All items tagged with wireless connectivity (87)

Synaptics Unveils First Veros Triple Combo Family with Wi-Fi 7, Bluetooth 6.0 and Matter Support

April 28, 2025 by Joao Martins

Synaptics Unveils First Veros Triple Combo Family with Wi-Fi 7, Bluetooth 6.0 and Matter Support

Synaptics extended its Veros wireless portfolio with its first family of Wi-Fi 7 system-on-chips (SoCs) tailored for a broad category of connected devices. Comprising the SYN4390 and SYN4384, the scalable offering supports bandwidths up to 320MHz to deliver 5.8Gbps peak speed and low latency. The triple-combo SoCs integrate Wi-Fi 7 with Bluetooth 6.0 and Zigbee/Thread, support Matter, and are designed to minimize system cost and power consumption.

SPARK Microsystems Launches New SR1120 UWB Transceiver Promising 40x the Wireless Data Throughput of Bluetooth

April 22, 2025 by Joao Martins

SPARK Microsystems Launches New SR1120 UWB Transceiver Promising 40x the Wireless Data Throughput of Bluetooth

Finally showing some progress in its development efforts, SPARK Microsystems has unveiled its new SR1120 ultra-wideband (UWB) wireless transceiver, which it says is able to deliver 40x the data throughput of Bluetooth, with 25x the power savings, and up to 60x lower latency. This doubles up the performance from its existing chips, while offering extended range and multi-antenna support.

Synaptics Launches Ultra-Low-Power Triple Combo Wireless SoC Family with Auracast

March 11, 2025 by Joao Martins

Synaptics Launches Ultra-Low-Power Triple Combo Wireless SoC Family with Auracast

Synaptics has extended its Veros Triple Combo connectivity portfolio with the launch of the latest SYN461x family of ultra-low-power Wi-Fi 2.4/5/6 GHz, Bluetooth 6.0, Bluetooth LE Audio with Auracast, and IEEE 802.15.4 (Zigbee/Thread) systems on chip (SoCs). Designed for embedded applications in Edge AI connected devices, the Veros SYN461x family is optimized for system integration, size, and rapid time to market.

STMicroelectronics Reveals New STM32 Ultra-Low Power MCUs and Wireless Microcontrollers

March 5, 2025 by Joao Martins

STMicroelectronics Reveals New STM32 Ultra-Low Power MCUs and Wireless Microcontrollers

STMicroelectronics has introduced new STM32U3 microcontrollers (MCUs) with power-saving innovations that ease deployment of smart connected devices, especially in remote locations. The company has also unveiled the next generation of its STM32 power-efficient short-range wireless microcontrollers that simplify connecting consumer and industrial devices. The two new MCUs leverage near-threshold chip design to set a record performance-per-watt efficiency benchmark.

Silicon Labs Introduces New Concurrent Multiprotocol SoCs for Matter

March 3, 2025 by Joao Martins

Silicon Labs Introduces New Concurrent Multiprotocol SoCs for Matter

Silicon Labs announced that its MG26 family of wireless SoCs is now generally available and ready to provide developers with the highest performance for smart home applications, while leveraging AI/ML processing capabilities. The company calls it the industry’s most advanced, high-performance Matter and concurrent multiprotocol SoCs to date, with double the Flash and RAM of other Silicon Labs multiprotocol devices and best-in-class security.

Ceva Unveils First Multi-Protocol Wireless Connectivity Platform IP Featuring Next Generation Bluetooth High Data Throughput

January 2, 2025 by Joao Martins

Ceva Unveils First Multi-Protocol Wireless Connectivity Platform IP Featuring Next Generation Bluetooth High Data Throughput

Ceva announced the first complete multi-protocol wireless connectivity platform that supports Bluetooth High Data Throughput (HDT). This next generation technology meets the pressing need for Bluetooth devices looking to support streaming of even larger media at higher data rates. The new Ceva-Waves Links200 IP platform is designed to dramatically enhance wireless audio capabilities and support advanced applications like 7.1 audio systems.

Synaptics Brings Astra AI-Native Platform to CES 2025

December 18, 2024 by Joao Martins

Synaptics Brings Astra AI-Native Platform to CES 2025

Following earlier demonstrations at trade shows all over the world, Synaptics will showcase its Astra AI-Native processing and Veros intelligent connectivity offerings at CES 2025. Synaptics Astra AI-native platform showcases the advantages of purpose-built hardware paired with an open-source development framework, and intelligent connectivity to enable rapid development of context-aware connected devices.

AONDevices Unveils Edge AI Sensor Module in Collaboration with P-Logic Consulting

December 16, 2024 by Joao Martins

AONDevices Unveils Edge AI Sensor Module in Collaboration with P-Logic Consulting

AONDevices announced the launch of its AONix Edge AI sensor module, a new platform that addresses key challenges for battery-operated connected devices running artificial intelligence on the edge. Developed in collaboration with P-Logic Consulting and featuring sensor integration from TDK InvenSense, this compact 32mm x 32mm module is an energy-efficient platform with the ability to deliver real-time AI performance in always-on applications, particularly for consumer electronics.

Synaptics Announces New Dual-Core Bluetooth 5.4 and Matter Veros SoC

December 16, 2024 by Joao Martins

Synaptics Announces New Dual-Core Bluetooth 5.4 and Matter Veros SoC

Synaptics expanded its Veros family of connectivity devices with the SYN20708 dual-core system on chip (SoC) for Bluetooth 5.4 and IEEE 802.15.4. The Matter-compliant SoC supports Bluetooth (BT) Classic, Bluetooth Low Energy (BLE), Zigbee, and Thread protocols concurrently on both cores, allowing simultaneous connections to multiple endpoints in heterogeneous network environments, with overall lower system cost.

STMicroelectronics Introduces First STM32 Wireless Module Leveraging Collaboration with Qualcomm

December 10, 2024 by Cristina Costa

STMicroelectronics Introduces First STM32 Wireless Module Leveraging Collaboration with Qualcomm

STMicroelectronics introduced the first result of its strategic collaboration with Qualcomm Technologies to simplify development of next-generation STM32-based wireless solutions. The new ST67W611M1 modules combine Wi-Fi6, Bluetooth 5.3 and Thread connectivity to accelerate development of advanced consumer wireless solutions. Applications in home audio and smart home, powered by edge AI are a natural use case.

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