All items tagged with connected devices (134)
Cypress Releases PSoC 6 BLE Pioneer Kit and Supporting PSoC Creator 4.2 IDE
October 2, 2017 by audioXpress Staff

Cypress Releases PSoC 6 BLE Pioneer Kit and Supporting PSoC Creator 4.2 IDE

Cypress Semiconductor announced its PSoC 6 BLE Pioneer Kit and PSoC Creator Integrated Design Environment (IDE) software version 4.2 that enable designers to begin innovating with the PSoC 6 microcontroller (MCU) for all connected applications. PSoC BLE 6 is the industry’s lowest power, most flexible MCU with built-in Bluetooth Low Energy wireless connectivity and integrated hardware-based security in a single device.
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DSP Group and LISNR Partner to Create Ultra-low Power Audio-Enabled Data Transmission Solution
August 22, 2017 by audioXpress Staff

DSP Group and LISNR Partner to Create Ultra-low Power Audio-Enabled Data Transmission Solution

Wireless communications chipset specialist, DSP Group and LISNR, a global provider of data-over-audio technology, developed the Audio-D, a solution that supports data-over-audio communication for any device with a speaker or microphone. This solution, based on DSP Group’s DBMD4 Voice SoC and LISNR technology, overcomes device-to-device hardware restraints regarding RF protocols. This enables always-on communication and high level of interoperability while consuming low power.
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STMicroelectronics Introduces BlueNRG-2 Next-Generation Bluetooth Low Energy Chip for Wireless Connected Smart Devices
June 29, 2017 by audioXpress Staff

STMicroelectronics Introduces BlueNRG-2 Next-Generation Bluetooth Low Energy Chip for Wireless Connected Smart Devices

STMicroelectronics announced its new BlueNRG-2 Bluetooth Low Energy Chip, combining small size, and high performance, as currently required by the widespread deployment of energy-conscious, space-constrained applications with BLE connectivity. According to the company, the new solution provides state-of-the-art security and is Bluetooth 5.0-certified to ensure interoperability with the latest mobiles and tablets.
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Cypress Expands Wireless Connectivity Portfolio with New 802.11ac High-Performance Wi-Fi and Bluetooth Combo Solution Solution
May 30, 2017 by audioXpress Staff

Cypress Expands Wireless Connectivity Portfolio with New 802.11ac High-Performance Wi-Fi and Bluetooth Combo Solution Solution

During Computex 2017, Cypress Semiconductor announced a new wireless solution that delivers advanced coexistence combining 802.11ac high-performance Wi-Fi, Bluetooth and Bluetooth Low Energy (BLE). The new highly integrated Cypress CYW4373 solution incorporates a USB 2.0 hub that provides a common WLAN and Bluetooth interface. The combo solution seems to be ideal for connected audio systems.
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Frontier Silicon Announces Smart Audio Solution with Google Assistant
May 26, 2017 by audioXpress Staff

Frontier Silicon Announces Smart Audio Solution with Google Assistant

Frontier Silicon announced that its Smart Audio platform, Minuet, has been upgraded to include Google Assistant. Minuet already allows brands and manufacturers to develop smart audio devices with Chromecast built-in. With the addition of Google Assistant, users will be able to control their smart speakers via voice and use these speakers not only to play music but also to access Internet services, such as news, update personal schedules and control a wide range of smart home devices.
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Microchip Unveils System in Package for Wirelessly Connected Designs That Last for Years
April 28, 2017 by audioXpress Staff

Microchip Unveils System in Package for Wirelessly Connected Designs That Last for Years

The SAM R30 System in Package (SiP), a single-chip RF microcontroller (MCU), is now available from Microchip Technology. The SAM R30 SiP incorporates an ultra-low power microcontroller with an 802.15.4 sub-GHz radio, providing multi-year battery life in a compact 5 mm package. The SAM R30 SiP delivers design flexibility and proven reliability all in a small package, making it ideally suited for long-lasting connected home and smart city applications.
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Shenzhen Micro & Nano Institute License CEVA Audio/Voice DSP for Microphone Far-Field Voice Pickup Applications
January 3, 2017 by audioXpress Staff

Shenzhen Micro & Nano Institute License CEVA Audio/Voice DSP for Microphone Far-Field Voice Pickup Applications

CEVA DSP, a licensor of signal processing IP for smarter, connected devices, announced that Shenzhen Micro & Nano Institute (MNI) has licensed the CEVA audio/voice DSP for the development of a multi-mic voice processor targeting a range of intelligent hardware systems including robots, smart appliances and the smart home. CEVA DSP's will power MNI’s 360 degree voice positioning algorithm in their intelligent voice processor.
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Tessera Completes Acquisition of DTS
December 2, 2016 by audioXpress Staff

Tessera Completes Acquisition of DTS

Following the original announcement in September 2016, Tessera Holding Corporation announced it has completed the acquisition of DTS. Tessera Technologies and DTS are now combined under Tessera Holding Corporation and the shares of the combined company will continue to trade on the NASDAQ under Tessera’s ticker symbol TSRA. The Company plans to introduce a new corporate name, stock ticker, brand and logo during the first quarter of 2017.
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Cypress Streamlines Connected Designs with New Turnkey Development Platform
November 10, 2016 by Cristina Costa

Cypress Streamlines Connected Designs with New Turnkey Development Platform

Cypress Semiconductor announced a new version of its development platform for the Internet of Things (IoT) and consumer electronics that enables wireless connectivity in minutes. The Wireless Internet Connectivity for Embedded Devices (WICED) Studio 4 platform provides a single development environment for multiple wireless technologies, including Cypress's Wi-Fi, Bluetooth and combo solutions, with an easy-to-use application programming interface.
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Archwave and Bosch Demonstrate AES67 and AES70 Integrated Platform for Audio, Control and Connection Management
October 6, 2016 by audioXpress Staff

Archwave and Bosch Demonstrate AES67 and AES70 Integrated Platform for Audio, Control and Connection Management

During the 141st Audio Engineering Society convention in Los Angeles, Archwave and Bosch have demonstrated an AES67 and AES70 (OCA) integrated networked platform for audio, control and connection management. Archwave worked together with Bosch and their combined teams to integrate the two existing audio industry standards into a full-fledged solution for audio networking.
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