Instruments Announces Affordable CC2340 Bluetooth LE Wireless MCUs

June 22, 2022 by audioXpress Staff

Texas Instruments Announces Affordable CC2340 Bluetooth LE Wireless MCUs

Texas Instruments expanded its connectivity portfolio with a new family of wireless microcontrollers (MCU) that enable high-quality Bluetooth Low Energy (LE) at half the price of typical competing devices. Featuring best-in-class standby current and radio-frequency (RF) performance, the SimpleLink Bluetooth LE CC2340 family is priced to start as low as $0.79, making it affordable for engineers to add Bluetooth LE connectivity to more products.

Renesas Launches Highly Integrated Advanced Bluetooth Low Energy SoC

June 22, 2022 by Cristina Costa

Renesas Launches Highly Integrated Advanced Bluetooth Low Energy SoC

Renesas Electronics announced the SmartBond DA1470x Family of Bluetooth low energy (LE) solutions, which the Japanese corporation describes as "the world’s most advanced, integrated System-on-Chip (SoC) family for wireless connectivity." The new Renesas SmartBond DA1470x family features a small form factor with integrated applications and 2D graphics processors, voice activity detector and power management, enabling the development of very compact connected product designs.

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