All items tagged with wireless connectivity (73)

More Than 5.5 Billion Smart Home Matter-Compliant Devices Forecasted to Ship Between 2022 and 2030

February 9, 2022 by audioXpress Staff

More Than 5.5 Billion Smart Home Matter-Compliant Devices Forecasted to Ship Between 2022 and 2030

Still months from its completion, the Matter smart home specification is already driving new products and strategies across the smart home and consumer electronics market. With a host of major players, technology suppliers, and partners already pledged to delivering Matter compliant offerings, the specification is expected to dominate the smart home landscape within five years, according to a new report from market intelligence firm ABI Research.

Telit Launches WE310G4 Dual-Band Wi-Fi Module with BLE 5.0

January 28, 2022 by audioXpress Staff

Telit Launches WE310G4 Dual-Band Wi-Fi Module with BLE 5.0

Wireless connectivity specialists Telit announced the launch of their new WE310G4 module, which enables manufacturers to add dual-band Wi-Fi and Bluetooth Low Energy (BLE) 5.0 connectivity quickly and cost-effectively to their products. Based on Realtek's Ameba system on chip (SoC), the WE310G4 is ideal for a wide variety of embedded designs, including smart home devices and appliances, wearables, fitness trackers, smart city sensors, aftermarket telematics and industrial automation sensors.

NXP Advances Matter Smart Home Connectivity with Industry’s First Secure Tri-Radio Device

January 13, 2022 by Joao Martins

NXP Advances Matter Smart Home Connectivity with Industry’s First Secure Tri-Radio Device

NXP Semiconductors announced the IW612, the industry’s first secure tri-radio device to support the Wi-Fi 6, Bluetooth 5.2 and 802.15.4 (Zigbee, Thread, Z-Wave, Matter) protocols. Part of NXP’s new family of tri-radio products, the new device enables seamless, secure connectivity for smart home, automotive and industrial use cases. The single SoC enables simultaneous transmit and receive for higher performance in smart solutions, and supports Matter, the new interoperable, secure connectivity standard for the smart home.

MediaTek Announces New Filogic 830 and Filogic 630 Wi-Fi 6/6E Chips

October 1, 2021 by audioXpress Staff

MediaTek Announces New Filogic 830 and Filogic 630 Wi-Fi 6/6E Chips

MediaTek unveiled its new Filogic connectivity family with the introduction of the Filogic 830 Wi-Fi 6/6E system-on-chip (SoC) and Filogic 630 Wi-Fi 6E network interface card (NIC) solutions. The highly integrated chipsets offer fast, reliable connectivity with enhanced performance for broadband routers, mesh systems, enterprise access points and retail routers. Two high-performance, power-efficient Wi-Fi 6/6E chipsets with high computation capabilities and a rich set of features.

Former HDMI Executive Team Joins WiSA Standard Promotion Effort

September 15, 2021 by audioXpress Staff

Former HDMI Executive Team Joins WiSA Standard Promotion Effort

Summit Wireless Technologies, a leading provider of immersive, wireless sound technology for intelligent devices and next-generation home entertainment systems, hired three industry veterans to increase the proliferation of the WiSA standard. The team, comprised of Eric Almgren, Steve Venuti, and Roger Isaac, will focus on strategies to expand the market applications and to increase the global use of WiSA's high-definition wireless audio technology and promote wireless audio interoperability.

Laird Connectivity Launches BL5340 Bluetooth 5.2 Modules for High Performance LE Audio Applications

September 6, 2021 by audioXpress Staff

Laird Connectivity Launches BL5340 Bluetooth 5.2 Modules for High Performance LE Audio Applications

The new BL5340 Series of Bluetooth 5.2 and 802.15.4 modules from Laird Connectivity are now available. Based on Nordic Semiconductor’s nRF5340 system-on-chip (SoC), the BL5340 Series delivers a secure, high-performance dual-core MCU wireless solution with a choice of modules - BL5340 with nRF5340, or a power amplified variant (BL5340PA with nRF5340 + nRF21540), with integrated pre-certified PCB or Trace pad antenna options, and multiple tools for advanced Bluetooth LE product development.

Synaptics to Acquire DSP Group to Strengthen Leadership in Low Power AI Technology and Wireless Connectivity

August 30, 2021 by audioXpress Staff

Synaptics to Acquire DSP Group to Strengthen Leadership in Low Power AI Technology and Wireless Connectivity

Synaptics and DSP Group, both Nasdaq listed, announced the signing of a definitive agreement, unanimously approved by the boards of directors of both companies, whereby Synaptics acquires DSP Group at $22.00 per share in an all-cash transaction. Synaptics is the company from San Jose, CA, that in 2017 acquired Conexant, one of the industry's leading audio and voice technology specialists, and more recently acquired DisplayLink and the wireless connectivity business of Broadcom.

Skyworks Solutions Acquires the Infrastructure and Automotive Business of Silicon Labs

April 23, 2021 by audioXpress Staff

Skyworks Solutions Acquires the Infrastructure and Automotive Business of Silicon Labs

Silicon Labs announced that it has entered into a definitive asset purchase agreement to sell its Infrastructure & Automotive (I&A) business to Skyworks Solutions, in order to focus on the wireless connectivity market. The $2.75 billion transaction includes Silicon Labs’ power/isolation, timing and broadcast products, intellectual property and associated employees. Silicon Labs also announced Matt Johnson has been appointed President. Tyson Tuttle will continue as CEO.

Infineon Introduces New AIROC Wi-Fi 6/6E and Bluetooth 5.2 Combo Devices for High-Quality Video and Audio Streaming

April 9, 2021 by Cristina Costa

Infineon Introduces New AIROC Wi-Fi 6/6E and Bluetooth 5.2 Combo Devices for High-Quality Video and Audio Streaming

Infineon Technologies expanded its wireless portfolio with new high-performance, reliable and secure devices. The newly developed AIROC brand now includes the industry’s first 1x1 Wi-Fi 6/6E and Bluetooth 5.2 combo SoC for enterprise and industrial applications, and its first 2x2 Wi-Fi 6/6E and Bluetooth 5.2 combo SoC for multimedia, consumer and automotive applications. The new wireless connectivity combo devices deliver robust performance and minimal latency, making them ideal for high-quality video and audio streaming applications.

CEVA Establishes Partnership with DARPA for Technology Innovation

January 5, 2021 by audioXpress Staff

CEVA Establishes Partnership with DARPA for Technology Innovation

CEVA announced an open licensing agreement with the U.S. Defense Advanced Research Projects Agency (DARPA) to accelerate technology innovation for DARPA programs. The commercial partnership, as part of the DARPA Toolbox initiative, establishes an access framework under which DARPA organizations can access all of CEVA’s commercially available IPs, tools and support to expedite their programs. This provides DARPA researchers with access to CEVA’s portfolio of wireless connectivity and smart sensing IPs.

«
1
2
3
4
5
6
7
8
»