Lattice Wants Manufacturers to Replace USB Connectors with its SiBEAM Snap 12 Gbps Wireless Technology

February 21 2018, 03:00
Lattice Semiconductor announced the expansion of its Lattice Snap wireless connector product family to support broader adoption of 60 GHz wireless technology in consumer and embedded applications. The solution allows direct replacing of physical interfaces such as USB and HDMI in consumer devices using short-range wireless technology, allowing waterproof, thinner products that are less prone to mechanical failures. 

Newly introduce Lattice Snap modules incorporate all the key benefits of SiBEAM Snap technology for a robust, environment-proof and connector-less link at 12 Gbps speeds, compliant with international regulation. The modules enable manufacturers to easily integrate the short-range wireless links into their products. To simplify the design process further, Lattice included the Snap modules into their Snap evaluation kit for fast prototyping and time-to-market.

“We were seeking a wireless solution that was robust, easy to integrate and wouldn’t require a lot of design support,” says Ehren Achee, CTO at SecuraShot. “Lattice’s Snap modules met all of our expectations, allowing us to develop a more rugged product that can seamlessly support the transfer of data wirelessly without delay.”

The Snap modules offer 12 Gbps full-duplex bandwidth at sub-frame latencies, making this technology ideal for the replacement of physical connectors, such as USB. By eliminating the connector, the industrial designs of new products can be optimized by making them thinner, lighter, and environment-proof, all while maintaining a robust and high-speed connection. To enable faster prototyping for both existing and new customers, Lattice created the Snap Evaluation Kit, which includes the modules, system design guidelines and improved de-bug tools.

“SiBEAM Snap wireless connector technology offers a unique advantage in data transfer for a variety of high volume mobile applications, such as smartphones, tablets and notebooks. The new Snap modules not only accelerate time to market, but will enable 60 GHz technology to be easily integrated into broader consumer and industrial products,” explains Abdullah Raouf, senior manager at Lattice.
SiBEAM Snap technology was already integrated in Fujitsu’s next-generation Tablet PC, model Q508, already available in Japan since January 2018.
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