All items tagged with product development (919)

GRAS Sound & Vibration Announces High Resolution Ear Simulator for Reliable Measurements of Headphones and Earphones up to 20 kHz

November 8, 2017 by audioXpress Staff

GRAS Sound & Vibration Announces High Resolution Ear Simulator for Reliable Measurements of Headphones and Earphones up to 20 kHz

GRAS Sound & Vibration, the world-renowned manufacturer of high quality measurement microphones and related acoustic equipment, announced the availability of a new, High Resolution Ear Simulator designed specifically to meet the need for reliable and repeatable measurements of personal audio devices at high frequencies. An ideal solution for development of in-ear as well as supra- and circumaural headphones.

FlexTech and PARC Cooperate on Ultra-Thin, Flexible Audio Speaker Development

November 6, 2017 by audioXpress Staff

FlexTech and PARC Cooperate on Ultra-Thin, Flexible Audio Speaker Development

FlexTech, a SEMI Strategic Association Partner announced a new development project with PARC, a Xerox company, to develop a hybrid, highly bendable, paper-like smart tag, incorporating a thin audio speaker. The product, based on the most advanced printed electronics uses active and passive components, and is aimed at applications in packaging, wearables prosthetics, soft robotics, smart tags, and smart cities and homes.

NXP Software Development Kit with Apple HomeKit Support Now Available

November 6, 2017 by Cristina Costa

NXP Software Development Kit with Apple HomeKit Support Now Available

NXP Semiconductors announced that its Apple HomeKit Software Development Kit (SDK) now offers full support for home automation applications using HomeKit. NXP's HomeKit SDK now supports all Apple HomeKit transports, including Bluetooth Low Energy (BLE) 4.2, Wi-Fi, Ethernet with iCloud remote access across NXP microcontrollers and microprocessors. The solutions enables Smart Home development with the most advanced security features.

SoundChip Unveils World’s Lowest Power, Highest Performance Hybrid Noise Cancelling Platform for True Wireless Stereo Headsets

November 3, 2017 by audioXpress Staff

SoundChip Unveils World’s Lowest Power, Highest Performance Hybrid Noise Cancelling Platform for True Wireless Stereo Headsets

SoundChip, a Swiss-based provider or audio processing solutions, unveiled Aurora – an application-specific, low-power, hybrid noise cancelling platform for next-generation True Wireless Stereo (TWS) headsets. According to the company, Aurora delivers up to 35dB of class-leading digitally-programmable feed-forward and feedback (hybrid) noise cancelling, as well as a swathe of software-controlled features, including multi-mode noise cancelling, digitally configurable occlusion control, and situational awareness.

Libre Wireless Technologies Launches “MAVID”, Miniaturized Low Power Integrated Wireless Voice/Audio/IoT Device

November 3, 2017 by audioXpress Staff

Libre Wireless Technologies Launches “MAVID”, Miniaturized Low Power Integrated Wireless Voice/Audio/IoT Device

At a one day industry summit focused on the Amazon Alexa Voice Service (AVS), Libre Wireless Technologies, announced “MAVID,” an entirely new embedded voice enabled multiprotocol wireless connectivity and IoT platform. This ultra low power and incredibly small new device incorporates a complete hardware and software solution for embedded voice, IoT, audio and wireless connectivity. The new Libre platform will enable OEMs and ODMs to build unique voice-enabled products.

Intel Announces New Development Kit for Far-Field Alexa-Enabled Products

November 2, 2017 by audioXpress Staff

Intel Announces New Development Kit for Far-Field Alexa-Enabled Products

Intel has announced the Intel Speech Enabling Developer Kit, designed for manufacturers and developers to quickly bring new Alexa-enabled products to market. This kit is the first audio front end solution that combines far-field voice processing and "Alexa" wake word detection on a single chip. It is based on a new digital signal processor (DSP) architecture from Intel that enables high-quality voice capture in acoustically challenging environments.

New Synaptics and NXP Alexa Development Kit Available at Arrow Electronics

November 1, 2017 by audioXpress Staff

New Synaptics and NXP Alexa Development Kit Available at Arrow Electronics

NXP has teamed up with Arrow Electronics, Synaptics and Amazon to develop the Synaptics AudioSmart 2-Mic and NXP Pico i.MX7Dual Development Kit for Amazon Alexa Voice Service (AVS). This newly available development kit is one of the first to be qualified with production-ready system-on-chip (SoC), voice processor, and the AVS Device SDK. It enables device makers to quickly and cost-effectively integrate Alexa into a fully functioning prototype and then take that work into design for manufacturing and production.

TDK InvenSense MEMS Microphones Available with Synaptics AudioSmart Solution

November 1, 2017 by audioXpress Staff

TDK InvenSense MEMS Microphones Available with Synaptics AudioSmart Solution

TDK Corporation showcased a Synaptics AudioSmart solution for voice recognition, using InvenSense high performance MEMS microphones. The ICS-40212 and ICS-40720 analog output and the ICS-41350 PDM digital output MEMS microphones are approved for use with Synaptics AudioSmart Amazon Voice Services (AVS) solution. TDK also announced the worldwide availability of its SmartMotion Platform encompassing 4 unique development kits with multiple sensors.

CEVA and Cyberon Partner for Ultra-low Power Always-listening Voice Activation Solution

October 30, 2017 by audioXpress Staff

CEVA and Cyberon Partner for Ultra-low Power Always-listening Voice Activation Solution

CEVA, a leading licensor of signal processing IP for smarter, connected devices, and Taiwan's leading embedded speech solution provider, Cyberon Corporation, announced a partnership to offer an ultra-low power, always-listening voice activation solution for smartphones, consumer and IoT devices. Cyberon has developed an optimized implementation of its CSpotter voice recognition engine for the CEVA-TeakLite family of DSPs.

Microchip Updates MPLAB Mindi Analog Simulator to Include Over 300 Device Models and Schematics

October 20, 2017 by Cristina Costa

Microchip Updates MPLAB Mindi Analog Simulator to Include Over 300 Device Models and Schematics

Microchip Technology announced availability of its updated MPLAB Mindi analog simulation software, now including more models and features. The circuit simulation tool now supports more than 300 Microchip analog products, with SIMetrix’s enhanced SPICE (Simulation Program with Integrated Circuit Emphasis) and SIMPLIS Technologies’ SIMPLIS (SIMulation of Piecewise LInear Systems) simulation environments.

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