All items tagged with wireless connectivity (81)
Synaptics Brings Astra AI-Native Platform to CES 2025
December 18, 2024 by Joao Martins

Synaptics Brings Astra AI-Native Platform to CES 2025

Following earlier demonstrations at trade shows all over the world, Synaptics will showcase its Astra AI-Native processing and Veros intelligent connectivity offerings at CES 2025. Synaptics Astra AI-native platform showcases the advantages of purpose-built hardware paired with an open-source development framework, and intelligent connectivity to enable rapid development of context-aware connected devices.
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AONDevices Unveils Edge AI Sensor Module in Collaboration with P-Logic Consulting
December 16, 2024 by Joao Martins

AONDevices Unveils Edge AI Sensor Module in Collaboration with P-Logic Consulting

AONDevices announced the launch of its AONix Edge AI sensor module, a new platform that addresses key challenges for battery-operated connected devices running artificial intelligence on the edge. Developed in collaboration with P-Logic Consulting and featuring sensor integration from TDK InvenSense, this compact 32mm x 32mm module is an energy-efficient platform with the ability to deliver real-time AI performance in always-on applications, particularly for consumer electronics.
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Synaptics Announces New Dual-Core Bluetooth 5.4 and Matter Veros SoC
December 16, 2024 by Joao Martins

Synaptics Announces New Dual-Core Bluetooth 5.4 and Matter Veros SoC

Synaptics expanded its Veros family of connectivity devices with the SYN20708 dual-core system on chip (SoC) for Bluetooth 5.4 and IEEE 802.15.4. The Matter-compliant SoC supports Bluetooth (BT) Classic, Bluetooth Low Energy (BLE), Zigbee, and Thread protocols concurrently on both cores, allowing simultaneous connections to multiple endpoints in heterogeneous network environments, with overall lower system cost.
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STMicroelectronics Introduces First STM32 Wireless Module Leveraging Collaboration with Qualcomm
December 10, 2024 by Cristina Costa

STMicroelectronics Introduces First STM32 Wireless Module Leveraging Collaboration with Qualcomm

STMicroelectronics introduced the first result of its strategic collaboration with Qualcomm Technologies to simplify development of next-generation STM32-based wireless solutions. The new ST67W611M1 modules combine Wi-Fi6, Bluetooth 5.3 and Thread connectivity to accelerate development of advanced consumer wireless solutions. Applications in home audio and smart home, powered by edge AI are a natural use case.
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Nordic Semiconductor Launches Next-Generation nRF54L Series Wireless SoCs
November 12, 2024 by Joao Martins

Nordic Semiconductor Launches Next-Generation nRF54L Series Wireless SoCs

The nRF54L wireless SoCs are one of the biggest product launches of the electronica 2024 show in Munich, and they redefine once again Nordic Semiconductor’s lead in ultra-low power wireless for connected devices. The new nRF54L Series includes the previously announced nRF54L15, and the new nRF54L10 and nRF54L05 wireless SoCs. This advanced product series offers significantly enhanced efficiency, exceptional processing power, and versatile design options to meet a growing range of Bluetooth LE applications, including LE Audio and Auracast products.
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STMicroelectronics and Qualcomm Enter Strategic Collaboration for Edge AI Wireless Connected Devices
October 1, 2024 by Cristina Costa

STMicroelectronics and Qualcomm Enter Strategic Collaboration for Edge AI Wireless Connected Devices

STMicroelectronics and Qualcomm Technologies International, announces a new strategic collaboration for the next generation of industrial and consumer connected solutions augmented by edge AI. The collaboration will pair STMicroelectronics' STM32 microcontroller ecosystem and Qualcomm's wireless connectivity solutions to allow simple, fast, and cost-effective designs of next-generation connected applications.
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Ceva-Waves UWB Low Power Solution Wins Prestigious OFweek China Automotive Industry Award 2024
August 28, 2024 by Cristina Costa

Ceva-Waves UWB Low Power Solution Wins Prestigious OFweek China Automotive Industry Award 2024

Ceva announced that its Ceva-Waves UWB, a low-power ultra-wideband IP for mobile, automotive, consumer and connected devices applications, has been named a winner of the Cabin-Driving Integrated Technology Breakthrough Award at the prestigious OFweek China Automotive Industry Awards, promoted by the OFweek industry and technology network of websites in China.
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Ceva Bluetooth LE and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor’s Balletto Family of MCUs
July 23, 2024 by audioXpress Staff

Ceva Bluetooth LE and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor’s Balletto Family of MCUs

Ceva announced that Alif Semiconductor has licensed and deployed the Ceva-Waves Bluetooth Low Energy and 802.15.4 IPs in its Balletto family of wireless microcontrollers. The Balletto family is a complete Edge AI/ML microcontroller solution for wireless audio and smart home connected products with integrated Bluetooth Low Energy 5.3 and 802.15.4 (Matter) wireless subsystem and a dedicated network co-processor, enabling connectivity and class leading machine learning performance in a single chip.
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Teledyne LeCroy's Frontline X500e Wireless Sniffer Captures Wi-Fi 7, Bluetooth, and 802.15.4 Traffic Simultaneously
April 12, 2024 by Joao Martins

Teledyne LeCroy's Frontline X500e Wireless Sniffer Captures Wi-Fi 7, Bluetooth, and 802.15.4 Traffic Simultaneously

Teledyne LeCroy is enabling the development of the latest wireless devices and connected applications with the launch of the Frontline X500e wireless protocol analyzer with Wi-Fi 7. For any application involving Bluetooth, Wi-Fi, 802.15.4-based technologies (including Matter, Thread, and Zigbee), or wired interfaces such as HCI-UART, USB, SPI, and Audio I2S, the X500e delivers precise insights for network professionals.
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Ceva Accelerates Enhanced Connectivity with Multiprotocol Wireless Platform IP Family
April 8, 2024 by audioXpress Staff

Ceva Accelerates Enhanced Connectivity with Multiprotocol Wireless Platform IP Family

Ceva announced Ceva-Waves Links, a new family of multiprotocol wireless platform IPs that delivers fully integrated connectivity solutions with Wi-Fi, Bluetooth, UWB, Thread, Zigbee, and Matter, simplifying development and accelerating time to market for next generation, connectivity-rich, MCUs and SoCs. Ceva-Waves Links100, a connectivity platform IP with RF implemented on TSMC 22nm is currently being deployed by a leading OEM in connected devices.
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