All items tagged with connected devices (134)

STMicroelectronics and Qualcomm Enter Strategic Collaboration for Edge AI Wireless Connected Devices

October 1, 2024 by Cristina Costa

STMicroelectronics and Qualcomm Enter Strategic Collaboration for Edge AI Wireless Connected Devices

STMicroelectronics and Qualcomm Technologies International, announces a new strategic collaboration for the next generation of industrial and consumer connected solutions augmented by edge AI. The collaboration will pair STMicroelectronics' STM32 microcontroller ecosystem and Qualcomm's wireless connectivity solutions to allow simple, fast, and cost-effective designs of next-generation connected applications.

Bluetooth SIG Introduces Updated Specification for True Distance Awareness

September 3, 2024 by Joao Martins

Bluetooth SIG Introduces Updated Specification for True Distance Awareness

The Bluetooth Special Interest Group (SIG), the organization that oversees Bluetooth technology, announced the release of an updated specification that now includes Bluetooth Channel Sounding, a new secure, fine-ranging feature to enhance location abilities for Bluetooth connected devices. By enabling true distance awareness in billions of everyday devices, Bluetooth Channel Sounding opens countless possibilities for developers and users alike.

Nordic Semiconductor Introduces Smaller nRF7002 Wi-Fi 6 Companion IC for Compact Designs

August 14, 2024 by Cristina Costa

Nordic Semiconductor Introduces Smaller nRF7002 Wi-Fi 6 Companion IC for Compact Designs

Nordic Semiconductor announced the launch of a Wafer-Level Chip Scale Package (WLCSP) version of its nRF7002 Wi-Fi 6 Companion IC. The new package option offers the same functionality as the nRF7002 QFN variant but with a footprint reduction of over 60 percent - making the WLCSP the ideal choice for efficient, size-constrained designs for next-generation wireless devices.

Particle Unveils Tachyon, a Qualcomm Snapdragon-Powered, 5G, AI-Enabled Single-Board Computer

July 31, 2024 by Joao Martins

Particle Unveils Tachyon, a Qualcomm Snapdragon-Powered, 5G, AI-Enabled Single-Board Computer

Particle, a company from San Francisco focused on edge-to-cloud connectivity and platforms, has launched Tachyon, its first Qualcomm Snapdragon-powered single-board computer (SBC), comprising a powerful NPU for AI/ML workloads, built-in high-bandwidth cellular 5G and Wi-Fi 6E connectivity, and a Linux-powered Ubuntu operating system. The board is now available for pre-order on Kickstarter starting at $149.

Ceva Adds New TinyML Optimized NPUs to Enable Edge AI Everywhere

June 24, 2024 by audioXpress Staff

Ceva Adds New TinyML Optimized NPUs to Enable Edge AI Everywhere

Ceva, a leading licensor of silicon and software IP that enables edge devices to connect, sense and infer data more reliably and efficiently, announced that it has extended its Ceva-NeuPro family of NPUs. These meet growing demand for efficient and specialized AI applications at the Edge, where power and processing power is often limited, particularly in consumer products such as TWS earbuds, wearables, smart speakers, smart appliances, home automation devices, cameras, and more.

Teledyne LeCroy's Frontline X500e Wireless Sniffer Captures Wi-Fi 7, Bluetooth, and 802.15.4 Traffic Simultaneously

April 12, 2024 by Joao Martins

Teledyne LeCroy's Frontline X500e Wireless Sniffer Captures Wi-Fi 7, Bluetooth, and 802.15.4 Traffic Simultaneously

Teledyne LeCroy is enabling the development of the latest wireless devices and connected applications with the launch of the Frontline X500e wireless protocol analyzer with Wi-Fi 7. For any application involving Bluetooth, Wi-Fi, 802.15.4-based technologies (including Matter, Thread, and Zigbee), or wired interfaces such as HCI-UART, USB, SPI, and Audio I2S, the X500e delivers precise insights for network professionals.

Ceva Accelerates Enhanced Connectivity with Multiprotocol Wireless Platform IP Family

April 8, 2024 by audioXpress Staff

Ceva Accelerates Enhanced Connectivity with Multiprotocol Wireless Platform IP Family

Ceva announced Ceva-Waves Links, a new family of multiprotocol wireless platform IPs that delivers fully integrated connectivity solutions with Wi-Fi, Bluetooth, UWB, Thread, Zigbee, and Matter, simplifying development and accelerating time to market for next generation, connectivity-rich, MCUs and SoCs. Ceva-Waves Links100, a connectivity platform IP with RF implemented on TSMC 22nm is currently being deployed by a leading OEM in connected devices.

Knowles Precision Devices Introduces Three-Cell Supercapacitors

March 12, 2024 by audioXpress Staff

Knowles Precision Devices Introduces Three-Cell Supercapacitors

Knowles Precision Devices, a segment of Knowles Corporation announced that its latest EDLC (Electric Double Layer Capacitor) supercapacitor modules are now available. Based on Knowles' Cornell Dubilier brand DGH and DSF Series supercapacitors, these new cutting-edge capacitors use a three-cell package for higher operating voltages (at up to 9 WVDC) and allow for printed circuit board space savings.

ONiO Selects Exeger Powerfoyle Solar Cell Technology to Create Devices That Are 100% Battery-Free

December 21, 2023 by Joao Martins

ONiO Selects Exeger Powerfoyle Solar Cell Technology to Create Devices That Are 100% Battery-Free

ONiO, a pioneer in the development of advanced batteryless microcontrollers that can efficiently harness power from a wide range of sources, announced a strategic partnership with Exeger. ONiO chooses Powerfoyle as their preferred solar cell technology for product integration and will combine advanced microcontrollers with solar technology, driving forward the development of sustainable, low-maintenance electronics that are ready for immediate operation.

Synaptics Introduces Wi-Fi 6E and Bluetooth 5.3 Wireless SoC Ideal for Auracast

November 9, 2023 by Joao Martins

Synaptics Introduces Wi-Fi 6E and Bluetooth 5.3 Wireless SoC Ideal for Auracast

Synaptics announced the expansion of its wireless connectivity family with the introduction of the SYN43711. This Wi-Fi 6E and Bluetooth 5.3 tri-band combo system on chip (SoC) is ready to support Bluetooth 5.3 with LE Audio for multiple concurrent Bluetooth connections and audio streams, including Auracast. Delivering best-in-class rate-over-range and interoperability in a cost-effective form factor, the SYN43711 targets high-performance applications with audio and video streaming.

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