Even though Wi-Fi 7 is still at draft stage and a standard doesn't yet exist - and while manufacturers are now consistently promoting Wi-Fi 6E to consumers - multiple semiconductor companies are committing to pushing Wi-Fi 7 in advance. Mediatek's second-generation Filogic chipsets deliver Wi-Fi 7 speeds (Gbps), peak performance, and always-on reliability.
The new Filogic 860 SoC combines a Wi-Fi 7 dual-band access point with a new advanced network processor solution and is ideal for enterprise access points, service provider Ethernet gateways and mesh nodes, as well as retail and IoT router applications. Filogic 360 is a stand-alone client solution that integrates Wi-Fi 7 2x2 and dual Bluetooth 5.4 radios in a single chip, and is designed to deliver next-generation Wi-Fi 7 connectivity to edge devices, streaming devices and a vast array of other consumer electronics.
"MediaTek stands out with the most comprehensive connectivity portfolio on the market, and we're continuing this legacy with our two new advanced Wi-Fi 7 solutions designed for mainstream applications," says Alan Hsu, corporate vice president and general manager of the Intelligent Connectivity Business at MediaTek. "Filogic 860 and Filogic 360 offers the same technology as our premium solutions with exceptional reliability in busy network environments, ultra-fast speeds with reduced latency and enhanced range."
For the enterprise and retail markets, Filogic 860 provides a complete platform for a dual-band Wi-Fi 7 access point, router and mesh node solution. Building upon the success of its first-generation design, Filogic 860 is equipped with a triple-core Arm Cortex-A73 CPU that supports powerful hardware acceleration for advanced tunneling and security features to meet enterprise, service provider requirements.
The Filogic 860 platform is an industry leading 6nm low power Wi-Fi design with single-MAC MLO, 4096-QAM, and MRU support, dual-band Wi-Fi 7 with industry-highest dual-band MLO speed of 7.2Gbps, and dual-band, dual concurrent capabilities with 4T4R for 2.4GHz up to BW40 and 5T5R 4SS for 5GHz up to BW160. The platform also adds support for an additional receive antenna for zero-wait DFS, and Filogic Xtra range support, boosting receiving distance using an extra antenna.
The Filogic 360 is a stand-alone, single chip Wi-Fi 7 2x2 and dual Bluetooth 5.4 solution designed to deliver best-in-class connectivity for high-performance clients such as smartphones, PCs, laptops, set-top boxes, OTT streaming, and many other devices. Key features of the Filogic 360 include triple-band selectable Wi-Fi 7 2x2 with up to 2.9Gbps speed, 4096-QAM and MRU support, 160MHz channel bandwidth support and Filogic Xtra range support, boosting communication distance by using a unique Hybrid MLO solution.
The Filogic 360 platform also supports dual Bluetooth 5.4 cores for gaming and other applications, and already supports Bluetooth LE audio with integrated DSP for LC3 codec support. MediaTek advanced Wi-Fi and Bluetooth coexistence technology ensures both technologies can operate on the 2.4 GHz band seamlessly, without interference.
The MediaTek Filogic 860 and Filogic 360 solutions have begun sampling to customers and mass production is anticipated for mid-2024.
www.mediatek.com
