The incredible rapid adoption rate of CEVA’s IP in the connected era is a testament to the company’s role in the democratization of wireless connectivity, through the broad licensing of its 5G, cellular IoT, Bluetooth, Wi-Fi and UWB platform IP to hundreds of semiconductors and OEMs. This effectively lowered the entry barriers for embedding wireless connectivity in SoCs, enabling companies to design more cost-effective and power-efficient chips that led to the proliferation of wirelessly-connected devices that we take for granted today. These devices include smartphones, wearables, hearables, wireless speakers, smart home appliances, white goods, plugs, lights and many more.
"Surpassing the 15 billion CEVA-powered chip shipment milestone is a very noteworthy accomplishment for CEVA and its customers. The steep shipment ramp we have experienced over the past 3 years directly coincides with the explosion of IoT devices, where almost every electronic device that ships today is connected. We have been developing and investing in wireless technologies for two decades, and today CEVA is proud to be at the forefront of wireless connectivity in the IoT era. Going forward, as devices become increasingly smarter, integrating more sensors and intelligence, our sensing technologies and edge AI platforms are primed to build on our wireless success. We are excited and invigorated by what’s next for CEVA as the adoption of our technologies continues to grow and we reach new heights," states Gideon Wertheizer, CEO of CEVA.
The milestone underscores CEVA’s central role in enabling wireless connectivity and intelligence in billions of smartphones, consumer electronics, wearables, IoT endpoints and edge AI devices. Today, more than 50 CEVA-powered devices are sold every second around the world.
CEVA provides Digital Signal Processors, AI engines, wireless platforms, cryptography cores and complementary software for sensor fusion, image enhancement, computer vision, voice input and artificial intelligence. These technologies are offered in combination with the company's Intrinsix IP integration services, helping manufacturers and developers address their most complex and time-critical integrated circuit design projects. Leveraging CEVA's technologies and chip design skills, many of the world’s leading semiconductors, system companies and OEMs create power-efficient, intelligent, secure and connected devices for a range of end markets, including mobile, consumer, automotive, robotics, industrial, aerospace and defense.
CEVA's DSP-based solutions include platforms for audio/voice/speech and ultra-low-power always-on/sensing applications for multiple markets. For sensor fusion, the company's Hillcrest Labs sensor processing technologies provide a broad range of sensor fusion software and inertial measurement unit (“IMU”) solutions for markets including hearables and wearables. For wireless connected devices, CEVA's platforms for Bluetooth (low energy and dual mode), Wi-Fi 4/5/6 (802.11n/ac/ax), Ultra-wideband (UWB), NB-IoT and GNSS are the most broadly licensed connectivity platforms in the industry.
www.ceva-dsp.com
