All items tagged with connected devices (133)
TDK Announces Availability of the Chirp SmartSonic Platform Family of MEMS-based Ultrasonic ToF Sensors
October 4, 2019 by Cristina Costa

TDK Announces Availability of the Chirp SmartSonic Platform Family of MEMS-based Ultrasonic ToF Sensors

Following its acquisition of Chirp Microsystems in February 2018, TDK Corporation now announced the immediate availability of the latest Chirp SmartSonic platform family of ultrasonic sensor time-of-flight (ToF) solutions. The SmartSonic platform is currently available with the Chirp CH-101, an ultra-low power ultrasonic ToF range sensor that provides millimeter-accurate range measurements up to 1.2m, independent of target color and transparency.
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Increasing Demand for High Throughput Home Wi-Fi Networks Drives Wi-Fi 6 Deployments
September 19, 2019 by audioXpress Staff

Increasing Demand for High Throughput Home Wi-Fi Networks Drives Wi-Fi 6 Deployments

Increasing worldwide broadband penetration, combined with the adoption of multiple connected devices, bandwidth-intensive, and low latency applications in each household is continuously driving the demand for efficient Wi-Fi Consumer Premises Equipment (CPE) devices. Global tech market advisory firm, ABI Research, forecasts that the Wi-Fi CPE market, including routers, gateways, whole-home mesh systems, access points, and Wi-Fi extenders will generate 221 million unit shipments in 2019.
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Skyworks Enables Nordic Semiconductor High-efficiency, Long-Range Bluetooth Solutions
August 13, 2019 by audioXpress Staff

Skyworks Enables Nordic Semiconductor High-efficiency, Long-Range Bluetooth Solutions

High performance analog semiconductor and wireless networking manufacturer Skyworks Solutions announced that its advanced connectivity engines are being leveraged by Nordic Semiconductor for ultra-low power wireless communications. Specifically, Nordic is utilizing Skyworks’ family of fully-integrated front-end solutions in conjunction with their multi-protocol system-on-chip (SoC) for Bluetooth Low Energy (LE) and emerging Bluetooth 5 applications.
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u-blox Acquires Rigado’s Bluetooth Modules Business
August 2, 2019 by audioXpress Staff

u-blox Acquires Rigado’s Bluetooth Modules Business

Swiss company u‑blox, a global provider of positioning and wireless communication technologies, announced it acquired Rigado’s Bluetooth modules business in an Asset Purchase Agreement. Rigado is an Oregon-based provider of Edge‑as‑a-Service gateway solutions for Commercial IoT applications, and began offering certified wireless modules in 2015, implementing Nordic Semiconductor’s nRF52840 Bluetooth Low Energy (Bluetooth LE) SoC.
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SnapAV and Control4 Combine to Transform Global Smart Home Industry
August 1, 2019 by audioXpress Staff

SnapAV and Control4 Combine to Transform Global Smart Home Industry

As announced in May 2019, SnapAV, a leading provider of A/V, surveillance, networking and remote management products for professionals, and Control4 Corporation, the smart home solutions company, announced the successful completion of their merger. Unified into a single organization, Control4 becomes a professional smart home brand in the SnapAV portfolio. The combined company promises to expand investments in solutions and services for technology professionals.
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CEVA Acquires Hillcrest Labs Intelligent Sensor Technologies Business from InterDigital
July 23, 2019 by audioXpress Staff

CEVA Acquires Hillcrest Labs Intelligent Sensor Technologies Business from InterDigital

CEVA announced the acquisition of the Hillcrest Laboratories, Inc. (Hillcrest Labs) business from InterDigital. Hillcrest Labs is a leading global supplier of software and components for sensor processing in consumer and IoT devices, and the acquisition extends CEVA’s connected technology portfolio with highly complementary sensor processing technologies that have powered more than 100 million devices.
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CEVA Introduces Fully-Integrated Wi-Fi Solution to Connect Devices to the Alibaba Cloud
June 25, 2019 by audioXpress Staff

CEVA Introduces Fully-Integrated Wi-Fi Solution to Connect Devices to the Alibaba Cloud

Signal processing platform specialist CEVA introduced a fully-integrated, licensable Wi-Fi solution for companies looking to accelerate the development of connected devices that make use of Alibaba Cloud. The turnkey solution integrates CEVA’s industry-leading RivieraWaves Wi-Fi Low Power IP together with the AliOS Things operating system on a single RISC-V CPU core, providing the freedom to focus development efforts on creating differentiation in the end application.
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LEA Professional Launches New Technology Platform and First Low Power, Connected Amplifiers
June 13, 2019 by audioXpress Staff

LEA Professional Launches New Technology Platform and First Low Power, Connected Amplifiers

As highly anticipated, LEA Professional was the focus of attention as soon as InfoComm 2019 opened its doors in Orlando, introducing its professional-grade IoT (Internet of Things) technology platform with the launch of the LEA Connect Series amplifier family. As promised, LEA wants to bring the benefits of a connected world to the Professional A/V market, allowing system designers and integrators to provide real-time system performance coverage to their existing service contacts.
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Lattice Semiconductor Introduces New Development Kit for Low Power, Embedded AI Applications
May 31, 2019 by Cristina Costa

Lattice Semiconductor Introduces New Development Kit for Low Power, Embedded AI Applications

Lattice Semiconductor announced the availability of the HM01B0 UPduino Shield, a comprehensive development kit for implementing Artificial Intelligence (AI) computing in devices using vision and sound as sensory inputs. This rapid prototyping board, in the Arduino form factor, includes components designers need to quickly develop always-on, low power smart IoT and connected devices. This new development kit consists of a Lattice iCE40 UltraPlus FPGA-based Upduino 2.0 board and a Himax HM01B0 image sensor module.
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Qualcomm Launches AI-Enabled Highly Integrated SoCs and Dedicated Smart Speaker Platform
March 19, 2019 by audioXpress Staff

Qualcomm Launches AI-Enabled Highly Integrated SoCs and Dedicated Smart Speaker Platform

Qualcomm made two important announcements for audio developers, both bound to significantly impact the fast-growing market of smart speakers and new generation whole-home audio systems. The San Diego company announced the new QCS400 family of audio SoCs and the Smart Audio Platform 400 development kit, bringing smart speakers high-performance processing, Qualcomm AI Engine, superior connectivity, and multiple advanced audio and visual display capabilities in a single, power-optimized chip architecture.
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