With mainstream consumer demand for high-quality audio experiences growing, consumers expect Bluetooth audio devices to perform accordingly. However, Bluetooth audio designs are often limited by the bit depth and frequency rate of existing codecs used to send audio over the air. Now designers of audio systems have a fully-certified, Bluetooth 5-compliant System-on-Chip (SoC) with Sony’s LDAC audio codec technology in the IS2064GM-0L3 from Microchip Technology.
Considered the highest-quality audio codec available, Sony’s LDAC technology transmits up to 990 kbps data throughput, which is three times higher than the standard Bluetooth Sub-band Codec (SBC), and maintains frequency and bit depth of up to 96 kHz/24-bit.
The new Microchip IS2064GM-0L3 SoC allows manufacturers to develop a new generation of audio devices with an advanced codec, extending high-resolution audio from upscale and enthusiast products directly to mass market Bluetooth wireless applications.
Audeze is among the first companies to implement the new Microchip IS2064GM-0L3 SoC into their high-end Mobius gaming headphone. The Audeze Mobius headphone utilizes the IS2064GM-0L3 for the Bluetooth wireless connection supporting LDAC and other audio codec interfaces. Information for licensing requirements using Sony LDAC technology is available here: www.sony.net/Products/LDAC/index.html.
“Our new Mobius headphone features many groundbreaking technologies. To ensure high-quality Bluetooth audio we implemented Microchip’s IS2064GM-0L3 SoC in our headphones,” said Sankar Thiagasamudram, CEO of Audeze. “Thanks to the outstanding support from Microchip, we were able to incorporate the LDAC codec quickly and easily into our products.”
The IS2064GM-0L3 SoC not only makes the LDAC codec available to the broader market of audio product vendors, it also allows manufacturers to leverage Microchip’s global technical support and comprehensive development environment to assist them with implementation and getting to market faster. The LDAC codec is also integrated into the Android 8.0 Oreo operating system Bluetooth stack, making the LDAC technology more widely available on the transmit side.
“Microchip enables OEMs to address consumers’ increasing demand for high-quality audio with the convenience and ubiquity of Bluetooth wireless,” says Steve Caldwell, vice president of Microchip’s wireless solutions group. “OEMs can focus on their audio product and sound quality and know that, because of Microchip, the Bluetooth wireless integration will be seamless.”
The IS2064GM-0L3 is available to manufacturers upon request after approval. Development boards are also available. The IS2064GM-0L3 comes in an 8 x 8 mm LGA package and is available for volume production starting at $4.90 each in 10,000-unit quantities.
For more information on the SoC visit: http://www.microchip.com/IS2064.