All items tagged with connected devices (133)

Cadence Announces New Tensilica HiFi 1 DSP Optimized for Bluetooth LE Audio True Wireless Devices

October 29, 2021 by audioXpress Staff

Cadence Announces New Tensilica HiFi 1 DSP Optimized for Bluetooth LE Audio True Wireless Devices

Cadence Design Systems announced the new Cadence Tensilica HiFi 1 DSP, delivering increased voice- and music-processing performance with optimal neural network capability in a compact footprint with ultra-low energy, improving the user experience and extending battery life. The Tensilica HiFi 1 DSP is now the smallest and lowest power member of the HiFi DSP family, developed for battery-constrained applications, such as mobile, hearables, wearables, automotive, and connected devices.

Smart Speaker Shipments Surged to Record Levels

September 15, 2021 by audioXpress Staff

Smart Speaker Shipments Surged to Record Levels

The smart speaker market in the second quarter of 2021 surged to new heights as consumers and brands adapt to the ongoing pandemic, according to the latest research from Strategy Analytics. Even with the looming specters of supply chain challenges, component shortages, and the Delta variant of the COVID-19 virus hanging over the market, global shipments of smart speakers and smart displays in Q2 2021 grew 34.8% from Q2 2020 to 39.5 million units, a record for a second calendar quarter.

World’s Smallest UWB and BLE Low-Power Module for Connected Devices

September 3, 2021 by Cristina Costa

World’s Smallest UWB and BLE Low-Power Module for Connected Devices

Murata has launched the world’s smallest ultra-wideband (UWB) module – measuring just 10.5 mm × 8.3 mm × 1.44 mm – that combines elevated levels of accuracy and reliability with low-power to ensure compact and battery-driven connected devices operate as efficiently and cost-effectively as possible. Using short-range radio frequency (RF) technology, the Type 2AB UWB + Bluetooth low-energy (BLE) connectivity module can be used in a wide variety of applications where precise detection is essential.

CEVA to Acquire Intrinsix to Offer Full Turnkey SoC Platforms

May 10, 2021 by audioXpress Staff

CEVA to Acquire Intrinsix to Offer Full Turnkey SoC Platforms

CEVA announced that it agreed to acquire Massachusetts-based Intrinsix Corp., a leading chip design specialist, for approximately $33 million in cash, subject to working capital and other customary purchase price adjustments. The closing of the acquisition is anticipated to take place during the second quarter of 2021. The acquisition allows CEVA to offer IP, software and chip development.

Skyworks Solutions Acquires the Infrastructure and Automotive Business of Silicon Labs

April 23, 2021 by audioXpress Staff

Skyworks Solutions Acquires the Infrastructure and Automotive Business of Silicon Labs

Silicon Labs announced that it has entered into a definitive asset purchase agreement to sell its Infrastructure & Automotive (I&A) business to Skyworks Solutions, in order to focus on the wireless connectivity market. The $2.75 billion transaction includes Silicon Labs’ power/isolation, timing and broadcast products, intellectual property and associated employees. Silicon Labs also announced Matt Johnson has been appointed President. Tyson Tuttle will continue as CEO.

Renesas Launches RX23W Module with Bluetooth for System Control and Wireless Communication on Connected Devices

April 9, 2021 by audioXpress Staff

Renesas Launches RX23W Module with Bluetooth for System Control and Wireless Communication on Connected Devices

Renesas Electronics Corporation introduced the RX23W Module with full Bluetooth 5.0 Low Energy support for system control and wireless communication on endpoint connected devices. Featuring the RX23W 32-bit RX MCU supporting fully integrated Bluetooth Low Energy communication, the new RX23W module is equipped with an antenna, oscillator and custom-matched circuit. A solution ready for the development of connected home appliances, healthcare and sports and fitness equipment.

Infineon Introduces New AIROC Wi-Fi 6/6E and Bluetooth 5.2 Combo Devices for High-Quality Video and Audio Streaming

April 9, 2021 by Cristina Costa

Infineon Introduces New AIROC Wi-Fi 6/6E and Bluetooth 5.2 Combo Devices for High-Quality Video and Audio Streaming

Infineon Technologies expanded its wireless portfolio with new high-performance, reliable and secure devices. The newly developed AIROC brand now includes the industry’s first 1x1 Wi-Fi 6/6E and Bluetooth 5.2 combo SoC for enterprise and industrial applications, and its first 2x2 Wi-Fi 6/6E and Bluetooth 5.2 combo SoC for multimedia, consumer and automotive applications. The new wireless connectivity combo devices deliver robust performance and minimal latency, making them ideal for high-quality video and audio streaming applications.

Audio Market Intelligence Update March 2021 - Positive Stats and Look Ahead

March 18, 2021 by Joao Martins

Audio Market Intelligence Update March 2021 - Positive Stats and Look Ahead

Every day at audioXpress we look carefully at market intelligence updates from the leading research firms, and we normally look at data-based reports from multiple sources, trying to get a clear vision of what is happening in the markets, and how forecasts look for the audio industry. audioXpress is focused on serving the audio industry, and we are more interested in providing market intelligence than publishing subjective opinions about the measurement systems used by YouTube headphone reviewers - which seems to be the latest focus even for many competent audio publications these days.

Dirac and CRI Middleware Join Forces to Deliver Enhanced Sound for Mobile, Gaming, and Automotive

March 11, 2021 by audioXpress Staff

Dirac and CRI Middleware Join Forces to Deliver Enhanced Sound for Mobile, Gaming, and Automotive

Swedish digital audio pioneer Dirac and Tokyo-based solution provider CRI Middleware announced they have entered into a distribution agreement to explore new applications of Dirac’s audio optimization technology. The two companies will build on CRI Middleware’s expertise working with developers in the gaming, automotive, mobile/PC and connected devices to identify products that would benefit from the enhanced sound experiences enabled by Dirac solutions.

Knowles Releases Bluetooth Standard Solution Development Kit to Speed up Voice Integration

February 24, 2021 by audioXpress Staff

Knowles Releases Bluetooth Standard Solution Development Kit to Speed up Voice Integration

Knowles Corporation, a leading provider of advanced micro-acoustic microphones and speakers, audio processing, and precision device solutions, announced the AISonic Bluetooth Standard Solution, a complete development kit that enables fast voice integration to Bluetooth devices. The kit is built upon the Knowles AISonic Audio Edge Processor IA8201, a high-performance, ultra-low power audio-centric OpenDSP, and includes SDK, pre-integrated mics, and integration support for Bluetooth chips.

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