All items tagged with wireless connectivity (77)

Nordic Semiconductor Launches Next-Generation nRF54L Series Wireless SoCs

November 12, 2024 by Joao Martins

Nordic Semiconductor Launches Next-Generation nRF54L Series Wireless SoCs

The nRF54L wireless SoCs are one of the biggest product launches of the electronica 2024 show in Munich, and they redefine once again Nordic Semiconductor’s lead in ultra-low power wireless for connected devices. The new nRF54L Series includes the previously announced nRF54L15, and the new nRF54L10 and nRF54L05 wireless SoCs. This advanced product series offers significantly enhanced efficiency, exceptional processing power, and versatile design options to meet a growing range of Bluetooth LE applications, including LE Audio and Auracast products.

STMicroelectronics and Qualcomm Enter Strategic Collaboration for Edge AI Wireless Connected Devices

October 1, 2024 by Cristina Costa

STMicroelectronics and Qualcomm Enter Strategic Collaboration for Edge AI Wireless Connected Devices

STMicroelectronics and Qualcomm Technologies International, announces a new strategic collaboration for the next generation of industrial and consumer connected solutions augmented by edge AI. The collaboration will pair STMicroelectronics' STM32 microcontroller ecosystem and Qualcomm's wireless connectivity solutions to allow simple, fast, and cost-effective designs of next-generation connected applications.

Ceva-Waves UWB Low Power Solution Wins Prestigious OFweek China Automotive Industry Award 2024

August 28, 2024 by Cristina Costa

Ceva-Waves UWB Low Power Solution Wins Prestigious OFweek China Automotive Industry Award 2024

Ceva announced that its Ceva-Waves UWB, a low-power ultra-wideband IP for mobile, automotive, consumer and connected devices applications, has been named a winner of the Cabin-Driving Integrated Technology Breakthrough Award at the prestigious OFweek China Automotive Industry Awards, promoted by the OFweek industry and technology network of websites in China.

Ceva Bluetooth LE and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor’s Balletto Family of MCUs

July 23, 2024 by audioXpress Staff

Ceva Bluetooth LE and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor’s Balletto Family of MCUs

Ceva announced that Alif Semiconductor has licensed and deployed the Ceva-Waves Bluetooth Low Energy and 802.15.4 IPs in its Balletto family of wireless microcontrollers. The Balletto family is a complete Edge AI/ML microcontroller solution for wireless audio and smart home connected products with integrated Bluetooth Low Energy 5.3 and 802.15.4 (Matter) wireless subsystem and a dedicated network co-processor, enabling connectivity and class leading machine learning performance in a single chip.

Teledyne LeCroy's Frontline X500e Wireless Sniffer Captures Wi-Fi 7, Bluetooth, and 802.15.4 Traffic Simultaneously

April 12, 2024 by Joao Martins

Teledyne LeCroy's Frontline X500e Wireless Sniffer Captures Wi-Fi 7, Bluetooth, and 802.15.4 Traffic Simultaneously

Teledyne LeCroy is enabling the development of the latest wireless devices and connected applications with the launch of the Frontline X500e wireless protocol analyzer with Wi-Fi 7. For any application involving Bluetooth, Wi-Fi, 802.15.4-based technologies (including Matter, Thread, and Zigbee), or wired interfaces such as HCI-UART, USB, SPI, and Audio I2S, the X500e delivers precise insights for network professionals.

Ceva Accelerates Enhanced Connectivity with Multiprotocol Wireless Platform IP Family

April 8, 2024 by audioXpress Staff

Ceva Accelerates Enhanced Connectivity with Multiprotocol Wireless Platform IP Family

Ceva announced Ceva-Waves Links, a new family of multiprotocol wireless platform IPs that delivers fully integrated connectivity solutions with Wi-Fi, Bluetooth, UWB, Thread, Zigbee, and Matter, simplifying development and accelerating time to market for next generation, connectivity-rich, MCUs and SoCs. Ceva-Waves Links100, a connectivity platform IP with RF implemented on TSMC 22nm is currently being deployed by a leading OEM in connected devices.

Qualcomm S7 Pro, Micro-Power Wi-Fi, and XPAN Technology

March 14, 2024 by Joao Martins

Qualcomm S7 Pro, Micro-Power Wi-Fi, and XPAN Technology

Qualcomm S7 Pro, Micro-Power Wi-Fi, and XPAN Technology. An interview with John Turner, Senior Director, Product Management Voice and Music at Qualcomm Technologies International about the new Qualcomm S7 Pro platform that brings micro-power Wi-Fi and Bluetooth LE Audio to TWS earbuds. The same battery life, much better quality, high-res lossless audio, longer range, same user experience as Bluetooth on TWS earbuds. How does it work?

March 12, 2024 by audioXpress Staff

Laird Connectivity Changes Name to Ezurio

Laird Connectivity, a recognized wireless technology supplier, announce it has rebranded as Ezurio. For decades, Laird Connectivity and Boundary Devices have provided industry-renowned expertise in wireless product design and embedded processor development. Now the company entered a new chapter building on that foundation as Ezurio, continuing forward with all current portfolios of products and services.

pureLiFi Unveils Next-Gen Connectivity That Breaks Through Barriers with LiFi at MWC 2024

February 28, 2024 by Joao Martins

pureLiFi Unveils Next-Gen Connectivity That Breaks Through Barriers with LiFi at MWC 2024

LiFi technology specialists pureLiFi introduced its latest innovations at Mobile World Congress (MWC) 2024. LiFi is ready to redefine connectivity using light and break through conventional wireless boundaries and the Barcelona was a strong show for pureLiFi. The company announced LINXC Bridge, a collaborative project with Solace Power, which addresses the challenge of providing robust connectivity indoors, particularly for 5G mmWave signals.

Frontier Unveils Partnership with Realtek for New AURIA Connected Audio Module

January 12, 2024 by audioXpress Staff

Frontier Unveils Partnership with Realtek for New AURIA Connected Audio Module

Frontier Smart Technologies unveiled a collaboration with Realtek for its AURIA Bluetooth LE Audio and Wi-Fi module, which features Auracast support. The audio module has been designed and engineered for simple integration into various audio products, and comes with a customizable SDK, rich I/O, comprehensive documentation and technical support. The latest Realtek Ameba chips ensure support for the latest technologies.

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