All items tagged with wireless connectivity (74)

Ceva Bluetooth LE and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor’s Balletto Family of MCUs

July 23, 2024 by audioXpress Staff

Ceva Bluetooth LE and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor’s Balletto Family of MCUs

Ceva announced that Alif Semiconductor has licensed and deployed the Ceva-Waves Bluetooth Low Energy and 802.15.4 IPs in its Balletto family of wireless microcontrollers. The Balletto family is a complete Edge AI/ML microcontroller solution for wireless audio and smart home connected products with integrated Bluetooth Low Energy 5.3 and 802.15.4 (Matter) wireless subsystem and a dedicated network co-processor, enabling connectivity and class leading machine learning performance in a single chip.

Teledyne LeCroy's Frontline X500e Wireless Sniffer Captures Wi-Fi 7, Bluetooth, and 802.15.4 Traffic Simultaneously

April 12, 2024 by Joao Martins

Teledyne LeCroy's Frontline X500e Wireless Sniffer Captures Wi-Fi 7, Bluetooth, and 802.15.4 Traffic Simultaneously

Teledyne LeCroy is enabling the development of the latest wireless devices and connected applications with the launch of the Frontline X500e wireless protocol analyzer with Wi-Fi 7. For any application involving Bluetooth, Wi-Fi, 802.15.4-based technologies (including Matter, Thread, and Zigbee), or wired interfaces such as HCI-UART, USB, SPI, and Audio I2S, the X500e delivers precise insights for network professionals.

Ceva Accelerates Enhanced Connectivity with Multiprotocol Wireless Platform IP Family

April 8, 2024 by audioXpress Staff

Ceva Accelerates Enhanced Connectivity with Multiprotocol Wireless Platform IP Family

Ceva announced Ceva-Waves Links, a new family of multiprotocol wireless platform IPs that delivers fully integrated connectivity solutions with Wi-Fi, Bluetooth, UWB, Thread, Zigbee, and Matter, simplifying development and accelerating time to market for next generation, connectivity-rich, MCUs and SoCs. Ceva-Waves Links100, a connectivity platform IP with RF implemented on TSMC 22nm is currently being deployed by a leading OEM in connected devices.

Qualcomm S7 Pro, Micro-Power Wi-Fi, and XPAN Technology

March 14, 2024 by Joao Martins

Qualcomm S7 Pro, Micro-Power Wi-Fi, and XPAN Technology

Qualcomm S7 Pro, Micro-Power Wi-Fi, and XPAN Technology. An interview with John Turner, Senior Director, Product Management Voice and Music at Qualcomm Technologies International about the new Qualcomm S7 Pro platform that brings micro-power Wi-Fi and Bluetooth LE Audio to TWS earbuds. The same battery life, much better quality, high-res lossless audio, longer range, same user experience as Bluetooth on TWS earbuds. How does it work?

March 12, 2024 by audioXpress Staff

Laird Connectivity Changes Name to Ezurio

Laird Connectivity, a recognized wireless technology supplier, announce it has rebranded as Ezurio. For decades, Laird Connectivity and Boundary Devices have provided industry-renowned expertise in wireless product design and embedded processor development. Now the company entered a new chapter building on that foundation as Ezurio, continuing forward with all current portfolios of products and services.

pureLiFi Unveils Next-Gen Connectivity That Breaks Through Barriers with LiFi at MWC 2024

February 28, 2024 by Joao Martins

pureLiFi Unveils Next-Gen Connectivity That Breaks Through Barriers with LiFi at MWC 2024

LiFi technology specialists pureLiFi introduced its latest innovations at Mobile World Congress (MWC) 2024. LiFi is ready to redefine connectivity using light and break through conventional wireless boundaries and the Barcelona was a strong show for pureLiFi. The company announced LINXC Bridge, a collaborative project with Solace Power, which addresses the challenge of providing robust connectivity indoors, particularly for 5G mmWave signals.

Frontier Unveils Partnership with Realtek for New AURIA Connected Audio Module

January 12, 2024 by audioXpress Staff

Frontier Unveils Partnership with Realtek for New AURIA Connected Audio Module

Frontier Smart Technologies unveiled a collaboration with Realtek for its AURIA Bluetooth LE Audio and Wi-Fi module, which features Auracast support. The audio module has been designed and engineered for simple integration into various audio products, and comes with a customizable SDK, rich I/O, comprehensive documentation and technical support. The latest Realtek Ameba chips ensure support for the latest technologies.

Logitech G Launches New Flagship Console Wireless Gaming Headset With Pure Graphene Drivers

December 8, 2023 by Joao Martins

Logitech G Launches New Flagship Console Wireless Gaming Headset With Pure Graphene Drivers

The new Logitech G ASTRO A50 X Lightspeed Wireless Gaming Headset and Base Station is the fifth generation of the acclaimed ASTRO A50 Series console gaming headset from the brand. Following previous models using graphene, the new flagship gaming headset uses a pure graphene 40mm driver that makes it the ultimate model with the technology from Canadian pioneer Ora Graphene. It also combines a range of cutting-edge, industry-first design features and technologies.

December 6, 2023 by audioXpress Staff

Ceva Launches New Brand Identity Reflecting its Focus on Smart Edge IP Innovation

Ceva, Inc., introduced a fresh new brand visual identity, logo design and web domain ”ceva-ip.com,” reflecting the company’s commitment to "being the partner of choice for transformative IP solutions that power the smart edge." Ceva is a leading provider of silicon and software IP that makes it possible for low power Edge AI devices to connect, sense and infer data, reliably and efficiently, across multiple high-growth end markets.

MediaTek Expands Wi-Fi and Bluetooth 5.4 Portfolio with New Chipsets for Mainstream Devices

November 21, 2023 by audioXpress Staff

MediaTek Expands Wi-Fi and Bluetooth 5.4 Portfolio with New Chipsets for Mainstream Devices

MediaTek, one of the first adopters of the upcoming Wi-Fi 7 technology, now has the industry's most comprehensive Wi-Fi 7 portfolio with the introduction of the latest Filogic 860 and Filogic 360 solutions. Together, these second-generation additions aim to further expand MediaTek's platform of cutting-edge products that utilize the latest technology advancements in connectivity while achieving peak performance and always-on reliability.

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