TDK Introduces Lowest Pulse Density Modulation Multi-Mode MEMS Microphone With Acoustic Activity Detect

InvenSense, a TDK Group company, announced a comprehensive portfolio of new technology solutions during the 2021 Consumer Electronics Showcase. Among the expanded MEMS portfolio, the new T5838 SmartSound MEMS microphone offers a low power mode of just 130uAmps and a high-quality mode of 330uAmps, while supporting a dynamic range of 68dN SNR and 133dB AOP at 20kHz bandwidth. Optimized for smartphones, microphone arrays, smart speakers, and headsets, the T5838 supports configurable wake-on-sound at power levels as low as 20 µA.

CEVA and Fluent.ai, a leading provider of on-device, multilingual speech understanding solutions, announced a partnership to offer ultra-low power speech-to-intent solutions for intelligent edge devices. Fluent.ai’s suite of speech-to-intent technologies has been ported and optimized for CEVA’s low power audio and sensor hub DSPs, providing a high performance, robust solution for OEMs and ODMs looking to integrate intelligent voice activation and control into their wearables, consumer devices and IoT products.

Ambiq unveiled its latest Apollo4 SoC family, enabling next generation endpoint devices with record-setting energy efficiency - running as low as 3µA/MHz - and new levels of performance. The new Apollo4 systems enable manufacturers to create leading-edge endpoint devices leveraging the unique SPOT platform with Ambiq’s easy-to-use, rich peripheral set. The Apollo4 is available now with CSP and BGA package offerings, as well as an Apollo4 Blue SoC with Bluetooth LE.

Syntiant, a California-based AI chip company focused on moving machine learning from the cloud to edge devices, announced a partnership with Infineon Technologies, to service the rising demand for voice user interface (VUI) in electronic devices. Optimized for battery-powered devices from true wireless earbuds to mobile phones to smart speakers, Syntiant’s partnership with Infineon enables more efficient voice control and custom command detection to numerous product configurations.

QuickLogic, the developer of ultra-low power multi-core voice-enabled SoCs, embedded FPGA IP, and Endpoint AI solutions, announced the launch of its EOS S3AI platform for endpoint Artificial Intelligence (AI) and Machine Learning (ML) applications. The new AI platform provides all the hardware blocks needed to enable low power AI at the connected device endpoint. It comes with time-series (continuous) sensors, including accelerometer / gyroscope / magnetometer motion sensors and two digital microphones (PDMs).