All items tagged with wireless connectivity (77)

Synaptics Launches Triple Combo 16nm Ultra-Low-Power SoC to Drive New Automotive and Multimedia Use Cases

March 24, 2023 by Joao Martins

Synaptics Launches Triple Combo 16nm Ultra-Low-Power SoC to Drive New Automotive and Multimedia Use Cases

Offering enhanced connectivity and streaming features, Synaptics latest SYN4382 Triple Combo offers Matter-compliant Wi-Fi 2.4/5/6/6E, Bluetooth 5.3, and IEEE 802.15.4 wireless, with the ability for simultaneous operation of two radios and multiple Bluetooth channels to stream multimedia content. This state-of-the-art system-on-chip enables new exciting audio and video experiences, while lowering power consumption, cost, and system complexity.

SPARK Microsystems Receives CDN $48 Million Investment To Drive UWB Wireless Development

March 13, 2023 by Joao Martins

SPARK Microsystems Receives CDN $48 Million Investment To Drive UWB Wireless Development

SPARK Microsystems announced the closing of CDN $34 million Series B financing, with an additional CDN $14 million available subject to meeting operational milestones. Led by Idealist Capital, a prominent investment firm focused on the energy transition and decarbonization, the round includes existing investors Cycle Capital, Economic Development Canada (EDC), Real Ventures, and ND Capital. The new funding will drive mass market commercialization for ultra-energy efficient, UWB-based wireless electronic devices and sensors.

Texas Instruments Unifies Smart Home Connected Ecosystems with Matter-Enabled SimpleLink Wireless MCUs

November 22, 2022 by Cristina Costa

Texas Instruments Unifies Smart Home Connected Ecosystems with Matter-Enabled SimpleLink Wireless MCUs

Enabling smarter connections to the world around us, Texas Instruments (TI) introduced new Matter-enabled software development kits for Wi-Fi and Thread SimpleLink wireless microcontrollers (MCUs) that will streamline adoption of the Matter protocol in connected applications (also named sometimes as Internet of Things or IoT). The software builds on TI’s close involvement with the Connectivity Standards Alliance and innovation in the 2.4-GHz connectivity space.

CEVA Appoints Technology Industry Veteran Amir Panush as CEO Effective January 2023

November 9, 2022 by audioXpress Staff

CEVA Appoints Technology Industry Veteran Amir Panush as CEO Effective January 2023

After 17 years as CEO of CEVA and more than 32 years with the company, Gideon Wertheizer is set to retire at the end of the year. The CEVA board of directors has unanimously appointed Amir Panush as CEO effective January 1st, 2023. Wertheizer will continue to serve as an active member of CEVA’s board of directors and will be employed in an advisory role in the near term to ensure a smooth leadership transition.

WiSA Technologies Announces Program to License its Wireless Multichannel Audio Technology

October 26, 2022 by Joao Martins

WiSA Technologies Announces Program to License its Wireless Multichannel Audio Technology

WiSA Technologies announced a licensing program for its high-quality, multichannel wireless WiSA E software. Expanding from its original, hardware-based module approach, the new software licensing program is targeted towards HDTV platforms and speaker manufacturers. WiSA E is an interoperable audio software/IP solution designed for wireless sound technology on TV and Wi-Fi SoC platforms, enabling built-in transmission capabilities of high-quality multichannel audio streams.

Microchip Announces New Arm-Based PIC with Built-in Bluetooth Low Energy Connectivity

October 19, 2022 by Cristina Costa

Microchip Announces New Arm-Based PIC with Built-in Bluetooth Low Energy Connectivity

Microchip Technology introduced its first Arm Cortex-M4F-based PIC microcontroller (MCU) family that solves basic wireless connectivity design challenges by integrating Bluetooth Low Energy functionality directly into one of a system’s most basic components, supported by one of the industry’s most comprehensive developer ecosystems. Microchip's new PIC32CX-BZ2 MCU family is available in SoCs QFN packages and complete PCB modules and antenna.

Nordic Semiconductor Announces Its First Wi-Fi Chip

August 19, 2022 by Cristina Costa

Nordic Semiconductor Announces Its First Wi-Fi Chip

Following the acquisition of the Wi-Fi development team, core Wi-Fi expertise, and Wi-Fi IP tech assets of Imagination Technologies Group in 2020, Nordic Semiconductor announced its entry into the Wi-Fi wireless market with the introduction of the nRF7002, an ultra-low power, dual-band Wi-Fi 6 companion IC. The launch enables Nordic Semiconductor to offer all three of the world’s most popular wireless connectivity technologies: Bluetooth, Wi-Fi, and cellular, paving the way for new market opportunities.

Worldwide Wearable Shipments Will Reach 344 Million by the End of 2022

August 12, 2022 by audioXpress Staff

Worldwide Wearable Shipments Will Reach 344 Million by the End of 2022

Demand for wearables and accessories slowed during 2021 due to economic and geopolitical factors impacting consumer's priorities. Despite this decline, global technology intelligence firm ABI Research expects continuous growth until 2027. More than 300 million wearables devices were shipped by the end of 2021 and will reach around 344 million by the end of this year. Additionally, more than 650 million of these devices are expected to be shipped worldwide by 2027, a CAGR of 13.2% between 2022 and 2027.

CEVA Celebrates 15 Billionth CEVA-powered Chip Shipped

August 9, 2022 by audioXpress Staff

CEVA Celebrates 15 Billionth CEVA-powered Chip Shipped

CEVA, Inc., the wireless connectivity and smart sensing technologies licensing company, announced that cumulative royalty-bearing chip shipments that include CEVA IP surpassed 15 billion units during the second quarter of 2022. This significant milestone has been achieved as CEVA approaches it’s 20-year anniversary of being a public company. While the first 10 billion CEVA-powered shipments spanned more than 15 years, the next 5 billion shipments took less than three and a half years.

Laird Connectivity Launches New SOM that Delivers Powerful NXP Edge Processing with Wi-Fi and Bluetooth

July 7, 2022 by audioXpress Staff

Laird Connectivity Launches New SOM that Delivers Powerful NXP Edge Processing with Wi-Fi and Bluetooth

Laird Connectivity announced the new Summit SOM 8M Plus, a highly-integrated and comprehensive hardware and software solution that combines NXP multi-core applications processing with dual-band 2x2 Wi-Fi 5 and Bluetooth 5.3 connectivity. The new system-on-module (SOM) is Laird's most versatile, feature-rich, and secure wireless solution to date, truly perfect for serving as the core platform for advanced connected applications and audio/voice systems.

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