All items tagged with product development (919)
NXP Expands Media Capabilities Available on a Single Chip with i.MX 8M Application Processors
January 17, 2018 by Joao Martins

NXP Expands Media Capabilities Available on a Single Chip with i.MX 8M Application Processors

During CES 2018, NXP Semiconductors had the most impressive presence among semiconductor manufacturers. To address the convergence of immersive sensory experiences fueled by voice, video and audio demands, NXP has launched the i.MX 8M family of applications processors, combining robust media capabilities on one single chip. Arkamys and MSC Technologies, already announced support for the new 64-bit processor family.
Read more...
AAC Technologies and Dirac Research to Explore the ‘Future of Sound’ Across All Consumer Technology Categories at CES 2018
January 4, 2018 by audioXpress Staff

AAC Technologies and Dirac Research to Explore the ‘Future of Sound’ Across All Consumer Technology Categories at CES 2018

After two years of collaboration, the two companies are set to unveil a series of breakthrough product prototypes that demonstrate the now-possible audio experience available across all consumer technology product categories. The AAC-Dirac product prototypes available for demo at CES 2018 include a smart speaker, smartphones, an augmented reality headset, and an ultra-thin automotive speaker – all of which are custom-configured with sophisticated AAC-Dirac audio subsystems.
Read more...
CEVA's Bluetooth 5 Low Energy IP certified with Ellisys Bluetooth Compliance Tester
January 4, 2018 by audioXpress Staff

CEVA's Bluetooth 5 Low Energy IP certified with Ellisys Bluetooth Compliance Tester

CEVA, a leading licensor of signal processing solutions for connected devices, announced that it has completed qualification testing of its Bluetooth 5 Low Energy (LE) IP, including all the new optional Bluetooth 5 features using the recognized Ellisys Bluetooth Qualifier (EBQ) Compliance Tester, that ensures industry-standard compatibility and interoperability for Bluetooth certified products.
Read more...
Unified Computer Intelligence Corporation Launches Alexa and Google Assistant for Ubi Kit Development Platform
January 2, 2018 by audioXpress Staff

Unified Computer Intelligence Corporation Launches Alexa and Google Assistant for Ubi Kit Development Platform

Unified Computer Intelligence Corporation (UCIC) announced the support of Google Assistant on its developer and hardware AI platform, Ubi Kit. The Ubi Kit already supports Amazon’s Alexa Voice Service, and with this new implementation developers can now add Google Assistant to their hardware projects with unprecedented simplicity and ease, using any compatible far field solution, and supporting wake word engines from Sensory, Kitt.AI, Cognitech, and others.
Read more...
Qorvo and HUMAX Provide Complete Zigbee-based Smart Home Voice Assistant System
December 29, 2017 by audioXpress Staff

Qorvo and HUMAX Provide Complete Zigbee-based Smart Home Voice Assistant System

RF solutions specialist Qorvo announced that its multi-stack, multi-protocol GP712 System-on-Chip was implemented in the new Zigbee-based HUMAX Chorus Voice Assistant. The pairing allows creating a turnkey ultra-compatible smart home system for IoT operators that integrates gateways, sensor devices, cloud platforms and mobile applications. The new Qorvo/HUMAX voice solution will be showcased during CES 2018, in Las Vegas, Nevada.
Read more...
Corigine Unveils First Certified SuperSpeed+ USB 3.1 Gen 2 IP with M31 28nm PHY
December 28, 2017 by Cristina Costa

Corigine Unveils First Certified SuperSpeed+ USB 3.1 Gen 2 IP with M31 28nm PHY

Corigine and M31 Technology Corporation announced that the 28nm PHY from M31, with Corigine's USB 3.1 Gen 2 PC host and device controller intellectual property (IP) is certified by the USB Implementers Forum (USB-IF) and compliant with USB SuperSpeed+, the fastest USB speed standard. With this USB-IF certification, Corigine's IP will enable deployment of millions of devices that need the fastest USB speed.
Read more...
Intel Unveils Industry’s First FPGA Integrated with High Bandwidth Memory Built for Acceleration
December 20, 2017 by audioXpress Staff

Intel Unveils Industry’s First FPGA Integrated with High Bandwidth Memory Built for Acceleration

Intel today announced the availability of the Intel Stratix 10 MX FPGA, the industry’s first field programmable gate array (FPGA) with integrated High Bandwidth Memory DRAM (HBM2). By integrating the FPGA and the HBM2, Intel Stratix 10 MX FPGAs offer up to 10 times the memory bandwidth when compared with standalone standard DDR 2400 DIMM memory solutions.
Read more...
COMSOL Releases Multiphysics 5.3a with Expanded Range of Innovative Acoustics Modeling Tools
December 18, 2017 by audioXpress Staff

COMSOL Releases Multiphysics 5.3a with Expanded Range of Innovative Acoustics Modeling Tools

As previewed back in October 2017, COMSOL now made available the latest release of its COMSOL Multiphysics and COMSOL Server software products. Version 5.3a provides simulation specialists with cutting-edge modeling tools and increased solver performance. Featuring new methods, material models and simulations, the new software includes a hybrid boundary element-finite element (BEM-FEM) method for acoustics and acoustic-structure interaction, among many valuable new tools.
Read more...
Pulse Electronics Releases New Nanocrystalline Common Mode Choke Series
December 14, 2017 by Cristina Costa

Pulse Electronics Releases New Nanocrystalline Common Mode Choke Series

Pulse Electronics Power BU, a leading provider of electronic components, announced the release of its new PH9455 series, the amorphous metal common mode choke. Expanding on the existing Pulse family of common mode chokes, the PH9455 series provide higher impedance per unit volume when compared to ferrite core solutions, and filters out common mode EMI noise while reducing size.
Read more...
MIPI Alliance Opens Access to MIPI I3C Sensor Interface Specification
December 13, 2017 by audioXpress Staff

MIPI Alliance Opens Access to MIPI I3C Sensor Interface Specification

The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, announced it is opening access to its sensor interface specification, MIPI I3C. All companies, including those not currently members of MIPI Alliance, may access the MIPI I3C v1.0 specification so they may evaluate the incorporation of the specification into their design applications.
Read more...