All items tagged with connected devices (129)

Practical Test & Measurement: Testing Smart Devices

February 4, 2020 by Steve Temme

Practical Test & Measurement: Testing Smart Devices

Voice applications are currently fostering the largest growth in the audio industry. This article addresses the challenges and solutions for testing the wider class of “smart” – connected, voice-activated, and sensor-equipped – devices, proposing solutions to implement basic acoustic tests and real-world tests of greater complexity. This article was originally published in audioXpress, April 2019.

MIPI I3C v1.1 Update for I2C Implementers Simplifies Development for Wearables and Connected Devices

January 20, 2020 by audioXpress Staff

MIPI I3C v1.1 Update for I2C Implementers Simplifies Development for Wearables and Connected Devices

The MIPI Alliance, the international organization that develops interface specifications for mobile and mobile-influenced industries, announced MIPI I3C v1.1, the first update to the interface that eliminates the historical pain points of I2C development. MIPI I3C v1.1 is a scalable, medium-speed, utility and control bus that connects peripherals to an application processor, streamlining integration and improving cost efficiencies in development.

CEVA Debuts SenslinQ Platform to Streamline Development of Contextually Aware Connected Devices

January 7, 2020 by audioXpress Staff

CEVA Debuts SenslinQ Platform to Streamline Development of Contextually Aware Connected Devices

At CES 2020 CEVA unveiled SenslinQ, its first integrated hardware IP and software platform that aggregates sensor fusion, sound and connectivity technologies to enable contextually aware connected devices. The CEVA SenslinQ integrated hardware IP and software platform collects, processes and links data from multiple sensors to enable intelligent devices to understand their surroundings - a key development for augmented hearing using wireless headphones and earbuds.

Project Connected Home Over IP Created to Expand Smart Home Device Connectivity

December 19, 2019 by audioXpress Staff

Project Connected Home Over IP Created to Expand Smart Home Device Connectivity

Amazon, Apple, Google, and the Zigbee Alliance, announced a new working group that plans to develop and promote the adoption of a new, royalty-free connectivity standard to increase compatibility among smart home products, with security as a fundamental design tenet. The working group is named Project Connected Home over IP and intends to simplify development for device manufacturers by creating a new, open standard for Smart Home Device Connectivity.

Kick Off Another Exciting Year for Audio Technology with audioXpress!

December 11, 2019 by audioXpress Staff

Kick Off Another Exciting Year for Audio Technology with audioXpress!

audioXpress January 2020 is now available in print and download! To start 2020 in the best possible way, this edition includes a Market Update about Speakers and Transducers, followed by a report of the COMSOL Boston Conference where the latest Multiphysics 5.5 Release was unveiled, a great review of the Cambridge Audio Edge W amplifier, and an in-depth article in which Steve Temme discusses tools and techniques to accurately measure voice-controlled and connected devices. Plus many more great theory articles and practical knowledge shared by audioXpress experts.

Chirp and Synaptics Join Forces to Empower Smart Home Devices with Data-Over-Sound Connectivity

November 4, 2019 by audioXpress Staff

Chirp and Synaptics Join Forces to Empower Smart Home Devices with Data-Over-Sound Connectivity

Chirp, the pioneers in data-over-sound, have joined forces with one of the leading companies in human machine interface (HMI) hardware and software solutions, Synaptics, in an effort to bring low-powered connectivity to consumer smart home devices. The collaboration targets seamless smart device experiences by embedding Chirp’s data-over-sound software into Synaptics’ edge computing SoCs.

TDK Announces Availability of the Chirp SmartSonic Platform Family of MEMS-based Ultrasonic ToF Sensors

October 4, 2019 by Cristina Costa

TDK Announces Availability of the Chirp SmartSonic Platform Family of MEMS-based Ultrasonic ToF Sensors

Following its acquisition of Chirp Microsystems in February 2018, TDK Corporation now announced the immediate availability of the latest Chirp SmartSonic platform family of ultrasonic sensor time-of-flight (ToF) solutions. The SmartSonic platform is currently available with the Chirp CH-101, an ultra-low power ultrasonic ToF range sensor that provides millimeter-accurate range measurements up to 1.2m, independent of target color and transparency.

Increasing Demand for High Throughput Home Wi-Fi Networks Drives Wi-Fi 6 Deployments

September 19, 2019 by audioXpress Staff

Increasing Demand for High Throughput Home Wi-Fi Networks Drives Wi-Fi 6 Deployments

Increasing worldwide broadband penetration, combined with the adoption of multiple connected devices, bandwidth-intensive, and low latency applications in each household is continuously driving the demand for efficient Wi-Fi Consumer Premises Equipment (CPE) devices. Global tech market advisory firm, ABI Research, forecasts that the Wi-Fi CPE market, including routers, gateways, whole-home mesh systems, access points, and Wi-Fi extenders will generate 221 million unit shipments in 2019.

Skyworks Enables Nordic Semiconductor High-efficiency, Long-Range Bluetooth Solutions

August 13, 2019 by audioXpress Staff

Skyworks Enables Nordic Semiconductor High-efficiency, Long-Range Bluetooth Solutions

High performance analog semiconductor and wireless networking manufacturer Skyworks Solutions announced that its advanced connectivity engines are being leveraged by Nordic Semiconductor for ultra-low power wireless communications. Specifically, Nordic is utilizing Skyworks’ family of fully-integrated front-end solutions in conjunction with their multi-protocol system-on-chip (SoC) for Bluetooth Low Energy (LE) and emerging Bluetooth 5 applications.

u-blox Acquires Rigado’s Bluetooth Modules Business

August 2, 2019 by audioXpress Staff

u-blox Acquires Rigado’s Bluetooth Modules Business

Swiss company u‑blox, a global provider of positioning and wireless communication technologies, announced it acquired Rigado’s Bluetooth modules business in an Asset Purchase Agreement. Rigado is an Oregon-based provider of Edge‑as‑a-Service gateway solutions for Commercial IoT applications, and began offering certified wireless modules in 2015, implementing Nordic Semiconductor’s nRF52840 Bluetooth Low Energy (Bluetooth LE) SoC.

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