All items tagged with connected devices (137)
Synaptics Brings Astra AI-Native Platform to CES 2025
December 18, 2024 by Joao Martins

Synaptics Brings Astra AI-Native Platform to CES 2025

Following earlier demonstrations at trade shows all over the world, Synaptics will showcase its Astra AI-Native processing and Veros intelligent connectivity offerings at CES 2025. Synaptics Astra AI-native platform showcases the advantages of purpose-built hardware paired with an open-source development framework, and intelligent connectivity to enable rapid development of context-aware connected devices.
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AONDevices Unveils Edge AI Sensor Module in Collaboration with P-Logic Consulting
December 16, 2024 by Joao Martins

AONDevices Unveils Edge AI Sensor Module in Collaboration with P-Logic Consulting

AONDevices announced the launch of its AONix Edge AI sensor module, a new platform that addresses key challenges for battery-operated connected devices running artificial intelligence on the edge. Developed in collaboration with P-Logic Consulting and featuring sensor integration from TDK InvenSense, this compact 32mm x 32mm module is an energy-efficient platform with the ability to deliver real-time AI performance in always-on applications, particularly for consumer electronics.
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StreamUnlimited Revamps Development Modules for Future-Proof Flexibility
December 3, 2024 by Joao Martins

StreamUnlimited Revamps Development Modules for Future-Proof Flexibility

As a leading engineering house for audio development, supplying software and hardware solutions for connected audio products, StreamUnlimited relies on a series of development modules that respond to all major application areas and form-factors. The company now reengineered its hardware modules to ensure extended longevity and that modules remain compatible with advancing technologies, enabling manufacturers to extend product lifecycles and provide greater value to end-users.
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STMicroelectronics and Qualcomm Enter Strategic Collaboration for Edge AI Wireless Connected Devices
October 1, 2024 by Cristina Costa

STMicroelectronics and Qualcomm Enter Strategic Collaboration for Edge AI Wireless Connected Devices

STMicroelectronics and Qualcomm Technologies International, announces a new strategic collaboration for the next generation of industrial and consumer connected solutions augmented by edge AI. The collaboration will pair STMicroelectronics' STM32 microcontroller ecosystem and Qualcomm's wireless connectivity solutions to allow simple, fast, and cost-effective designs of next-generation connected applications.
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Bluetooth SIG Introduces Updated Specification for True Distance Awareness
September 3, 2024 by Joao Martins

Bluetooth SIG Introduces Updated Specification for True Distance Awareness

The Bluetooth Special Interest Group (SIG), the organization that oversees Bluetooth technology, announced the release of an updated specification that now includes Bluetooth Channel Sounding, a new secure, fine-ranging feature to enhance location abilities for Bluetooth connected devices. By enabling true distance awareness in billions of everyday devices, Bluetooth Channel Sounding opens countless possibilities for developers and users alike.
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Nordic Semiconductor Introduces Smaller nRF7002 Wi-Fi 6 Companion IC for Compact Designs
August 14, 2024 by Cristina Costa

Nordic Semiconductor Introduces Smaller nRF7002 Wi-Fi 6 Companion IC for Compact Designs

Nordic Semiconductor announced the launch of a Wafer-Level Chip Scale Package (WLCSP) version of its nRF7002 Wi-Fi 6 Companion IC. The new package option offers the same functionality as the nRF7002 QFN variant but with a footprint reduction of over 60 percent - making the WLCSP the ideal choice for efficient, size-constrained designs for next-generation wireless devices.
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Particle Unveils Tachyon, a Qualcomm Snapdragon-Powered, 5G, AI-Enabled Single-Board Computer
July 31, 2024 by Joao Martins

Particle Unveils Tachyon, a Qualcomm Snapdragon-Powered, 5G, AI-Enabled Single-Board Computer

Particle, a company from San Francisco focused on edge-to-cloud connectivity and platforms, has launched Tachyon, its first Qualcomm Snapdragon-powered single-board computer (SBC), comprising a powerful NPU for AI/ML workloads, built-in high-bandwidth cellular 5G and Wi-Fi 6E connectivity, and a Linux-powered Ubuntu operating system. The board is now available for pre-order on Kickstarter starting at $149.
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Ceva Adds New TinyML Optimized NPUs to Enable Edge AI Everywhere
June 24, 2024 by audioXpress Staff

Ceva Adds New TinyML Optimized NPUs to Enable Edge AI Everywhere

Ceva, a leading licensor of silicon and software IP that enables edge devices to connect, sense and infer data more reliably and efficiently, announced that it has extended its Ceva-NeuPro family of NPUs. These meet growing demand for efficient and specialized AI applications at the Edge, where power and processing power is often limited, particularly in consumer products such as TWS earbuds, wearables, smart speakers, smart appliances, home automation devices, cameras, and more.
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Teledyne LeCroy's Frontline X500e Wireless Sniffer Captures Wi-Fi 7, Bluetooth, and 802.15.4 Traffic Simultaneously
April 12, 2024 by Joao Martins

Teledyne LeCroy's Frontline X500e Wireless Sniffer Captures Wi-Fi 7, Bluetooth, and 802.15.4 Traffic Simultaneously

Teledyne LeCroy is enabling the development of the latest wireless devices and connected applications with the launch of the Frontline X500e wireless protocol analyzer with Wi-Fi 7. For any application involving Bluetooth, Wi-Fi, 802.15.4-based technologies (including Matter, Thread, and Zigbee), or wired interfaces such as HCI-UART, USB, SPI, and Audio I2S, the X500e delivers precise insights for network professionals.
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Ceva Accelerates Enhanced Connectivity with Multiprotocol Wireless Platform IP Family
April 8, 2024 by audioXpress Staff

Ceva Accelerates Enhanced Connectivity with Multiprotocol Wireless Platform IP Family

Ceva announced Ceva-Waves Links, a new family of multiprotocol wireless platform IPs that delivers fully integrated connectivity solutions with Wi-Fi, Bluetooth, UWB, Thread, Zigbee, and Matter, simplifying development and accelerating time to market for next generation, connectivity-rich, MCUs and SoCs. Ceva-Waves Links100, a connectivity platform IP with RF implemented on TSMC 22nm is currently being deployed by a leading OEM in connected devices.
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