All items tagged with wireless connectivity (80)

MediaTek Announces New Filogic 830 and Filogic 630 Wi-Fi 6/6E Chips

October 1, 2021 by audioXpress Staff

MediaTek Announces New Filogic 830 and Filogic 630 Wi-Fi 6/6E Chips

MediaTek unveiled its new Filogic connectivity family with the introduction of the Filogic 830 Wi-Fi 6/6E system-on-chip (SoC) and Filogic 630 Wi-Fi 6E network interface card (NIC) solutions. The highly integrated chipsets offer fast, reliable connectivity with enhanced performance for broadband routers, mesh systems, enterprise access points and retail routers. Two high-performance, power-efficient Wi-Fi 6/6E chipsets with high computation capabilities and a rich set of features.

Former HDMI Executive Team Joins WiSA Standard Promotion Effort

September 15, 2021 by audioXpress Staff

Former HDMI Executive Team Joins WiSA Standard Promotion Effort

Summit Wireless Technologies, a leading provider of immersive, wireless sound technology for intelligent devices and next-generation home entertainment systems, hired three industry veterans to increase the proliferation of the WiSA standard. The team, comprised of Eric Almgren, Steve Venuti, and Roger Isaac, will focus on strategies to expand the market applications and to increase the global use of WiSA's high-definition wireless audio technology and promote wireless audio interoperability.

Laird Connectivity Launches BL5340 Bluetooth 5.2 Modules for High Performance LE Audio Applications

September 6, 2021 by audioXpress Staff

Laird Connectivity Launches BL5340 Bluetooth 5.2 Modules for High Performance LE Audio Applications

The new BL5340 Series of Bluetooth 5.2 and 802.15.4 modules from Laird Connectivity are now available. Based on Nordic Semiconductor’s nRF5340 system-on-chip (SoC), the BL5340 Series delivers a secure, high-performance dual-core MCU wireless solution with a choice of modules - BL5340 with nRF5340, or a power amplified variant (BL5340PA with nRF5340 + nRF21540), with integrated pre-certified PCB or Trace pad antenna options, and multiple tools for advanced Bluetooth LE product development.

Synaptics to Acquire DSP Group to Strengthen Leadership in Low Power AI Technology and Wireless Connectivity

August 30, 2021 by audioXpress Staff

Synaptics to Acquire DSP Group to Strengthen Leadership in Low Power AI Technology and Wireless Connectivity

Synaptics and DSP Group, both Nasdaq listed, announced the signing of a definitive agreement, unanimously approved by the boards of directors of both companies, whereby Synaptics acquires DSP Group at $22.00 per share in an all-cash transaction. Synaptics is the company from San Jose, CA, that in 2017 acquired Conexant, one of the industry's leading audio and voice technology specialists, and more recently acquired DisplayLink and the wireless connectivity business of Broadcom.

Skyworks Solutions Acquires the Infrastructure and Automotive Business of Silicon Labs

April 23, 2021 by audioXpress Staff

Skyworks Solutions Acquires the Infrastructure and Automotive Business of Silicon Labs

Silicon Labs announced that it has entered into a definitive asset purchase agreement to sell its Infrastructure & Automotive (I&A) business to Skyworks Solutions, in order to focus on the wireless connectivity market. The $2.75 billion transaction includes Silicon Labs’ power/isolation, timing and broadcast products, intellectual property and associated employees. Silicon Labs also announced Matt Johnson has been appointed President. Tyson Tuttle will continue as CEO.

Infineon Introduces New AIROC Wi-Fi 6/6E and Bluetooth 5.2 Combo Devices for High-Quality Video and Audio Streaming

April 9, 2021 by Cristina Costa

Infineon Introduces New AIROC Wi-Fi 6/6E and Bluetooth 5.2 Combo Devices for High-Quality Video and Audio Streaming

Infineon Technologies expanded its wireless portfolio with new high-performance, reliable and secure devices. The newly developed AIROC brand now includes the industry’s first 1x1 Wi-Fi 6/6E and Bluetooth 5.2 combo SoC for enterprise and industrial applications, and its first 2x2 Wi-Fi 6/6E and Bluetooth 5.2 combo SoC for multimedia, consumer and automotive applications. The new wireless connectivity combo devices deliver robust performance and minimal latency, making them ideal for high-quality video and audio streaming applications.

CEVA Establishes Partnership with DARPA for Technology Innovation

January 5, 2021 by audioXpress Staff

CEVA Establishes Partnership with DARPA for Technology Innovation

CEVA announced an open licensing agreement with the U.S. Defense Advanced Research Projects Agency (DARPA) to accelerate technology innovation for DARPA programs. The commercial partnership, as part of the DARPA Toolbox initiative, establishes an access framework under which DARPA organizations can access all of CEVA’s commercially available IPs, tools and support to expedite their programs. This provides DARPA researchers with access to CEVA’s portfolio of wireless connectivity and smart sensing IPs.

Growth and Opportunities in Audio Delivery to Connected Vehicles

October 26, 2020 by audioXpress Staff

Growth and Opportunities in Audio Delivery to Connected Vehicles

The significant growth of connected vehicles and Internet accessibility supported by network expansion is transforming the in-car dashboards of vehicles today and in the future. The automotive market has become increasingly connected, servicing an increased base of audio system solutions. The integration of advanced technologies within the automotive audio space is shaping the in-vehicle radio experience, according to SAR Insight & Consulting.

NXP Unveils New IW62X Family of 2x2 Wi-Fi 6 + Bluetooth Devices for Advanced Audio Applications and Connected Designs

October 9, 2020 by audioXpress Staff

NXP Unveils New IW62X Family of 2x2 Wi-Fi 6 + Bluetooth Devices for Advanced Audio Applications and Connected Designs

NXP Semiconductors announced its latest family of 2x2 Wi-Fi 6 (802.11ax) Dual Band + Bluetooth/BLE-Audio devices, designed to drive a new phase of connectivity innovation for all sorts of advanced audio, gaming and connected devices. Enabling the world’s first Wi-Fi 6 enabled gaming console (the new PlayStation 5), NXP’s optimized IW62X family of products will provide increased capacity, efficiency and performance for next-generation connectivity solutions including wireless speakers and all sorts of smart devices.

CEVA RivieraWaves Wi-Fi 6 Solution Achieves Wi-Fi Certified 6 Status from the Wi-Fi Alliance

August 20, 2020 by audioXpress Staff

CEVA RivieraWaves Wi-Fi 6 Solution Achieves Wi-Fi Certified 6 Status from the Wi-Fi Alliance

CEVA announced that its RivieraWaves Wi-Fi 6 IP platform has become the world’s first Wi-Fi IP to achieve Wi-Fi Certified 6 Status from the Wi-Fi Alliance. CEVA offers a complete suite of Wi-Fi 6 IPs, spanning 1x1 20 MHz for low power connected devices through to MIMO 80/160MHz Wi-Fi 6 and 6E for higher end products including smartphones, smart TVs, access points and wireless infrastructure. CEVA’s RivieraWaves 802.11ax MAC & modem IP have already been licensed to multiple semiconductor companies and OEMs for upcoming Wi-Fi 6 products.

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