All items tagged with product development (919)

Lattice Wants Manufacturers to Replace USB Connectors with its SiBEAM Snap 12 Gbps Wireless Technology

February 21, 2018 by Joao Martins

Lattice Wants Manufacturers to Replace USB Connectors with its SiBEAM Snap 12 Gbps Wireless Technology

Lattice Semiconductor announced the expansion of its Lattice Snap wireless connector product family to support broader adoption of 60 GHz wireless technology in consumer and embedded applications. The solution allows direct replacing of physical interfaces such as USB and HDMI in consumer devices using short-range wireless technology, allowing waterproof, thinner products that are less prone to mechanical failures.

Efficient Linux Designs with Microchip Microprocessor-Based System on Module (SOM) featuring SAMA5D2 MPU

February 21, 2018 by audioXpress Staff

Efficient Linux Designs with Microchip Microprocessor-Based System on Module (SOM) featuring SAMA5D2 MPU

Microchip Technology has unveiled a new System on Module (SOM) featuring the SAMA5D2 MPU. The ATSAMA5D27-SOM1 contains the recently released ATSAMA5D27C-D1G-CU System in Package (SiP). The SOM simplifies IoT design by integrating the power management, non-volatile boot memory, Ethernet PHY and high-speed DDR2 memory onto a small, single-sided Printed Circuit Board (PCB).

OCA Alliance Demonstrates Expanding AES70 Interoperability at ISE 2018

February 8, 2018 by Joao Martins

OCA Alliance Demonstrates Expanding AES70 Interoperability at ISE 2018

The OCA Alliance is demonstrating the very latest developments in the AES70 standard and the technologies supporting it, at ISE 2018. Alliance member companies Archwave, Bosch, d&b audiotechnik GmbH, DeusO, Focusrite, Suzhou Fitcan Technology and Your Audio Systems GmbH are exhibiting numerous products and development tools to demonstrate the multiple facets of AES70 in a hands-on environment.

XMOS Showcases Advanced True Stereo Voice Interface Solutions

February 1, 2018 by Joao Martins

XMOS Showcases Advanced True Stereo Voice Interface Solutions

XMOS will be showcasing their portfolio of far-field voice capture solutions for voice-enabled stereo smart TVs, soundbars, set-top boxes, and digital media adapter markets at GSMA Mobile World Congress 2018, Barcelona, 26th February to 1st March. XMOS will be demonstrating commercial solutions in development, and proof of concepts that capture voice commands accurately from across the room even when the audio appliances are playing content at high volume in complex noisy acoustic environments.

Valens Adds New HDBaseT Chipsets to the Colligo Family for Plug-and-Play Product Design

February 1, 2018 by audioXpress Staff

Valens Adds New HDBaseT Chipsets to the Colligo Family for Plug-and-Play Product Design

Valens, the developer of HDBaseT and founder of the HDBaseT Alliance, announced the availability of the VS200 and VS210 chipsets, for simpler HDBaseT installations where not all 5Play features are necessary. The addition of the VS200 and VS210 to the Valens Colligo family allows HDBaseT equipment vendors to design and manufacture a range of products, from high-end to low-end, using a common hardware platform.

Your Audio Systems Launches Software Development Solution for AES67 and AES70 Embedded Devices at ISE 2018

January 31, 2018 by audioXpress Staff

Your Audio Systems Launches Software Development Solution for AES67 and AES70 Embedded Devices at ISE 2018

In preparation for its Integrated Systems Europe debut, Swiss-based Your Audio Systems announces the first major demonstration of Orchestra, an embedded Linux software solution for AES67/AES70 professional embedded devices, now available for OEM implementations. The company will exhibit Orchestra in the OCA Alliance stand (7-R240) in the Amsterdam RAI, Amsterdam, from February 6-9.

Cypress Delivers Industry’s First Certified Bluetooth Mesh Wireless MCU and Combo Solutions

January 31, 2018 by audioXpress Staff

Cypress Delivers Industry’s First Certified Bluetooth Mesh Wireless MCU and Combo Solutions

Cypress Semiconductor announced its single-chip solutions for the IoT applications are the world’s first to deliver Bluetooth mesh connectivity certified by the Bluetooth Special Interest Group (SIG) to a consumer product. Three Cypress wireless combo chips and the latest version of its Wireless Internet Connectivity for Embedded Devices (WICED) software development kit (SDK) support state-of-the-art Bluetooth connectivity with mesh networking capability.

CEVA and Silentium Deliver Active Noise Cancellation Solution for the CEVA-TeakLite DSP Family

January 23, 2018 by Joao Martins

CEVA and Silentium Deliver Active Noise Cancellation Solution for the CEVA-TeakLite DSP Family

CEVA and Silentium Ltd., a leading provider of Active Noise Cancellation (ANC) technology and adaptive sound management solutions, announced a partnership to deliver a low power active noise cancellation solution for headsets and hearables. Silentium’s Broadband P2P ANC technology is now available for CEVA’s lowest power audio/voice DSP family.

THAT Introduces 2-Channel Programmable Preamplifier with ADC Driver

January 19, 2018 by audioXpress Staff

THAT Introduces 2-Channel Programmable Preamplifier with ADC Driver

THAT Corporation announced three new programmable preamplifiers with integrated ADC drivers. The family includes three products with different gain-step sizes: the 6261, 6263, and 6266 at 1dB, 3dB, and 6dB per step, respectively. The new THAT626x family increases integration and lowers power for low-noise digitally controlled microphone preamplifiers.

SoundChip Introduces Waypoints - a Platform for Scaling the Delivery of Class-Leading Noise Cancelling Into Smart Headsets

January 18, 2018 by Joao Martins

SoundChip Introduces Waypoints - a Platform for Scaling the Delivery of Class-Leading Noise Cancelling Into Smart Headsets

SoundChip SA, a Swiss-based global leader in hearable sound technology, announced the introduction of its Waypoints platform, which combines proven methods, tools and expertise to help manufacturers scale the delivery of effective noise cancelling into more products within their headset portfolio than ever before. The new platform supports third-party NC chips in addition to SoundChip's own HD-PA devices.

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