All items tagged with product development (879)
3PASS flex: New Background Noise Simulation System for Multi-Microphone Arrangements
April 11, 2017 by audioXpress Staff

3PASS flex: New Background Noise Simulation System for Multi-Microphone Arrangements

3PASS flex is HEAD acoustics new simulation system for measuring speech quality performance in the presence of background noise. It is particularly suited for testing multi-microphone systems, microphone arrays or beamforming microphones in real world conditions where multi-point noise simulation with flexible microphone and loudspeaker arrays is required. 3PASS flex reproduces any previously recorded sound field at distinct microphone positions, representative of typical use cases.
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Nordic Semiconductor Shows Development Kit and Other Solutions for Bluetooth 5 Implementation
March 28, 2017 by audioXpress Staff

Nordic Semiconductor Shows Development Kit and Other Solutions for Bluetooth 5 Implementation

Following the announcement at CES 2017 of its Bluetooth 5-compatible nRF52 Series SoCs (nRF52832 and nRF52840 devices), Nordic Semiconductor is showing new development tools for Bluetooth 5 at Bluetooth World, the official event of Bluetooth SIG, taking place at Santa Clara Convention Center, 28-29 March, 2017. Demonstrations include the new Preview Development Kit (nRF52840-PDK) and its first Thread networking SDK.
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Dialog Semiconductor Introduces Bluetooth 5 Low Power SoC with Integrated Microphone Interface
March 27, 2017 by audioXpress Staff

Dialog Semiconductor Introduces Bluetooth 5 Low Power SoC with Integrated Microphone Interface

As the connected devices market enters a new era of connectivity with Bluetooth 5.0, Dialog Semiconductor announced the next generation in its SmartBond family – DA14586. The all-new System-on-Chip (SoC) is the company’s first standalone device that is qualified to support the latest Bluetooth 5.0 specification, delivering the lowest power consumption and unrivalled functionality for advanced use cases.
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Bluetooth 5 Audio Update - An Interview with Mark Powell, Executive Director, Bluetooth SIG
March 23, 2017 by Joao Martins

Bluetooth 5 Audio Update - An Interview with Mark Powell, Executive Director, Bluetooth SIG

Ahead of the Bluetooth World 2017 meeting (March 28-29 2017), which will bring together more than 1,000 developers, executives, and start-ups on a busy exhibition floor to promote Bluetooth development and applications, we thought it would be appropriate to share part of the interview we had with Mark Powell, Executive Director, Bluetooth SIG, at CES 2017, where we discussed the Bluetooth 5 roadmap.
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Teledyne LeCroy Announces New Bluetooth 5 Development and Conformance Solutions
March 23, 2017 by audioXpress Staff

Teledyne LeCroy Announces New Bluetooth 5 Development and Conformance Solutions

Teledyne LeCroy, a leading company in Bluetooth protocol analysis and testing services, announced the development of a Bluetooth Conformance Tester for verifying conformance of Bluetooth low energy link layer and HCI implementations and also announced availability of the Frontline Sodera LE Analyzer supporting Bluetooth 5. Both solutions complement Teledyne's Audio Expert System audio quality tool set for resolving audio issues related to the Bluetooth protocol.
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Intelligent Touch-Screen Display Modules with Integrated WiFi from 4D Systems
March 21, 2017 by audioXpress Staff

Intelligent Touch-Screen Display Modules with Integrated WiFi from 4D Systems

Implementing rich graphical user interfaces with touch panel color displays for wireless control doesn't have to be complicated. At Embedded World 2017, in Nuremberg, Germany, 4D Systems has introduced its gen4 Internet of Displays (IoD) series with resistive touch. Featuring integrated WiFi capabilities, the display modules allow users to quickly and easily create GUI (graphical user interface) applications with wireless connectivity.
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Microchip Introduces New Development Solutions for Connected Products
March 20, 2017 by Cristina Costa

Microchip Introduces New Development Solutions for Connected Products

Microchip made a series of announcements for Embedded World 2017, including a completely new generation of 8-bit PIC MCUs for complex designs. The new PIC18 “K42” family offers a versatile array of Core Independent Peripherals with DMA and vectored interrupts for improved system performance with less code. Other announcements include new advanced Gigabit Ethernet products ideal for infotainment applications, and a new secure CEC1702 32-bit MCU for connected solutions.
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Texas Instruments Announces New SimpleLink MCU Platform with Security-Enhanced Wi-Fi Solutions
March 17, 2017 by Cristina Costa

Texas Instruments Announces New SimpleLink MCU Platform with Security-Enhanced Wi-Fi Solutions

Texas Instruments (TI) has announced availability of its new SimpleLink microcontroller (MCU) platform, combining hardware, software and tools under a single development environment. Sharing drivers, frameworks and libraries, SimpleLink MCU platform's new software development kits (SDKs) support development with TI's complete portfolio of 32-bit wired and wireless ARM-based MCUs, which now also include security-enhanced Wi-Fi chips and modules.
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New Wireless Gecko Bluetooth 5-Compliant SoCs Help Developers Tackle Multiprotocol Design Challenges
March 16, 2017 by audioXpress Staff

New Wireless Gecko Bluetooth 5-Compliant SoCs Help Developers Tackle Multiprotocol Design Challenges

Silicon Labs announced a major expansion of its Wireless Gecko system-on-chip (SoC) portfolio, making it easier for developers of all skill levels to add versatile multiprotocol switching capabilities to increasingly complex applications. The new EFR32xG12 SoCs support a broader range of multiprotocol, multiband use cases for home automation, connected lighting, wearables and industrial applications.
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Cypress Expands Wireless Connectivity with New 802.11ac Low Power Solutions
March 16, 2017 by audioXpress Staff

Cypress Expands Wireless Connectivity with New 802.11ac Low Power Solutions

Cypress Semiconductor announced two new wireless solutions that deliver advanced coexistence and robust connectivity combining 802.11ac high-performance Wi-Fi, Bluetooth and Bluetooth Low Energy (BLE). The 802.11ac solutions use high-speed transmissions to enable devices with faster downloads and better range, as well as lower power consumption by quickly exploiting deep sleep modes. The solutions are supported in Cypress' popular WICED Studio development platform.
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