Virscient Collaborates With Infineon to Accelerate AIROC-based Wireless Design Development

August 3 2023, 00:30
Story update. Virscient, announced a new strategic collaboration with Infineon to support customers' design-in of Infineon’s connectivity products. Under this agreement, Virscient will provide expert design and engineering services, and licensable software solutions to help innovative OEMs and platform vendors rapidly deliver products integrating Infineon's AIROC Wi-Fi + Bluetooth combo ICs – whether chip-down, or in modular form.

The wireless connectivity integration specialists from New Zealand will offer their Ubiquios embedded connectivity platform, which enables use of AIROC transceivers with small microcontrollers based on ultra-low-power Arm Cortex M cores such as Infineon’s PSoC 6 family. Possible applications with Infineon connectivity and MCU solutions include anything from indoor environment monitoring to wireless remote-control electric skateboards and professional, active noise cancelling microphones.

Virscient's software enables AIROC-based Wi-Fi and Bluetooth solutions to be implemented in less than 128 kilobytes of flash and 32 kilobytes of RAM on the host, enabling full-stack applications supporting dual-imaged over-the-air update on tiny platforms such as Infineon’s PSoC 61 programmable line. Ubiquios further enables secure connected applications using Infineon's OPTIGA embedded security solutions, integrated directly with the network stack.

Virscient also has particular expertise in supporting integration of chip-down Wi-Fi solutions for volume manufacture, including design, implementation, and optimization of custom RF front-end circuitry, antenna systems, and radio coexistence technologies.
 

"This collaboration helps customers accelerate their development of highly-integrated products by applying Virscient expertise in advanced hardware design and software optimization to Infineon's AIROC wireless portfolio. We look forward to future collaboration with Virscient on innovative solutions," says Sivaram Trikutam, VP of Wi-Fi Product Line at Infineon.

This new collaboration with Infineon further acknowledges Virscient's recognition as a technology consulting company helping developers and manufacturers get to market faster with quality wireless connectivity solutions for automotive, audio, IoT, and industrial markets. With expertise in embedded stack development, chip-on-board and combo Wi-Fi and Bluetooth, Virscient provides engineering services and intellectual property spanning a wide range of technologies such as Wi-Fi, Bluetooth, 5G, GNSS, LoRa, IEEE 802.15.4, and more. 

"With over 24 years of success across markets such as consumer, industrial and automotive, Infineon is a clear semiconductor leader in meeting customers' unique needs and solving their pain points. We look forward to growing our collaboration across our new and existing customers, while delivering next-generations solutions that meet companies' needs today and tomorrow," adds Dr. Dean Armstrong, CTO of Virscient.
 
"This strategic collaboration aims to support our customers in seamlessly integrating Infineon's state-of-the-art connectivity products into their designs. By leveraging Virscient's expertise in design and engineering services, as well as our licensable software solutions, innovative OEMs and platform vendors can rapidly deliver products that integrate Infineon's industry-leading AIROC Wi-Fi + Bluetooth combo ICs.

"At Virscient, we have a wealth of experience in supporting the integration of chip-down Wi-Fi solutions for volume manufacture. Our expertise encompasses the design, implementation, and optimization of custom RF front-end circuitry, antenna systems, and radio coexistence technologies," Armstrong adds.
www.virscient.com
 


 
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