All items tagged with embedded systems (30)

Microchip Technology Launches RISC-V Multi-Core 64-Bit Microprocessors

July 10, 2024 by Cristina Costa

Microchip Technology Launches RISC-V Multi-Core 64-Bit Microprocessors

Real-time, compute intensive applications such as fully adaptive noise cancellation, voice separation and Machine Learning (ML) are pushing the boundaries of embedded processing requirements, demanding more power-efficiency, hardware-level security and high reliability at the edge. With the launch of its PIC64 portfolio, Microchip Technology expanded its computing range to meet this rising demands.

Cloud2GND Bumblebee Bluetooth LE Audio Demonstration Board

February 21, 2024 by Joao Martins

Cloud2GND Bumblebee Bluetooth LE Audio Demonstration Board

Cloud2GND, an engineering house specializing in electronic circuit design, embedded systems, protocols, and connected devices developed the Bumblebee LE Audio Demonstrator, the first chipmaker-independent platform for product developers to test and evaluate Bluetooth LE Audio and Auracast applications. Featuring the Panasonic PAN1783 Bluetooth Low Energy 5.3 module, the board is a ready-to-use platform with a class-D amplifier, AKM stereo ADC/DAC, MEMS microphone, NFC and is powered over USB or external power supply.

AudioSourceRE Sets New Standard for Real-Time, AI-Powered Audio Separation

December 5, 2023 by Joao Martins

AudioSourceRE Sets New Standard for Real-Time, AI-Powered Audio Separation

Originally presented at the Audio Engineering Society (AES) New York convention in 2018, the release of the DeMIX Pro software established a strong new contender in the field of audio separation. Meanwhile, AudioSourceRE has used machine learning to take the concept further, while the latest version 5 of DeMIX Pro and DeMIX Essentials has set a new standard for AI-powered audio separation, making the unimaginable totally possible. Now, AudioSourceRE is working to offer the same technology, running in real-time embedded systems!

November 2, 2023 by audioXpress Staff

ADC23 - Audio Developers Conference Returns November 13-15, 2023

ADC23 - Audio Developers Conference returns in 2023 with a limited in-person event in London, but attendees from around the world can network and connect with audio developer experts through the unique ADC23 virtual venue online experience. Online tickets remain accessible and contribute to the support of ADC as a not-for-profit organization. "It's fun and tickets are available now!", says chair of ADC Bobby Lombard.

WiSA Technologies Announces 3-Channel Output Support for its WiSA E Receiver Module

September 22, 2023 by Joao Martins

WiSA Technologies Announces 3-Channel Output Support for its WiSA E Receiver Module

WiSA Technologies has added 3-channel output capabilities to its WiSA E receiver module. This capacity lowers the cost of Atmos-based soundbars and minimizes the number of speakers required for true immersive audio. Three separate wireless audio channels can now be combined into a single speaker enclosure significantly reducing system cost while maintaining a convincing immersive Atmos soundfield.

Sensory TrulyHandsfree 7.0 Improves Voice Recognition Accuracy

September 18, 2023 by audioXpress Staff

Sensory TrulyHandsfree 7.0 Improves Voice Recognition Accuracy

Sensory announced the launch of TrulyHandsfree 7.0, the latest iteration of its groundbreaking voice recognition software for low-power wake words and small command sets. As pioneers in wake word and custom voice assistants, now focusing their efforts in embedded voice and biometric AI technology, Sensory's latest version of TrulyHandsfree improves accuracy, size, and power consumption, all key metrics for the advancement of voice recognition applications.

Virscient Collaborates With Infineon to Accelerate AIROC-based Wireless Design Development

August 3, 2023 by audioXpress Staff

Virscient Collaborates With Infineon to Accelerate AIROC-based Wireless Design Development

Virscient, announced a new strategic collaboration with Infineon to support customers' design-in of Infineon’s connectivity products. Under this agreement, Virscient will provide expert design and engineering services, and licensable software solutions to help innovative OEMs and platform vendors rapidly deliver products integrating Infineon's AIROC Wi-Fi + Bluetooth combo ICs – whether chip-down, or in modular form.

July 25, 2023 by Joao Martins

WiSA Launches New Tools for Implementing, Managing and Testing WiSA-Enabled Products

WiSA Technologies announced two new tools designed to streamline the development and manufacturing of WiSA E (Embedded) and WiSA DS (Discrete System) implementations. The new WiSA Server, in combination with the new Product Support Engineering Tool (PEST), enable faster time-to-market as well as comprehensive management of testing and other aspects of the manufacturing process.

Sunplus and WiSA Technologies Partner to Enable Cost-Effective Atmos Soundbar Applications up to 7.1.4 Configurations

June 16, 2023 by Joao Martins

Sunplus and WiSA Technologies Partner to Enable Cost-Effective Atmos Soundbar Applications up to 7.1.4 Configurations

WiSA Technologies and Sunplus Technology a leading chip provider for multimedia and automotive applications from Taiwan, have partnered to bring to market a multichannel immersive audio System-on-a-Chip (SoC) targeting the Atmos soundbar market. The collaboration sees WiSA licensing and porting its embeddable multichannel audio software technology for high-quality wireless audio on the Sunplus SPA300 audio processor and multi-core DSP.

Nanusens Announces That It Can Now Create ASICs With Embedded Sensors

May 26, 2023 by audioXpress Staff

Nanusens Announces That It Can Now Create ASICs With Embedded Sensors

Nanusens has announced that it has successfully created a fully digital circuit design to measure the capacitance of its nanosensors. This means that both the sensor structure and its detection circuitry can be made at the same time within a chip using standard CMOS processes on whatever process node is required. As a result, ASICs can now be made with several different sensors embedded within them, helping to expand MEMS applications in hearables.

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