All items tagged with wearables (157)

TDK Announces T3902 Lowest-Power PDM MEMS Microphone

June 29, 2020 by audioXpress Staff

TDK Announces T3902 Lowest-Power PDM MEMS Microphone

TDK Corporation introduced the InvenSense T3902, which the company touts as the world’s lowest power Pulse Density Modulation (PDM) microphone for consumer devices. The new T3902 offers a high SNR of 64.5 dB, and high Acoustic Overload Point (AOP) of 120 dB in a very small package, optimized for mobile devices, wearables, headsets, TV remotes and more, supporting far-field communications, enabling clear audio capture in loud conditions, and ideal for voice recognition.

Nordic Unveils New Bluetooth 5.2 SoC Optimized for Compact, Two-Layer PCB Wireless Products

June 19, 2020 by audioXpress Staff

Nordic Unveils New Bluetooth 5.2 SoC Optimized for Compact, Two-Layer PCB Wireless Products

Nordic Semiconductor announced the nRF52805 Bluetooth 5.2 System-on-Chip (SoC), the seventh addition to its popular and proven nRF52 Series. The new nRF52805 SoC offers Bluetooth LE high-throughput 2 Mbps and enhanced Channel Selection Algorithm #2 for improved coexistence, and 2.4 GHz proprietary protocols for cost-constrained applications. This SoC is an ideal Bluetooth LE solution for high-volume, compact wireless applications.

Murata Develops Compact Multilayer Ceramic Capacitor

June 5, 2020 by audioXpress Staff

Murata Develops Compact Multilayer Ceramic Capacitor

Murata Manufacturing Co., Ltd. has developed the GRM011R60J104M multi-layer ceramic capacitor, which the company claims is the world’s first to feature a maximum capacitance of 0.1µF in 008004 inch size (0.25×0.125mm). Mass production of this new product is scheduled to begin in 2020. Applications can be valuable in wearables devices and compact audio players, among many other products that require large numbers of more compact capacitors.

Gesture-Controlled and Edge-AI In-Ear Headphones Joint Development Effort Funded in Sweden

June 3, 2020 by Joao Martins

Gesture-Controlled and Edge-AI In-Ear Headphones Joint Development Effort Funded in Sweden

Swedish companies Acconeer, Imagimob and Flexworks decided to join forces in a project to develop gesture-controlled in-ear headphones. Using the profound expertise of the three companies, the project will be a unique combination of research in advanced radar technology, expertise in AI (deep learning) and expertise in designing and manufacturing consumer electronics products. A first working prototype is expected within the first year of the project.

Cirrus Logic Launches Advanced Haptic and Sensing IC Solutions for Richer, Immersive User Experiences

May 28, 2020 by audioXpress Staff

Cirrus Logic Launches Advanced Haptic and Sensing IC Solutions for Richer, Immersive User Experiences

With the goal of elevating the user experience for a wide range of consumer devices, Cirrus Logic is leveraging its low-power, low-latency mixed-signal processing technology to develop an advanced product portfolio of haptic and sensing integrated circuits (ICs) that enable increased functionality and sleek buttonless designs for smartphones, PCs, wearables, gaming, virtual reality and automotive applications. Cirrus Logic’s haptic products and sophisticated haptic feedback technology enable sleeker, more robust end products with fewer mechanical controls for new responsive and immersive user experiences.

CEVA to Host Online Seminar Series for Wireless Connectivity, Bluetooth LE Audio, and Voice User Interfaces

May 27, 2020 by audioXpress Staff

CEVA to Host Online Seminar Series for Wireless Connectivity, Bluetooth LE Audio, and Voice User Interfaces

CEVA, a leading licensor of cutting-edge wireless connectivity and smart sensing technologies, announced that it will host a series of online seminars in June, exploring the benefits of including smart sensing and AI at the Edge in embedded designs, and the latest IoT and 5G cellular connectivity solutions. The “CEVA Technology Virtual Seminar 2020: Spring Edition” will be held over four dates, with each educational seminar focused on the challenges and trends in a specific technology domain, and hosted by CEVA product specialists and engineering experts.

Number of Voice Assistant Devices in Use to Reach 8.4 Billion

April 29, 2020 by audioXpress Staff

Number of Voice Assistant Devices in Use to Reach 8.4 Billion

A new report from Juniper Research has found that consumers will interact with voice assistants on over 8.4 billion devices by 2024; overtaking the world’s population and growing 113% compared to the 4.2 billion voice control devices expected to be in use by year end 2020. The value chain for voice assistants and interfaces is rapidly expanding to include more and more players, and device OEMs (from smartphones, speakers and wearables to cars and fridges), system integrators, apps developers and cloud providers are all escalating efforts to provide personalized voice solutions.

Next-Generation SIMO Power Management IC from Maxim Integrated Extends Battery Life for Wearables and Hearables

April 7, 2020 by audioXpress Staff

Next-Generation SIMO Power Management IC from Maxim Integrated Extends Battery Life for Wearables and Hearables

Designers of compact consumer devices like hearables can now slash solution size by half and extend battery life by 20 percent with the MAX77654 single inductor, multiple output (SIMO) power management IC (PMIC) from Maxim Integrated Products. The breakthrough new SIMO technology replaces traditional power management architectures for the most demanding designs in wearables and personal audio devices, reducing BOM count by up to 40 percent, with 23 percent lower BOM cost compared to discrete solutions.

Ambiq Micro Licenses CEVA’s Bluetooth Low Energy IP for Next-Generation SPOT Platforms

March 11, 2020 by audioXpress Staff

Ambiq Micro Licenses CEVA’s Bluetooth Low Energy IP for Next-Generation SPOT Platforms

CEVA announced that Ambiq Micro has licensed CEVA’s RivieraWaves Bluetooth low energy IP for use in its next-generation Subthreshold Power-Optimized Technology (SPOT) platforms integrating Bluetooth connectivity. CEVA’s Bluetooth low energy (BLE) IP is already powering Ambiq Micro’s Apollo3 Blue Family Wireless System-on-Chip (SoC), used in applications requiring intelligence everywhere, from wearables to animal trackers to smart home devices.

MagnaChip Launches New MOSFET to Enhance Protection for Wireless Earphones While Recharging

February 25, 2020 by audioXpress Staff

MagnaChip Launches New MOSFET to Enhance Protection for Wireless Earphones While Recharging

MagnaChip Semiconductor, a designer and manufacturer of analog and mixed-signal semiconductor products from South Korea, announced the company is entering the wireless earphone market with the introduction of a new MOSFET solution that helps preventing the battery in these wireless devices from overcharging. This MOSFET is designed to control excessive current flowing into wireless earphones while recharging the battery in order to protect wireless earphones from being damaged.

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