All items tagged with always-on (21)

H&S HighTech Invests in AONDevices and Becomes Preferred Distributor in Korea and Key Global Markets

July 4, 2025 by Joao Martins

H&S HighTech Invests in AONDevices and Becomes Preferred Distributor in Korea and Key Global Markets

AONDevices received a strategic investment from H&S HighTech Corp., a semiconductor manufacturer and electronics distribution company from South Korea. H&S HighTech will also serve as AONDevices' preferred distributor and strategic partner across Korea and select international markets. The two companies want to accelerate adoption of next-gen AI with smarter, ultra-efficient devices powered by AON’s tiny AI chips.

ONiO Selects Exeger Powerfoyle Solar Cell Technology to Create Devices That Are 100% Battery-Free

December 21, 2023 by Joao Martins

ONiO Selects Exeger Powerfoyle Solar Cell Technology to Create Devices That Are 100% Battery-Free

ONiO, a pioneer in the development of advanced batteryless microcontrollers that can efficiently harness power from a wide range of sources, announced a strategic partnership with Exeger. ONiO chooses Powerfoyle as their preferred solar cell technology for product integration and will combine advanced microcontrollers with solar technology, driving forward the development of sustainable, low-maintenance electronics that are ready for immediate operation.

Dolphin Design Unveils Innovative IP for Sound Classification Reducing Power Requirements by 99%

June 27, 2023 by audioXpress Staff

Dolphin Design Unveils Innovative IP for Sound Classification Reducing Power Requirements by 99%

Dolphin Design, a semiconductor designer of power management, audio, and processing devices with in-house ASIC design services, announced the launch of WhisperExtractor, a mixed-signal technology for voice and audio-enabled SoCs, enabling voice and sound classification at a record µW level power budget. The new technology paves the way to breakthrough always-on voice user interface, real time speech-to-text, and always-on sound detection.

TDK InvenSense Low-Power T5838 MEMS Microphones Selected for Edge AI Development Kit

June 22, 2023 by Joao Martins

TDK InvenSense Low-Power T5838 MEMS Microphones Selected for Edge AI Development Kit

The latest low-power T5838 and T5837 digital PDM MEMS microphones, part of the TDK InvenSense SmartSound family, have been elected by Syntiant as a microphone of choice for low-power edge AI application processors that perform keyword detection, due to its innovative Acoustic Activity Detect (AAD) feature that enables system power savings, thus prolonging battery life, and ability to intelligently detect keywords or voice commands.

XMOS Announces xcore-voice Next-Generation Solution for Smart Voice Applications

April 3, 2023 by audioXpress Staff

XMOS Announces xcore-voice Next-Generation Solution for Smart Voice Applications

XMOS announced xcore-voice: a complete voice solution built on its xcore platform hardware, software and tools. xcore-voice leverages xcore.ai crossover processor, the third-generation of XMOS’ xcore architecture, combining high performance AI, DSP, I/O and control in a single economical device. The solution provides voice pipeline example designs using XMOS industry-proven audio front-end, incorporating far-field processing and support for third party ISV voice algorithms.

Syntiant Launches NDP115 Neural Decision Processor for Always-On Speech and Sensor-Fusion

February 14, 2023 by Joao Martins

Syntiant Launches NDP115 Neural Decision Processor for Always-On Speech and Sensor-Fusion

It was one of the key audio-related demonstrations at the Syntiant suite during CES 2023, and the new NDP115 Neural Decision Processor is now positioned as a key strategic platform for new compact, ultra-low-power designs with always-on voice and sensor fusion applications. The newest addition to Syntiant's family of special purpose silicon is built using the company’s Syntiant Core 2 inference engine that can run multiple neural network loads at under 1mW.

TDK Introduces New SmartSound MEMS Microphones and Development Platform Plus VibeSense360 Solution Suite for TWS Designs

January 13, 2023 by Joao Martins

TDK Introduces New SmartSound MEMS Microphones and Development Platform Plus VibeSense360 Solution Suite for TWS Designs

At CES 2023, TDK InvenSense introduced the T5838 and T5837 PDM MEMS microphones that offer 68 dBA SNR consuming only 130 µA in always-on mode and 330 µA in high-performance mode. The company also announced the new SmartSound One development platform that provides a plug-and-play evaluation interface for its MEMS microphones, and the new VibeSense360 hardware and software solution suite for advanced true wireless stereo features.

Syntiant Partners with Telink and Murata to Present New Edge AI Audio Solutions at CES 2023

December 26, 2022 by Joao Martins

Syntiant Partners with Telink and Murata to Present New Edge AI Audio Solutions at CES 2023

Syntiant is heading to CES 2023 with an exciting range of announcements and presentations of end-to-end edge AI solutions for always-on applications. The company will unveil a new reference design created in partnership with Telink that will enable ODMs and OEMs to easily and quickly deploy complete, ultra-low-power, deep learning voice processing applications in remote controls. Another major announcement is the launch of the Murata Type2DA neural decision processor module for edge AI audio and sensor applications.

Silicon Labs Extends Portfolio for Matter and Wi-Fi at Developer Conference

September 16, 2022 by Joao Martins

Silicon Labs Extends Portfolio for Matter and Wi-Fi at Developer Conference

Silicon Labs announced a slate of new multiprotocol connectivity products that are driven by interoperability, advancing innovations in the Internet of Things and Smart Home, including Matter and Wi-Fi 6. Standing out among the announcements is the new low power SiWx917 Wi-Fi 6 and Bluetooth LE combination SoC that Silicon Labs says is Matter-ready. The SoC includes an integrated applications processor, and is ideal for battery-powered or energy-efficient connected devices with always-on cloud connectivity.

Renesas Launches Highly Integrated Advanced Bluetooth Low Energy SoC

June 22, 2022 by Cristina Costa

Renesas Launches Highly Integrated Advanced Bluetooth Low Energy SoC

Renesas Electronics announced the SmartBond DA1470x Family of Bluetooth low energy (LE) solutions, which the Japanese corporation describes as "the world’s most advanced, integrated System-on-Chip (SoC) family for wireless connectivity." The new Renesas SmartBond DA1470x family features a small form factor with integrated applications and 2D graphics processors, voice activity detector and power management, enabling the development of very compact connected product designs.

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