All items tagged with product development (919)
Maxim's Low-Power Microcontrollers Extend Battery Life for Wearables and Other Compact Devices
April 5, 2018 by Cristina Costa

Maxim's Low-Power Microcontrollers Extend Battery Life for Wearables and Other Compact Devices

Designers of IoT sensors, smartwatches, all types of wearables, and other size-constrained devices can now increase battery life and functionality using the ultra-low power MAX32660 and MAX32652 microcontrollers from Maxim Integrated Products. These microcontrollers (MCUs) are based on the Arm Cortex-M4 with FPU processor and provide designers the means to develop advanced applications under restrictive power constraints.
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The Linux Foundation Adopts Sound Open Firmware Project Enabling Developers to Adapt Operating Systems for Audio Devices
March 15, 2018 by audioXpress Staff

The Linux Foundation Adopts Sound Open Firmware Project Enabling Developers to Adapt Operating Systems for Audio Devices

During the Embedded Linux Conference in Portland, OR, The Linux Foundation announced that Sound Open Firmware (SOF) has become a Linux Foundation project. With significant engineering and code contributions from Intel Corporation, SOF includes a digital signal processing (DSP) firmware and an SDK that together provide infrastructure and development tools for developers working on audio or signal processing. Intel and Google support SOF and invite others to join them in advancing the project.
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CEVA Delivers Bluetooth 5 Dual Mode IP to ASR Micro
March 8, 2018 by audioXpress Staff

CEVA Delivers Bluetooth 5 Dual Mode IP to ASR Micro

CEVA, a licensor of signal processing platforms and artificial intelligence processors for connected devices, reinforced its leadership in the Bluetooth IP market with delivery of its RivieraWaves Bluetooth 5 dual mode IP to multiple licensees, including ASR Microelectronics, a fabless semiconductor company. ASR Micro adopted RivieraWaves Bluetooth 5 Dual Mode IP for smartphones, smart speakers, headsets and IoT Devices.
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Embedded World 2018 Confirms Record Attendance and Exhibitors Growth
March 2, 2018 by audioXpress Staff

Embedded World 2018 Confirms Record Attendance and Exhibitors Growth

In its closing report, NürnbergMesse confirmed that the 2018 edition of Embedded World - 26 - 28 February 2019, Nuremberg, Germany, has established a new record for the trade-show. Confirming more trade visitors, exhibitors and space, as well as a record 2.000 participants and speakers attending the annual conference sessions, Embedded World 2018 provided a clear sign of a positive momentum in all market segments for embedded electronics applications, with particular emphasis on IoT, industrial connected solutions and automotive.
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Qualcomm Introduces Smart Audio Platform and Speaker Development Kits for Multiple Voice Ecosystems
March 1, 2018 by Joao Martins

Qualcomm Introduces Smart Audio Platform and Speaker Development Kits for Multiple Voice Ecosystems

Following earlier demonstrations at CES 2018, Qualcomm introduced a series of new platforms, SoC and development kits targeting new advanced audio applications and smart speakers, including the support of key wireless technologies, voice and cloud ecosystems. Solutions include its Smart Audio Platform optimized for smart speakers, a 6-microphone far field voice platform qualified for Amazon AVS, Dolby Audio implementations for wireless speakers and much more.
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Texas Instruments Announces New Low-Power Multi-Standard Multi-Band SimpleLink MCU Platform
February 28, 2018 by Cristina Costa

Texas Instruments Announces New Low-Power Multi-Standard Multi-Band SimpleLink MCU Platform

To meet growing connectivity needs, Texas Instruments (TI) introduced its newest SimpleLink wireless and wired microcontrollers (MCUs). These new devices offer industry-leading low power consumption and concurrent multi-standard and multi-band connectivity for Thread, Zigbee, Bluetooth 5 and Sub-1 GHz. With more memory and unlimited connectivity options, the expanded SimpleLink MCU platform offers 100 percent code reuse across TI’s Arm Cortex-M4-based MCUs to enhance and connect sensor networks to the cloud.
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CEVA Extends its IP Platforms for Bluetooth 5 and Wi-Fi Applications with RISC-V
February 27, 2018 by Joao Martins

CEVA Extends its IP Platforms for Bluetooth 5 and Wi-Fi Applications with RISC-V

Audio and voice signal processing specialists CEVA announced that the complete RivieraWaves suite of Bluetooth 5 (low energy and dual mode) and Wi-Fi 802.11a/b/g/n/ac/ax intellectual property (IP) platforms are now offered with an optional integrated open-source RISC-V MCU. These integration-ready system solutions are ideal for those manufacturers seeking freedom from standard 3rd party processor architectures.
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STMicroelectronics Introduces Next-Generation Wireless Platform for Higher-Performing Bluetooth Devices
February 23, 2018 by Joao Martins

STMicroelectronics Introduces Next-Generation Wireless Platform for Higher-Performing Bluetooth Devices

Powering the next generation of smart connected objects like digital-home products and wearable electronics, STMicroelectronics has revealed an advanced dual-processor wireless chip that supports new features and enhanced performance with extended battery life. The fusion of 32-bit ultra-low-power microcontroller and highly integrated Bluetooth 5 (BLE) and IEEE 802.15.4 radio creates a high-performing wireless platform for feature-rich smart connected objects.
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Speakers and Voice Development - A Conversation with NXP
February 22, 2018 by Joao Martins

Speakers and Voice Development - A Conversation with NXP

After reviewing my notes from CES 2018 and the announcements from NXP, I decided it was fitting to share some parts of my interview with Martyn Humphries, vice president and general manager Media IoT and i.MX Applications Processors at NXP (and former Freescale executive). Basically, we discussed the environment that lead NXP to create its i.MX 8M single-chip media application processors, currently the most advanced integrated platform available for audio manufacturers.
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Qualcomm Enhances Performance of Truly Wireless Earbuds and Hearables with its Next Generation Qualcomm TrueWireless Stereo Technology
February 21, 2018 by audioXpress Staff

Qualcomm Enhances Performance of Truly Wireless Earbuds and Hearables with its Next Generation Qualcomm TrueWireless Stereo Technology

Qualcomm was an early pioneer in the concept of true wireless stereo a technology that is designed to completely eliminate the need for wires, not only between the media source and the headphones, but also between the left and right earbuds, offering users a wire-free stereo audio experience and supporting new use cases like hearables. Now Qualcomm announced enhancements to its Qualcomm TrueWireless Stereo technology.
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